EEWORLDEEWORLDEEWORLD

Part Number

Search

3SMBJ5954B-TP-HF

Description
Zener Diode,
CategoryDiscrete semiconductor    diode   
File Size280KB,4 Pages
ManufacturerMicro Commercial Components (MCC)
Environmental Compliance
Download Datasheet Parametric View All

3SMBJ5954B-TP-HF Overview

Zener Diode,

3SMBJ5954B-TP-HF Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerMicro Commercial Components (MCC)
Reach Compliance Codenot_compliant
ECCN codeEAR99
Diode typeZENER DIODE
JESD-609 codee3
Humidity sensitivity level1
Peak Reflow Temperature (Celsius)260
Terminal surfaceTin (Sn)
Maximum time at peak reflow temperature10
MCC
TM
Micro Commercial Components
  omponents
20736 Marilla Street Chatsworth

  !"#
$ %    !"#
3SMBJ5913B
THRU
3SMBJ5956B
3.0 Watt
Surface Mount
Silicon
Zener Diodes
DO-214AA
(SMB) (LEAD FRAME)
Features
Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates
Compliant. See ordering information)
3.3thru 200 Volt Voltage Range
Low Inductance, Low Profile Mounting
Glasss Passivated Junction
Available On Tape and Reel
Halogen
free available upon request by adding suffix "-HF"
Epoxy meets UL 94 V-0 flammability rating
Moisture Sensitivity Level 1
Mechanical Data
Terminals solderable per MIL-STD-750, Method 2026
Polarity is indicated by cathode band.
Packaging: Standard 12mm Tape (see EIA 481)
A
Maximum temperature for soldering: 260
0
C for 10 seconds.
Maximum Ratings @ 25
o
C Unless Otherwise Specified
C
B
Maximum
Forward
Voltage
Steady State
Power
Dissipation
Operation and
Storage
Temperature
V
F
P
d
T
J
, T
STG
1.5V
3.0W
-55
o
C to
+150
o
C
(Note:
2)
(Note:
3)
E
D
F
H
G
DIMENSIONS
INCHES
MIN
.160
.130
.006
.030
.200
.079
.075
.002
MM
MIN
4.06
3.30
0.15
0.76
5.08
2.00
1.91
0.05
DIM
A
B
C
D
E
F
G
H
MAX
.185
.155
.012
.060
.220
.096
.087
.008
MAX
4.70
3.94
0.31
1
..52
5.59
2.44
2.21
0.203
NOTE
Note:
1.
High Temperature Solder Exemptions Applied, see EU Directive Annex 7.
2.
3.
Forward Current @ 200mA.
Mounted on 5.0mm (1oz thick) Iand areas.
Lead temperature at T
L
=75 C
o
2
SUGGESTED SOLDER
PAD LAYOUT
0.106"
0.083”
0.050”
Revision:
B
www.mccsemi.com
1 of 4
2013/01/01
Differences between CPU and CLA in C28x+FPU architecture and error handling techniques
[i=s]This post was last edited by Aguilera on 2019-12-10 21:44[/i]The C2000 microprocessor with C28x+FPU architecture adds some registers and instructions to the original C28x fixed-point CPU to suppo...
Aguilera Microcontroller MCU
Help: Cross-compiling EXPAT and LIBXML2 cannot be successful. Can anyone help me?
I use ARM-ELF-GCC to cross-compile EXPAT and LIBXML2, and I encounter the same problem: ./configure --host=arm-elf --prefix=/home/expat prompts checking for C compiler default output file name... conf...
tosstaryt Embedded System
About AD conversion clock measurement
I have a question for everyone. When using the AD conversion clock to achieve accurate measurement, we should delay and wait for the conversion to complete. But how do we calculate the delay time accu...
企鹅 Test/Measurement
WinCE Forum
I just got started with WinCE and encountered many problems. I didn't know how to solve them. I accidentally found a forum with many good articles. I understood a lot. Now I tell everyone about this f...
ngy922 Embedded System
An STM32 serial port receiving problem
Receive in query mode, the receiving function is as follows:uint8_t DebugReadByte(void){while(USART_GetFlagStatus(USART1, USART_FLAG_RXNE) == RESET);return USART_ReceiveData(USART1);}In the program, I...
ppm009 stm32/stm8
Small signal amplification circuit design
Not bad....
yq_place Analog electronics

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 919  996  2522  384  1058  19  21  51  8  22 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号