Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IPD60R600P6
MA001356272
PG-TO252-3-313
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
inorganic material
non noble metal
noble metal
non noble metal
non noble metal
non noble metal
inorganic material
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
phosphorus
nickel
silver
tin
lead
iron
phosphorus
copper
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7723-14-0
7440-02-0
7440-22-4
7440-31-5
7439-92-1
7439-89-6
7723-14-0
7440-50-8
Issued
Weight*
Weight
[mg]
3.063
0.147
0.044
147.096
0.513
1.407
24.616
114.639
3.787
0.003
1.421
0.071
0.057
2.702
0.019
0.006
19.177
Average
Mass
[%]
0.96
0.05
0.01
46.14
0.16
0.44
7.72
35.96
1.19
0.00
0.45
0.02
0.02
0.85
0.01
0.00
6.02
17. April 2015
318.77 mg
Sum
[%]
0.96
Average
Mass
[ppm]
9608
462
139
46.20
0.16
461451
1611
4413
77222
44.12
1.19
359632
11879
11
0.45
4456
222
178
0.89
8477
60
18
6.03
60161
60239
1000000
8877
4467
441267
11879
462052
1611
Sum
[ppm]
9608
wire
encapsulation
leadfinish
plating
solder
heatspreader
*deviation
Sum in total: 100.00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption
7a, Lead in high melting temperature type solders.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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