Low Voltage RailClamp
®
4-Line ESD Protection
PROTECTION PRODUCTS - RailClamp
®
Description
The RClamp
®
3324T provides ESD protection for
USB3.0, HDMI1.3/1.4, and other high-speed ports. It
features a high maximum ESD withstand voltage of
±25kV contact and ±30kV air discharge per IEC
61000-4-2. RClamp3324T is designed to minimize
both the ESD peak clamping and the TLP clamping.
Peak ESD clamping voltage is extremely low and
approximately the same at each pin. The dynamic
resistance is among the industry’s lowest at 0.35
Ohms (typical). Typical capacitance on each line to
ground is approximately 0.40pF. This allows the
RClamp3324T to be used in applications operating in
excess of 5GHz without signal attenuation. These
devices are manufactured using Semtech’s proprietary
low voltage EPD technology for superior characteritics
at operating voltages up to 3.3 volts. Each device will
protect up to four lines (two high-speed pairs).
The RClamp3324T is in a 6-pin SLP1710P4T package. It
measures 1.7 x 1.0mm with a nominal height of 0.40mm.
The leads have a nominal pin-to-pin pitch of 0.40mm.
The flow- through package design simplifies PCB layout
and maintains signal integrity on high-speed lines.
The combination of low peak ESD clamping, low dynamic
resistance, and innovative package design enables this
device provides the highest level of ESD protection for
applications such as USB 3.0, HDMI and V-By-One inter-
faces.
RClamp3324T
PRELIMINARY
Features
ESD protection for high-speed data lines to
IEC 61000-4-2 (ESD) ±30kV (air), ±25kV (contact)
IEC 61000-4-5 (Lightning) 5A (8/20μs)
IEC 61000-4-4 (EFT) 40A (5/50ns)
Flow-Through design
Protects four high-speed lines
Low capacitance:
0.40pF
typical (I/O to ground)
Low ESD clamping voltage
Extremely low dynamic resistance: 0.35 Ohms (Typ)
Solid-state silicon-avalanche technology
SLP1710P4T 6L package
Pb-Free, Halogen Free, RoHS/WEEE Compliant
Nominal Dimensions: 1.7 x 1.0 x 0.40 mm
Lead Finish: NiPdAu
Molding compound flammability rating: UL 94V-0
Marking : Marking code + date code
Packaging : Tape and Reel
USB 3.0
HDMI 1.3/1.4
10GBase-T Ethernet
V-By-One
Display Port
MHL
LVDS Interfaces
eSATA Interfaces
Mechanical Characteristics
Applications
Circuit Diagram
Pin Configuration (Top View)
I/O 1
I/O 2
Pin 1
Pin 2
Pin 3
Pin 4
1
GND
I/O 3
5, 6
I/O 4
GND
Revision 9/24/2014
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RClamp3324T
PROTECTION PRODUCTS
Absolute Maximum Rating
R ating
Peak Pulse Power (tp = 8/20
μ
s)
Peak Pulse Current (tp = 8/20
μ
s)
ESD p er IEC 61000-4-2 (Air)
ESD p er IEC 61000-4-2 (Contact)
Op erating Temp erature
Storage Temp erature
Symbol
P
p k
I
P P
V
ESD
T
J
T
STG
Value
75
5
+/- 30
+/- 25
-40 to +125
-55 to +150
PRELIMINARY
Units
Watts
A
kV
°C
°C
Electrical Characteristics (T=25
o
C Unless Otherwise Specified)
Parameter
Reverse Stand-Off Voltage
Punch-Through Voltage
Reverse Leakage Current
Clamp ing Voltage
Clamp ing Voltage
Junction Cap acitance
Symbol
V
RWM
V
PT
I
R
V
C
V
C
C
j
Conditions
Any I/O to GN D
I
PT
= 2
μ
A
Any I/O to GN D
V
RWM
= 3.3V
Any I/O to GN D
I
PP
= 1A, tp = 8/20
μ
s
Any I/O to GN D
I
PP
= 5A, tp = 8/20
μ
s
Any I/O to GN D
V
R
= 0V, f = 1MHz,
Any I/O to GN D
V
R
= 0V, f = 1MHz,
Between I/O p ins
0.40
0.30
3.8
4.8
0.005
Minimum
Typical
Maximum
3.3
5.5
0.100
7
10.5
0.65
0.4
Units
V
V
μ
A
V
V
pF
pF
©
2014 Semtech Corporation
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RClamp3324T
PROTECTION PRODUCTS
Electrical Characteristics (T=25
o
C Unless Otherwise Noted)
ESD R atings (Each Pin)
P ar am et er
ESD Withstand Voltage
1
ESD Withstand Voltage
1
ESD Peak Voltage
1
ESD Peak Voltage
1
ESD Clamping Voltage
2
ESD Clamping Voltage
2
Dynamic Resistance (Positive)
2, 3
Dynamic Resistance (N egative)
2, 3
V
pk
V
pk
V
tl p
V
tl p
R
Dyn
R
Dyn
S y m b ol
Con d i t i on s
Contact discharge per
IEC 61000-4-2
Air discharge per IEC
61000-4-2
+8kV per IEC 61000-4-2
-8kV per IEC 61000-4-2
I
PP
= 16A,
tlp = 0.2/100ns
I
PP
= -16A,
tlp = 0.2/100ns
tp = 100ns
tp = 100ns
55
-60
11.5
11
0.35
0.50
Mi n i mu m
Ty p i c a l
M ax i m u m
25
30
Units
kV
kV
V
V
V
V
Ohms
Ohms
PRELIMINARY
Notes
1)ESD peak voltage measured with a 20dB attenuator, 50 Ohm scope input impedance, 2GHz bandwidth. ESD
gun return path connected to ESD ground plane.
2)Transmission Line Pulse Test (TLP) Settings: t
p
= 100ns, t
r
= 0.2ns, I
TLP
and V
TLP
averaging window: t
1
= 70ns to
t
2
= 90ns.
3) Dynamic resistance calculated from I
TLP
= 4A to I
TLP
= 16A
©
2014 Semtech Corporation
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RClamp3324T
PROTECTION PRODUCTS
Typical Characteristics
Non-Repetitive Peak Pulse Power vs. Pulse Time
10
DR040412-75
PRELIMINARY
Power Derating Curve
120
100
% of Rated Power or I
PP
Peak Pulse Power - P
PP
(kW)
1
80
60
40
20
DR040512:25:125:150
0.1
0
0.01
0.1
1
10
Pulse Duration - tp (µs)
100
1000
0
25
50
75
100
O
125
150
Ambient Temperature - T
A
( C)
Clamping Voltage vs. Peak Pulse Current
9
8
Capacitance vs. Reverse Voltage
1.0
0.9
0.8
Capacitance - C
j
(pf)
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
6
Clamping Voltage -V
C
(V)
7
6
5
4
3
2
1
0
0
1
2
3
4
5
Waveform
Parameters:
tr = 8µs
td = 20µs
f = 1 MHz
0
0.5
1
1.5
2
2.5
3
Peak Pulse Current - I
PP
(A)
Reverse Voltage - V
R
(V)
TLP Characteristic (Positive Pulse)
TLP Characteristic (Negative Pulse)
30
25
R
DYN
= 0.35
0
-5
-10
Current (A)
R
DYN
= 0.50
20
Current (A)
15
10
5
0
0
5
10
Voltage (V)
15
20
Transmission Line Pulse Test
(TLP) Settings:
t
p
= 100ns, t
r
= 0.2ns,
I
TLP
and V
TLP
averaging window:
t
1
= 70ns to t
2
= 90ns
-15
-20
-25
-30
-20
-15
-10
Voltage (V)
-5
0
Transmission Line Pulse Test
(TLP) Settings:
t
p
= 100ns, t
r
= 0.2ns,
I
TLP
and V
TLP
averaging window:
t
1
= 70ns to t
2
= 90ns
©
2014 Semtech Corporation
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RClamp3324T
PROTECTION PRODUCTS
Typical Characteristics
ESD Clamping at Each Pin
(+8kV Contact per IEC 61000-4-2)
60
50
40
Voltage (V)
Voltage (V)
-30
-40
-50
10
0
-10
0
10
20
30
40
50
60
70
80
Time (ns)
-60
-70
-10
0
10
20
30
40
50
60
70
80
Time (ns)
Measured with 50 Ohm scope input
impedance, 2GHz bandwidth.
Corrected for 50 Ohm, 20dB
attenuator. ESD gun return path
connected to ESD ground plane
Measured with 50 Ohm scope input
impedance, 2GHz bandwidth.
Corrected for 50 Ohm, 20dB
attenuator. ESD gun return path
connected to ESD ground plane
PRELIMINARY
ESD Clamping at Each Pin
(-8kV Contact per IEC 61000-4-2)
0
-10
-20
30
20
ESD Clamping vs. Positive Discharge Voltage
(Contact Discharge per IEC 61000-4-2)
60
+8kV
V
pk
=54.6V
+6kV
V
PK
=41.8V
+4kV
V
pk
=34.1V
30
+2kV
V
pk
=22.5V
Measured with 50 Ohm scope input
impedance, 2GHz bandwidth.
Corrected for 50 Ohm, 20dB
attenuator. ESD gun return path
connected to ESD ground plane
ESD Clamping vs. Negative Discharge Voltage
(Contact Discharge per IEC 61000-4-2)
10
0
-10
-20
-30
-40
-50
-2kV
Vpk= -19.20V
-4kV
Vpk= -35.36V
-6kV
Vpk= -48.00V
-8kV
Vpk= -60.20V
Measured with 50 Ohm scope input
impedance, 2GHz bandwidth.
Corrected for 50 Ohm, 20dB
attenuator. ESD gun return path
connected to ESD ground plane
50
40
Voltage (V)
20
10
0
Voltage (V)
20
30
40
50
60
-60
-70
-10
0
10
-10
0
-10
10
20
30
40
50
60
Time (ns)
Time (ns)
Typical Insertion Loss S21 (5GhZ)
0
-20
-3
Analog Crosstalk
Insertion Loss (dB)
Data includes loss due to SMA connector
-40
-60
-80
-100
-120
-140
1.00E+07
Insertion Loss (dB)
-9
-15
1.00E+06
1.00E+07
1.00E+08
Frequency (Hz)
1.00E+09
1.00E+10
1.00E+08
1.00E+09
1.00E+10
Frequency (Hz)
©
2014 Semtech Corporation
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