K8F5715ETM-DC1D0 datasheet, PDF

K8F5715ETM-DC1D0: DescriptionFlash, 16MX16, 100ns, PBGA88, 8 X 11 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FBGA-88; Categorystorage storage; File Size1MB，59 Pages; ManufacturerSAMSUNG; Websitehttp://www.samsung.com/Products/Semiconductor/; Environmental Compliance

Download Datasheet Parametric View All

K8F5715ETM-DC1D0 Overview

Flash, 16MX16, 100ns, PBGA88, 8 X 11 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FBGA-88

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	SAMSUNG
Parts packaging code	BGA
package instruction	TFBGA, BGA88,8X12,32
Contacts	88
Reach Compliance Code	compliant
ECCN code	3A991.B.1.A
Maximum access time	100 ns
Other features	SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE
startup block	TOP
command user interface	YES
Universal Flash Interface	YES
Data polling	YES
JESD-30 code	R-PBGA-B88
JESD-609 code	e1
length	11 mm
memory density	268435456 bit
Memory IC Type	FLASH
memory width	16
Humidity sensitivity level	2
Number of functions	1
Number of departments/size	4,255
Number of terminals	88
word count	16777216 words
character code	16000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	16MX16
Package body material	PLASTIC/EPOXY
encapsulated code	TFBGA
Encapsulate equivalent code	BGA88,8X12,32
Package shape	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	260
power supply	1.8 V
Programming voltage	1.8 V
Certification status	Not Qualified
ready/busy	YES
Maximum seat height	1.2 mm
Department size	16K,64K
Maximum standby current	0.00002 A
Maximum slew rate	0.055 mA
Maximum supply voltage (Vsup)	1.95 V
Minimum supply voltage (Vsup)	1.7 V
Nominal supply voltage (Vsup)	1.8 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	TIN SILVER COPPER
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	40
switch bit	YES
type	NOR TYPE
width	8 mm

K8F56(57)15ET(B)M

NOR FLASH MEMORY

256Mb M-die MLC NOR Specification

INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS,

AND IS SUBJECT TO CHANGE WITHOUT NOTICE.

NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,

EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE,

TO ANY INTELLECTUAL PROPERTY RIGHTS IN SAMSUNG PRODUCTS OR TECHNOLOGY. ALL

INFORMATION IN THIS DOCUMENT IS PROVIDED

ON AS "AS IS" BASIS WITHOUT GUARANTEE OR WARRANTY OF ANY KIND.

1. For updates or additional information about Samsung products, contact your nearest Samsung office.

2. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar

applications where Product failure couldresult in loss of life or personal or physical harm, or any military or

defense application, or any governmental procurement to which special terms or provisions may apply.

* Samsung Electronics reserves the right to change products or specification without notice.

Revision 1.2

September, 2006

On the modeling and configuration of DSP systems: Embedded software development requires extensive knowledge and understanding of the target architecture and its use. There are a series of steps required to transform an embedded system from concept t...; fish001 Microcontroller MCU

An old electronic engineer's ten-year workplace experience: An old electronic engineer's ten-year workplace experience I have been an electronic engineer for more than ten years, but I am not very successful. Looking around, I don’t see many successful people!...; 剑雪紫轩 ADI Reference Circuit

Basic knowledge of array antenna radiation: It uses electronic methods to achieve inertia-free beam scanning, so it is also called electronically scanned array (ESA). Its beam direction is controllable, scanning is flexible, and the gain can be...; Jacktang RF/Wirelessly

Compiling WinCe kernel, platform builder 5 freezes, what is the problem: Excuse me, the WinCe kernel can be compiled on my desktop computer, but when I transfer it to my laptop and compile it with platform builder5, it freezes. The information on my laptop is: System: Vist...; zzqiang66 Embedded System

(Solved) Questions for guidance: After getting the board, I can download the program, but the mobile phone Bluetooth cannot receive it, it cannot be searched using the app, and the little red light no longer flashes. I don't know if ...; Sur MEMS sensors

I'm a newbie. Is there any place to download the component and package library of cadence16.3?: Can I download the component and package library of cadence16.3? I want to make a board. Can I download the component and package library? There are commonly used ones such as capacitors, resistors an...; oyanghehe PCB Design

Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

Popular Components