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V62C3161024L-55T

Description
Ultra Low Power 64K x 16 CMOS SRAM
Categorystorage    storage   
File Size78KB,10 Pages
ManufacturerMosel Vitelic Corporation ( MVC )
Websitehttp://www.moselvitelic.com
Download Datasheet Parametric Compare View All

V62C3161024L-55T Overview

Ultra Low Power 64K x 16 CMOS SRAM

V62C3161024L-55T Parametric

Parameter NameAttribute value
MakerMosel Vitelic Corporation ( MVC )
Objectid1904877280
Parts packaging codeTSOP2
package instructionTSOP2,
Contacts44
Reach Compliance Codeunknow
ECCN codeEAR99
compound_id9916584
Maximum access time55 ns
JESD-30 codeR-PDSO-G44
length18.41 mm
memory density1048576 bi
Memory IC TypeSTANDARD SRAM
memory width16
Number of functions1
Number of terminals44
word count65536 words
character code64000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize64KX16
Package body materialPLASTIC/EPOXY
encapsulated codeTSOP2
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE
Parallel/SerialPARALLEL
Certification statusNot Qualified
Maximum seat height1.2 mm
Maximum supply voltage (Vsup)3.3 V
Minimum supply voltage (Vsup)2.7 V
Nominal supply voltage (Vsup)3 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formGULL WING
Terminal pitch0.8 mm
Terminal locationDUAL
width10.16 mm
V62C3161024L(L)
Ultra Low Power
64K x 16 CMOS SRAM
Features
• Ultra Low-power consumption
- Active: 40mA I
CC
at 55ns
- Stand-by: 5
µ
A
(CMOS input/output)
1
µA
(
CMOS input/output, L version)
• 55/70/85/100 ns access time
• Equal access and cycle time
• Single +2.7V to 3.3V Power Supply
• Tri-state output
• Automatic power-down when deselected
• Multiple center power and ground pins for
improved noise immunity
• Individual byte controls for both Read and
Write cycles
• Available in 44 pin TSOP (II) Package
Functional Description
TheV62C3161024L is a Low Power CMOS Static RAM
organized as 65,536 words by 16 bits. Easy memory exp-
ansion is provided by an active LOW (CE) and (OE) pin.
This device has an automatic power-down mode feature
when deselected. Separate Byte Enable controls (BLE
and BHE) allow individual bytes to be accessed. BLE
controls the lower bits I/O1 - I/O8. BHE controls the
upper bits I/O9 - I/O16.
Writing to these devices is performed by taking Chip
Enable (CE) with Write Enable (WE) and Byte Enable
(BLE/BHE) LOW.
Reading from the device is performed by taking Chip
Enable (CE) with Output Enable (OE) and Byte Enable
(BLE/BHE) LOW while Write Enable (WE) is held
HIGH.
Logic Block Diagram
Pre-Charge Circuit
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
TSOP(II)
Row Select
Vcc
Vss
Memory Array
1024 X 1024
I/O1 - I/O8
I/O9 - I/O16
Data
Cont
Data
Cont
I/O Circuit
Column Select
A10 A11 A12 A13 A14 A15
WE
OE
BLE
BHE
CE
A4
A3
A2
A1
A0
CE
I/O1
I/O2
I/O3
I/O4
Vcc
Vss
I/O5
I/O6
I/O7
I/O8
WE
A15
A14
A13
A12
NC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
A5
A6
A7
OE
BHE
BLE
I/O16
I/O15
I/O14
I/O13
Vss
Vcc
I/O12
I/O11
I/O10
I/O9
NC
A8
A9
A10
A11
NC
1
REV. 1.1
April
2001 V62C3161024L(L)

V62C3161024L-55T Related Products

V62C3161024L-55T V62C3161024LL-85T V62C3161024LL-70T V62C3161024LL-55T V62C3161024L-85T V62C3161024L-70T V62C3161024L-100T V62C3161024L
Description Ultra Low Power 64K x 16 CMOS SRAM Ultra Low Power 64K x 16 CMOS SRAM Ultra Low Power 64K x 16 CMOS SRAM Ultra Low Power 64K x 16 CMOS SRAM Ultra Low Power 64K x 16 CMOS SRAM Ultra Low Power 64K x 16 CMOS SRAM Ultra Low Power 64K x 16 CMOS SRAM Ultra Low Power 64K x 16 CMOS SRAM
Maker Mosel Vitelic Corporation ( MVC ) - Mosel Vitelic Corporation ( MVC ) Mosel Vitelic Corporation ( MVC ) Mosel Vitelic Corporation ( MVC ) Mosel Vitelic Corporation ( MVC ) Mosel Vitelic Corporation ( MVC ) -
Parts packaging code TSOP2 TSOP2 TSOP2 TSOP2 TSOP2 TSOP2 TSOP2 -
package instruction TSOP2, TSOP2, TSOP2, TSOP2, TSOP2, TSOP2, TSOP2, -
Contacts 44 44 44 44 44 44 44 -
Reach Compliance Code unknow unknow unknow unknow unknown unknown unknown -
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 -
Maximum access time 55 ns 85 ns 70 ns 55 ns 85 ns 70 ns 100 ns -
JESD-30 code R-PDSO-G44 R-PDSO-G44 R-PDSO-G44 R-PDSO-G44 R-PDSO-G44 R-PDSO-G44 R-PDSO-G44 -
length 18.41 mm 18.41 mm 18.41 mm 18.41 mm 18.41 mm 18.41 mm 18.41 mm -
memory density 1048576 bi 1048576 bi 1048576 bi 1048576 bi 1048576 bit 1048576 bit 1048576 bit -
Memory IC Type STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM -
memory width 16 16 16 16 16 16 16 -
Number of functions 1 1 1 1 1 1 1 -
Number of terminals 44 44 44 44 44 44 44 -
word count 65536 words 65536 words 65536 words 65536 words 65536 words 65536 words 65536 words -
character code 64000 64000 64000 64000 64000 64000 64000 -
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS -
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C -
organize 64KX16 64KX16 64KX16 64KX16 64KX16 64KX16 64KX16 -
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY -
encapsulated code TSOP2 TSOP2 TSOP2 TSOP2 TSOP2 TSOP2 TSOP2 -
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR -
Package form SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE -
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL -
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified -
Maximum seat height 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm -
Maximum supply voltage (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V -
Minimum supply voltage (Vsup) 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V -
Nominal supply voltage (Vsup) 3 V 3 V 3 V 3 V 3 V 3 V 3 V -
surface mount YES YES YES YES YES YES YES -
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS -
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL -
Terminal form GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING -
Terminal pitch 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm -
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL -
width 10.16 mm 10.16 mm 10.16 mm 10.16 mm 10.16 mm 10.16 mm 10.16 mm -
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