Packaging Information / Reference Pattern Layout Dimensions
●USP-6C
Unit: mm
■
Packaging Information
2.0±0.05
0.6MAX
■
Reference Pattern Layout Dimension
Note : reference metal mask design
0.70±0.05
1.0±0.05
0.25±0.05
●USP-6C
Power Dissipation
Power dissipation data for the USP-6C is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as one of reference data taken in the described condition.
1. Measurement Condition (Reference data)
Condition : Mount on a board
Ambient : Natural convection
Soldering : Lead (Pb) free
Board : Dimensions 40mm×40mm(1600mm
2
in one side)
Copper (Cu) traces occupy 50% of the board area
In top and back faces
Package heat-sink is tied to the copper traces
Material : Glass Epoxy(FR-4)
Thickness : 1.6mm
Through-hole : 4 x 0.8 Diameter
Evaluation Board (Unit: mm)
2.
Power Dissipation vs. Ambient temperature(85℃)
Board Mount ( Tjmax=125℃)
Ambient
Temperature
(℃)
25
85
Power
Dissipation
Pd (mW)
1000
400
Thermal
Resistance
(℃/W)
100.00
3.
Power Dissipation vs. Ambient temperature(105℃)
Board Mount ( Tjmax=125℃)
Ambient
Temperature
(℃)
25
105
Power
Dissipation
Pd (mW)
1000
200
Thermal
Resistance
(℃/W)
100.00