plerow
TM
APM0923-P29
High OIP3
Medium Power Amplifier Module
Features
·
S
21
= 33.05 dB @ 920 MHz
= 32.95 dB @ 925 MHz
·
NF of 6.5 dB over Frequency
·
Unconditionally Stable
·
Single 5V Supply
·
High OIP3 @ Low Current
Description
The plerow
TM
APM-Series is an internally matched
amplifier mini-module for such application band in
SMD package with the output P1dB of 29 dBm. It is
compactly designed for low current consumption and
high OIP3. Integrating all the components for biasing
and matching within the module enhances production
yield and throughput as well. It passes through the
stringent DC, RF, and reliability tests. Not sample test
but 100% quality control test is made before packing.
C
C
C
o
o
o
u
u
u
pl
pl
pl
er
er
er
C
o
o
u
u
pl
pl
er
Specifications (in Production)
Typ. @ T = 25C, V
s
= 5 V, Freq. = 922.5 MHz, Z
o.sys
= 50 ohm
Parameter
Frequency Range
Gain
Gain Flatness
Noise Figure
Output IP3
(1)
S11 / S22
(2)
Output P1dB
Switching Time
(3)
Supply Current
Supply Voltage
Impedance
Max. RF Input Power
Package Type & Size
Unit
MHz
dB
dB
dB
dBm
dB
dBm
sec
mA
V
dBm
mm
Specifications
Min
920
32.0
33.0
0.05
6.5
45.5
48.5
-19 / -10
29
30
-
380
5
50
C.W 23 ~ 25 (before fail)
Surface Mount Type, 10Wx10Lx3.8H
400
0.1
7.0
Typ
Max
925
1-stage Single Type
More Information
Website: www.asb.co.kr
E-mail: sales@asb.co.kr
Tel: (82) 42-528-7223
Fax: (82) 42-528-7222
Operating temperature is -40C to +85C.
1) OIP3 is measured with two tones at an output power of 12 dBm / tone separated by 1 MHz.
2) S11/S22 (max) is the worst value within the frequency band.
3) Switching time means the time that takes for output power to get stabilized to its final level after switching DC voltage from 0 V to V
S
.
Outline Drawing (Unit: mm)
plerow
APM0923-P29
Pin Number
2
5
6
(Bottom View)
Function
RF In
RF Out
Vs
Ground
ASB Inc.
(Top View)
Solder Stencil Area
Others
(Side View)
Note: 1. The number and size of ground via holes in
a circuit board is critical for thermal RF
grounding considerations.
2. We recommend that the ground via holes be
placed on the bottom of all ground pins for
better RF and thermal performance, as
shown in the drawing at the left side.
Ø
0.3 plated thru holes to ground plane
2 x
Ø
2.0 plated thru holes to screw on heat sinker
(Recommended Footprint)
1/5
www.asb.co.kr
April 2009
plerow
TM
APM0923-P29
High OIP3
Medium Power Amplifier Module
Application Circuit
V
S
+
-
Tantal or MLC (Multi Layer Ceramic)
Capacitor
C1
IN
C2
APM
OUT
1)
The tantal or MLC (Multi Layer Ceramic) capacitor is optional and for bypassing the AC noise introduced
from the DC supply. The capacitance value may be determined by customer’s DC supply status. The ca-
pacitor should be placed as close as possible to V
s
pin and be connected directly to the ground plane for
the best electrical performance.
DC blocking capacitors are always necessarily placed at the input and output port for allowing only the
RF signal to pass and blocking the DC component in the signal. The DC blocking capacitors are includ-
ed inside the APM module. Therefore, C1 & C2 capacitors may not be necessary, but can be added just
in case that the customer wants. The value of C1 & C2 is determined by considering the application fre-
quency.
2)
Recommended Soldering Reflow Process
Evaluation Board Layout
Vs
260C
Ramp-up
(3˚C/sec)
200C
20~40 sec
Ramp-down
(6C/sec)
IN
OUT
150C
60~180 sec
Size 40x40mm
(for APM Series – 10x10mm)
4/5
www.asb.co.kr
April 2009
plerow
TM
APM0923-P29
High OIP3
Medium Power Amplifier Module
Channel Power vs. ACLR Test Configuration
APM0950
– P29
Evaluation Board attached with Heat Sink
Evaluation Board
* In order to prevent damage of D.U.T (APM-Series) from heating, you must to use a properly sized heat
sink for testing a module.
5/5
www.asb.co.kr
April 2009
Automotive Electronics
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