EEWORLDEEWORLDEEWORLD

Part Number

Search

S1D15605T00C

Description
IC,LCD DISPLAY DRIVER,132-SEG,65-BP,CMOS,MODULE
CategoryAnalog mixed-signal IC    Drivers and interfaces   
File Size4MB,612 Pages
ManufacturerSeiko Epson Corporation
Download Datasheet Parametric Compare View All

S1D15605T00C Overview

IC,LCD DISPLAY DRIVER,132-SEG,65-BP,CMOS,MODULE

S1D15605T00C Parametric

Parameter NameAttribute value
MakerSeiko Epson Corporation
package instruction, MODULE(UNSPEC)
Reach Compliance Codeunknown
display modeSEGMENT
Number of base plates65-BP
Number of segments132
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Encapsulate equivalent codeMODULE(UNSPEC)
Package formMICROELECTRONIC ASSEMBLY
power supply3 V
Certification statusNot Qualified
Nominal supply voltage3 V
technologyCMOS
Temperature levelINDUSTRIAL
MF424-21
LCD driver with RAM
IEEE1394 Controller
S1D15000 Series
S1R75801F00A
Technical Manual

S1D15605T00C Related Products

S1D15605T00C S1D15300T10A S1D15A06T00A S1D15605T00A S1D15606T00A S1D15B01T00A S1D15608D11B S1D15607T00B
Description IC,LCD DISPLAY DRIVER,132-SEG,65-BP,CMOS,MODULE IC,LCD DISPLAY DRIVER,100-SEG,33-BP,CMOS,MODULE IC,LCD DISPLAY DRIVER,102-SEG,55-BP,CMOS,MODULE IC,LCD DISPLAY DRIVER,132-SEG,65-BP,CMOS,MODULE IC,LCD DISPLAY DRIVER,132-SEG,49-BP,CMOS,MODULE IC,LCD DISPLAY DRIVER,132-SEG,65-BP,CMOS,MODULE Interface Circuit, CMOS IC,LCD DISPLAY DRIVER,132-SEG,33-BP,CMOS,MODULE
package instruction , MODULE(UNSPEC) , MODULE(UNSPEC) , MODULE(UNSPEC) , MODULE(UNSPEC) , MODULE(UNSPEC) , MODULE(UNSPEC) , DIE OR CHIP , MODULE(UNSPEC)
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown
display mode SEGMENT SEGMENT SEGMENT SEGMENT SEGMENT SEGMENT SEGMENT SEGMENT
Number of base plates 65-BP 33-BP 55-BP 65-BP 49-BP 65-BP 55-BP 33-BP
Number of segments 132 100 102 132 132 132 132 132
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
Encapsulate equivalent code MODULE(UNSPEC) MODULE(UNSPEC) MODULE(UNSPEC) MODULE(UNSPEC) MODULE(UNSPEC) MODULE(UNSPEC) DIE OR CHIP MODULE(UNSPEC)
power supply 3 V 5 V 3 V 3 V 3 V 2/3.3 V 3 V 3 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Maker Seiko Epson Corporation - Seiko Epson Corporation Seiko Epson Corporation Seiko Epson Corporation Seiko Epson Corporation Seiko Epson Corporation Seiko Epson Corporation
Package form MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY - MICROELECTRONIC ASSEMBLY
Nominal supply voltage 3 V 5 V 3 V 3 V 3 V - 3 V 3 V

Technical ResourceMore

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1137  1163  2918  2546  4  23  24  59  52  1 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号