REVISIONS
LTR
A
DESCRIPTION
Update drawing to current requirements. Editorial changes throughout. - drw
DATE (YR-MO-DA)
04-09-10
APPROVED
Raymond Monnin
THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED.
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
REV
SHEET
PREPARED BY
Rick C. Officer
A
1
A
2
A
3
A
4
A
5
A
6
A
7
A
8
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
CHECKED BY
Charles E. Besore
APPROVED BY
Monica L. Poelking
DRAWING APPROVAL DATE
90-03-23
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
http://www.dscc.dla.mil
MICROCIRCUIT, LINEAR, CMOS, 12-BIT,
MULTIPLYING D/A CONVERTER, MONOLITHIC
SILICON
AMSC N/A
REVISION LEVEL
A
SIZE
A
SHEET
CAGE CODE
67268
1 OF
8
5962-89481
DSCC FORM 2233
APR 97
5962-E420-04
1. SCOPE
1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in
accordance with MIL-PRF-38535, appendix A.
1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example:
5962-89481
01
V
A
Drawing number
Device type
(see 1.2.1)
Case outline
(see 1.2.2)
Lead finish
(see 1.2.3)
1.2.1 Device types. The device types identify the circuit function as follows:
Device type
01
02
03
04
Generic number
AD7541AS
AD7541AT
PM7541AB
PM7541AA
Circuit function
12-bit multiplying DAC
12-bit multiplying DAC
12-bit multiplying DAC
12-bit multiplying DAC
1.2.2 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows:
Outline letter
2
V
Descriptive designator
CQCC1-N20
GDIP1-T18 or CDIP2-T18
Terminals
20
18
Package style
Square leadless chip carrier
Dual-in-line
1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A.
1.3 Absolute maximum ratings.
Supply voltage (V
DD
) .............................................................................................
Reference input voltage (V
REF
) .............................................................................
V
RFB
to GND..........................................................................................................
Digital input voltage (V
IN
):
Device types 01, 02...........................................................................................
Device types 03, 04...........................................................................................
Voltage at OUT1, OUT2 pins................................................................................
Power dissipation ..................................................................................................
Storage temperature range...................................................................................
Lead temperature (soldering, 10 seconds)...........................................................
Junction temperature (T
J
) .....................................................................................
Thermal resistance, junction-to-case (
JC
) ...........................................................
Thermal resistance, junction-to-ambient (
JA
):
Cases V and 2...................................................................................................
1.4 Recommended operating conditions.
Positive supply voltage (V
DD
)................................................................................. +15 V dc
Ambient operating temperature range (T
A
) .......................................................... -55°C to +125°C
Reference input voltage range.............................................................................. -10 V dc to +10 V dc
+17 V dc
±25 V dc
±25 V dc
-0.3 V dc to V
DD
GND, V
DD
-0.3 V dc to V
DD
450 mW 1/
-65°C to +150°C
+300°C
+175°C
See MIL-STD-1835
120°C/W
1/
Derate 6 mW/°C above T
A
= +75°C
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
θ
θ
SIZE
A
REVISION LEVEL
5962-89481
SHEET
A
2
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of
this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 -
MIL-STD-1835 -
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 -
MIL-HDBK-780 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
(Copies of these documents are available online at
http://assist.daps.dla.mil/quicksearch/
or
www.dodssp.daps.mil
or from
the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of
this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific
exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN
class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing
(QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535
may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval
in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make
modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These
modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in accordance with MIL-PRF-38535 is
required to identify when the QML flow option is used.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in
MIL-PRF-38535, appendix A and herein.
3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as
specified in table I and shall apply over the full ambient operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests
for each subgroup are described in table I.
3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in
1.2 herein. In addition, the manufacturer's PIN may also be marked. For packages where marking of the entire SMD PIN number
is not feasible due to space limitations, the manufacturer has the option of not marking the "5962-" on the device.
3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to
MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a "Q" or "QML" certification mark in accordance
with MIL-PRF-38535 to identify when the QML flow option is used.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-89481
SHEET
A
3
TABLE I. Electrical performance characteristics.
Conditions 1/
-55°C
≤
T
A
≤
+125°C
unless otherwise specified
Test
Symbol
Group A
subgroups
Device
type
Min
Limits
Max
±1
±1
±0.5
Unit
Relative accuracy
RA
1, 2, 3
1
2, 3, 12
1, 2, 3
01
02
LSB
03, 04
01, 03
02
±0.5
±1
±1
±0.5
LSB
Differential nonlinearity
DNL
1, 2, 3
1
2, 3, 12
1, 2, 3
04
01
±0.5
±6
±8
LSB
Gain error
AE
2/
1
2, 3
1
2, 3
12
1
2, 3
1
2, 3
02
±6
±5
±3
03
±2
±3
04
±1
±2
Power supply rejection ratio
PSRR
3/
1
2, 3
1
2, 3
01, 02
±.01
±.02
%per%
03, 04
±.001
±.002
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-89481
SHEET
A
4
TABLE I. Electrical performance characteristics continued.
Conditions 1/
-55°C
≤
T
A
≤
+125°C
unless otherwise specified
Test
Symbol
Group A
subgroups
Device
type
Min
Limits
Max
±5
±200
Unit
Output leakage current 4/
I
OUT
I
OUT1
and I
OUT2
pins
Digital input = 0 V, V
DD
1
2, 3
1
2, 3
01, 02
nA
03, 04
±5
±100
03, 04
Digital input high voltage
Digital input low voltage
Digital input leakage current
Supply current
V
IH
V
IL
I
IN
I
DD
V
IN
= 0 V or V
DD
Digital inputs = V
IN
or V
IL
Digital inputs = 0 V or V
DD
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
1
2, 3
Digital input capacitance
Output capacitance
I
OUT1
pin
I
OUT2
pin
I
OUT1
pin
I
OUT2
pin
1/
2/
3/
4/
C
OUT1
C
OUT2
C
OUT1
C
OUT2
Digital inputs = V
IH
,
See 4.3.1c, T
A
= +25°C
Digital inputs = V
IL
,
See 4.3.1c, T
A
= +25°C
4
All
C
IN
See 4.3.1c, T
A
= +25°C
4
All
All
All
All
All
7
2.4
15
V
0.8
±1
2
100
500
8
pF
V
A
mA
A
200
70
70
200
pF
V
DD
= +15 V, V
OUT1
= V
OUT2
= 0 V, V
REF
= 10 V unless other wise specified.
Measured using internal feedback resistor.
Delta V
DD
= ±5%.
DAC loaded with 0000 0000 0000 for I
OUT1
and digital inputs = V
IL
. Digital inputs = V
IH
for I
OUT2
.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-89481
SHEET
A
5
Ω
Reference input resistance
R
IN
1, 2, 3
01, 02
7
18
k
µ
µ
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