Document No
TCF-XXOS032J
2012/06/28
2/20
Thin Film Chip Fuse
Issued date
Page
4. Dimensions
Unit: mm
Type
(Inch Size code)
CF04
(0402)
CF06
(0603)
CF12
(1206)
Dimensions (mm)
L
1.0±0.1
1.6±0.1
3.1±0.1
W
0.52±0.05
0.80±0.10
1.55±0.10
C
0.2±0.1
0.3±0.2
0.5±0.3
d
0.25±0.1
0.35±0.2
0.50±0.2
t
0.35±0.05
0.45±0.10
0.60±0.10
5. Applications and ratings
Part
Designation
CF04V3TR315
CF04V3TR50
CF04V3TR75**
CF04V3TR80
CF04V3T1R0
CF04V3T1R25
CF04V3T1R50
CF04V3T1R60
CF04V3T2R0
CF04V3T2R50
CF04V3T3R0
CF04V3T3R15
CF04V3T4R0
Rated
Marking
Current
D
F
V
K
L
M
P
N
S
T
3
U
W
Resistance
Body
Rated Breaking
(mΩ)
Temperature
Voltage Capacity
rising
Tolerance±25%
0.315A
690
0.50A
340
0.75A
140
0.80A
100
1.00A
95
Open within
1.25A
57
1min.at
DC32V <75℃at 100%
1.50A
200%
45
DC 32V
35A
rated current
rated
1.60A
44
current
2.00A
33
2.50A
25
3.00A
19
3.15A
18
4.00A
12
Fusing
Time
*Resistance valve was measured with less than 10% of rated current
** CF04V3TR75
is still under UL application.
TA-I TECHNOLOGY CO., LTD
Document No
TCF-XXOS032J
2012/06/28
3/20
Thin Film Chip Fuse
Issued date
Page
Part
Designation
CF06V5TR40
CF06V5TR50
CF06V3TR63
CF06V3TR80
CF06V3T1R0
CF06V3T1R25
CF06V3T1R50
CF06V3T1R60
CF06V3T2R0
CF06V3T2R50
CF06V3T3R00
CF06V3T3R15
CF06V3T4R0
CF06V3T5R0
Rated
Marking
Current
E
F
I
K
L
M
P
N
S
T
3
U
W
Y
0.4A
0.50A
0.63A
0.80A
1.00A
1.25A
1.50A
1.60A
2.00A
2.50A
3.00A
3.15A
4.00A
5.00A
Resistance
Body
Rated
Breaking
(mΩ)
Temperature
Voltage Capacity
rising
Tolerance±25%
496
DC 50V DC50V 50A
290
205
132
84
Open within
DC32V
63
DC 32V
<75℃at
1min.at
50A
50.5
200%
100% rated
45
rated
current
current
34
24.5
20
DC32V
19
DC 32V
50A
13
11
Fusing
Time
*Resistance valve was measured with less than 10% of rated current
Resistance
Body
Rated Breaking
(mΩ)
Temperature
Voltage Capacity
rising
Tolerance±25%
517
211
132
DC63V
DC 63V
50A
95
Open within
76
1min.at
<75℃at 100%
200%
40.5
rated current
rated
31.5
current
23.25
DC32V
16
DC 32V
50A
12
7.5
Fusing
Time
Part
Designation
CF12V6TR50
CF12V6TR80
CF12V6T1R0
CF12V6T1R25
CF12V6T1R50
CF12V6T2R0
CF12V3T2R50
CF12V3T3R00
CF12V3T4R0
CF12V3T5R0
CF12V3T7R0
Rated
Marking
Current
F
K
L
M
P
S
T
3
W
Y
Z
0.50A
0.80A
1.00A
1.25A
1.50A
2.00A
2.50A
3.00A
4.00A
5.00A
7.00A
*Resistance valve was measured with less than 10% of rated current
TA-I TECHNOLOGY CO., LTD
Document No
TCF-XXOS032J
2012/06/28
4/20
Thin Film Chip Fuse
Issued date
Page
6. Temperature Derating Curve
6.1 Normal Ambient Temperature: 25℃
6.2 Operating Temperature: -20℃~105℃, whit proper Derating factor as below:
105
7. Reliability Tests
Parameter
Carrying capacity
Fusing Time
Interrupting Ability
Bending Test
Resistance to solder Heat
Solderability
Temperature Rise
Resistance to Dry Heat
Resistance to Solvent
Residual Resistance
Thermal Shock
Requirement
No fusing
Within 1 minute
No mechanical
damages
No mechanical
damages
±20%
95% coverage
minimum
<75℃
±20%
No evident damages
on protective coating
and marking
10kΩ and more
△R<
10 %
Test Method
Rated current ,4hr
200% of its rated current
After the fuse is interrupted ,rated voltage applied for
30sec again
Distance between holding points: 90mm,
Bending:3mm,1time ,30sec
260℃±5℃,10±1second
235℃±5℃, 2±0.5second
245℃±5℃, 2±0.5second (Lead Free)
100% of its rated current, Measure of surface
temperature
105℃±5℃,1000 hrs
23℃±5℃of Isopropyl alcohol 90second
Measure DC resistance after fusing
-20℃/+25℃/+125℃/+25℃, 10 cycles
TA-I TECHNOLOGY CO., LTD
京公网安备 11010802033920号
EEWORLD
