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U0406FC05C-T710-2

Description
Trans Voltage Suppressor Diode, 250W, Bidirectional, 5 Element, Silicon, FLIP CHIP-6
CategoryDiscrete semiconductor    diode   
File Size108KB,5 Pages
ManufacturerProTek Devices
Websitehttp://www.protekdevices.com/
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U0406FC05C-T710-2 Overview

Trans Voltage Suppressor Diode, 250W, Bidirectional, 5 Element, Silicon, FLIP CHIP-6

U0406FC05C-T710-2 Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerProTek Devices
Parts packaging codeFLIP-CHIP
package instructionR-XBCC-N6
Contacts6
Reach Compliance Codecompliant
ECCN codeEAR99
Minimum breakdown voltage6 V
ConfigurationCOMMON BIPOLAR TERMINAL, 5 ELEMENTS
Diode component materialsSILICON
Diode typeTRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 codeR-XBCC-N6
JESD-609 codee0
Maximum non-repetitive peak reverse power dissipation250 W
Number of components5
Number of terminals6
Maximum operating temperature150 °C
Minimum operating temperature-55 °C
Package body materialUNSPECIFIED
Package shapeRECTANGULAR
Package formCHIP CARRIER
Peak Reflow Temperature (Celsius)245
polarityBIDIRECTIONAL
Certification statusNot Qualified
surface mountYES
technologyAVALANCHE
Terminal surfaceTIN LEAD
Terminal formNO LEAD
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED

U0406FC05C-T710-2 Preview

05160
U0406FC3.3C
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. . . engineered solutions for the transient environment™
U0406FC36C
BIDIRECTIONAL UNBUMPED FLIP CHIP
APPLICA
TIONS
Cellular Phones
MCM Boards
Wireless Communication Circuits
IR LEDs
SMART Cards & PCMCIA Cards
IEC COMPA
TIBILITY
(EN61000-4)
61000-4-2 (ESD): Air - 15kV, Contact - 8kV
61000-4-4 (EFT): 40A - 5/50ns
FEA
TURES
ESD Protection > 25 kilovolts
Available in Multiple Voltage Types Ranging From 3.3V to 36V
250 Watts Peak Pulse Power per Line (8/20µs)
Monolithic Structure
MECHANICAL CHARACTERISTICS
Standard EIA Chip Size: 0406
Weight 0.73 milligrams (Approximate)
Flammability Rating UL 94V-0
8mm Plastic & Paper Tape and Reel Per EIA Standard 481
Device Marking On Reel
CIRCUIT DIAGRAM
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DEVICE CHARACTERISTICS
MAXIMUM RATINGS @ 25°C Unless Otherwise Specified
PARAMETER
Peak Pulse Power (t
p
= 8/20µs) - See Figure 1
Operating Temperature
Storage Temperature
SYMBOL
P
PP
T
J
T
STG
VALUE
250
-55°C to 150°C
-55°C to 150°C
UNITS
Watts
°C
°C
ELECTRICAL CHARACTERISTICS PER LINE @ 25°C Unless Otherwise Specified
PART
NUMBER
(See Note 1)
RATED
STAND-OFF
VOLTAGE
MINIMUM
BREAKDOWN
VOLTAGE
MAXIMUM
CLAMPING
VOLTAGE
(See Fig. 2)
@ I
P
= 1A
V
C
VOLTS
7.0
9.8
13.4
19.0
24.0
43.0
64.0
MAXIMUM
CLAMPING
VOLTAGE
(See Fig. 2)
MAXIMUM
LEAKAGE
CURRENT
TYPICAL
CAPACITANCE
V
WM
VOLTS
U0406FC3.3C
U0406FC05C
U0406FC08C
U0406FC12C
U0406FC15C
U0406FC24C
U0406FC36C
3.3
5.0
8.0
12.0
15.0
24.0
36.0
@ 1mA
V
(BR)
VOLTS
4.0
6.0
8.5
13.3
16.7
26.7
40.0
@8/20µs
V
C
@ I
PP
12.5V @ 20A
14.7V @ 17A
19.2V @ 13A
29.7V @ 9.0A
35.7V @ 7.0A
55.0V @ 5.0A
84.0V @ 3.0A
@V
WM
I
D
µA
75
10
10
1
1
1
1
0V @ 1 MHz
C
pF
150
100
75
50
40
30
25
Note 1:
All devices are bidirectional. Electrical characteristics apply in both directions.
FIGURE 1
PEAK PULSE POWER VS PULSE TIME
10,000
I
PP
- Peak Pulse Current - % of I
PP
P
PP
- Peak Pulse Current - Watts
120
100
80
60
40
20
0
t
f
FIGURE 2
PULSE WAVE FORM
Peak Value I
PP
TEST
WAVEFORM
PARAMETERS
t
f
= 8µs
t
d
= 20µs
1,000
250W, 8/20µs Waveform
e
-t
100
t
d
= t I /2
PP
0
5
10
15
t - Time - µs
20
25
30
10
0.01
1
10
t
d
- Pulse Duration - µs
100
1,000
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GRAPHS
FIGURE 3
POWER DERATING CURVE
Peak Pulse Power
8/20µs
225°C
5-10 sec
60
200°C
Instantaneous
to 200°C
100
80
% Of Rated Power
FIGURE 4
REFLOW SOLDER PROFILE
40
20
Average Power
0
0
25
50
75
100
125
T
L
- Lead Temperature - °C
150
Pre-Heat
Time
Soldering
Time
Cool Down
Time
100°C
1-2 Minutes
to 150°C
1-2 Minutes to 25°C
Note:
This reflow profile does not take into account the printed circuit board (PCB) material
heating time. Additional time may be required for the preheat time and cool down time upon the
PCB or board material.
FIGURE 5
OVERSHOOT & CLAMPING VOLTAGE FOR U0406FC05C
40
5 Volts per Division
30
20
10
0
ESD Test Pulse - 12 kilovolt, 1/30ns (waveform)
FIGURE 6
TYPICAL CLAMPING VOLTAGE VS PEAK PULSE CURRENT FOR U0406FC05C
14
12
10
8
6
4
2
0
0
5
10
I
PP
- Peak Pulse Current - Amps
15
20
05160.R1 11/02
V
C
- Clamping Voltage - Volts
3
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PACKAGE OUTLINE & DIMENSIONS
PACKAGE OUTLINE
U0406
Picture Not Available
A
B
C
TOP
SIDE
PACKAGE DIMENSIONS
DIM
MILLIMETERS
INCHES
A
E
F
Metalized Die Contacts
0.56 NOM
0.86 NOM
0.99 ± 0.0254
0.15 SQ
1.5 ± 0.0254
0.406 NOM
0.022 NOM
0.034 NOM
0.039 ± 0.001
0.006 SQ
0.059 ± 0.001
0.016 NOM
B
C
E
END
I
F
I
MOUNTING PAD - Option 1
C
A
D
PAD DIMENSIONS
DIM Millimeters
A
C
D
E
F
G
H
I
0.51
0.30
0.46
0.20
0.15 SQ
0.71
0.99
0.51
Inches
0.020
0.012
0.018
0.008
0.006 SQ
0.028
0.039
0.020
NOTES:
1. Controlling dimensions in inches.
2. Decimal tolerances for mounting pad and
outline: .xxx ± 0.05mm (± 0.002”).
T
APE & REEL ORIENT TION
A
DIE
SOLDER
CONTACTS
E
NOTE:
Preferred:
Using 0.1mm (0.004”)
stencil.
H
G
I
Triple Die - 0406
F
SOLDER PADS
SOLDER PRINT
0.010” - 0.012” DIA.
SOLDER MASK
NOTE:
1. Top view of tape. Solder bumps are face
down in tape package.
06025 Rev 2 - 11/02
TAPE & REEL ORDERING INFORMATION:
Surface mount product is taped and reeled in accordance with EIA-481.
Plastic Tape:
7 Inch Reels - 5,000 pieces per reel. Ordering Suffix: -T75-1 (i.e., U0406FC05C-T75-1).
Paper Tape:
7 Inch Reels - 5,000 pieces per reel. Ordering Suffix: -T75-2 (i.e., U0406FC05C-T75-2).
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PACKAGE OUTLINE & DIMENSIONS
MOUNTING PAD LA
YOUT - Option 2
DIM
A
A
F
G
H
I
DIE
SOLDER
CONTACTS
PAD DIMENSIONS
Millimeters
0.51
0.15 SQ
0.71
0.99
0.51
Inches
0.020
0.006 SQ
0.028
0.039
0.020
COPPER CONTACTS
0.009” [0.23] DIA.
I
NOTES:
1. Controlling dimensions in
inches.
2. Decimal tolerances for
mounting pad and
outline:
.xxx ± 0.05mm (± 0.002”).
3.
Preferred:
Using 0.1mm (0.004”)
stencil.
H
G
SOLDER PRINT
0.014” [0.36] DIA.
SOLDER MASK
F
06025 Rev 2 - 11/02
COPYRIGHT © ProTek Devices 2003
SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without
notice (except JEDEC). DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that the final
judgement concerning selection and specifications is the buyer’s and that in furnishing engineering and technical assistance,
ProTek assumes no responsibility with respect to the selection or specifications of such products.
ProTek Devices
2929 South Fair Lane, Tempe, AZ 85282
Tel: 602-431-8101 Fax: 602-431-2288
E-Mail: sales@protekdevices.com
Web Site: www.protekdevices.com
05160.R1 11/02
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U0406FC05C-T710-2 Related Products

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Description Trans Voltage Suppressor Diode, 250W, Bidirectional, 5 Element, Silicon, FLIP CHIP-6 Trans Voltage Suppressor Diode, 250W, Bidirectional, 5 Element, Silicon, FLIP CHIP-6 Trans Voltage Suppressor Diode, 250W, 12V V(RWM), Bidirectional, 5 Element, Silicon, FLIP CHIP-6 Trans Voltage Suppressor Diode, 250W, 15V V(RWM), Bidirectional, 5 Element, Silicon, FLIP CHIP-6 Trans Voltage Suppressor Diode, 250W, Bidirectional, 5 Element, Silicon, FLIP CHIP-6 Trans Voltage Suppressor Diode, 250W, Bidirectional, 5 Element, Silicon, FLIP CHIP-6 Trans Voltage Suppressor Diode, 250W, Bidirectional, 5 Element, Silicon, FLIP CHIP-6
Is it lead-free? Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible
Maker ProTek Devices ProTek Devices ProTek Devices ProTek Devices ProTek Devices ProTek Devices ProTek Devices
Parts packaging code FLIP-CHIP FLIP-CHIP FLIP-CHIP FLIP-CHIP FLIP-CHIP FLIP-CHIP FLIP-CHIP
package instruction R-XBCC-N6 R-XBCC-N6 R-XBCC-N6 R-XBCC-N6 R-XBCC-N6 R-XBCC-N6 R-XBCC-N6
Contacts 6 6 6 6 6 6 6
Reach Compliance Code compliant compliant compliant compliant compliant compliant compliant
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Minimum breakdown voltage 6 V 8.5 V 13.3 V 16.7 V 26.7 V 4 V 40 V
Configuration COMMON BIPOLAR TERMINAL, 5 ELEMENTS COMMON BIPOLAR TERMINAL, 5 ELEMENTS COMMON BIPOLAR TERMINAL, 5 ELEMENTS COMMON BIPOLAR TERMINAL, 5 ELEMENTS COMMON BIPOLAR TERMINAL, 5 ELEMENTS COMMON BIPOLAR TERMINAL, 5 ELEMENTS COMMON BIPOLAR TERMINAL, 5 ELEMENTS
Diode component materials SILICON SILICON SILICON SILICON SILICON SILICON SILICON
Diode type TRANS VOLTAGE SUPPRESSOR DIODE TRANS VOLTAGE SUPPRESSOR DIODE TRANS VOLTAGE SUPPRESSOR DIODE TRANS VOLTAGE SUPPRESSOR DIODE TRANS VOLTAGE SUPPRESSOR DIODE TRANS VOLTAGE SUPPRESSOR DIODE TRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 code R-XBCC-N6 R-XBCC-N6 R-XBCC-N6 R-XBCC-N6 R-XBCC-N6 R-XBCC-N6 R-XBCC-N6
JESD-609 code e0 e0 e0 e0 e0 e0 e0
Maximum non-repetitive peak reverse power dissipation 250 W 250 W 250 W 250 W 250 W 250 W 250 W
Number of components 5 5 5 5 5 5 5
Number of terminals 6 6 6 6 6 6 6
Maximum operating temperature 150 °C 150 °C 150 °C 150 °C 150 °C 150 °C 150 °C
Minimum operating temperature -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C
Package body material UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form CHIP CARRIER CHIP CARRIER CHIP CARRIER CHIP CARRIER CHIP CARRIER CHIP CARRIER CHIP CARRIER
Peak Reflow Temperature (Celsius) 245 245 245 245 245 245 245
polarity BIDIRECTIONAL BIDIRECTIONAL BIDIRECTIONAL BIDIRECTIONAL BIDIRECTIONAL BIDIRECTIONAL BIDIRECTIONAL
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
surface mount YES YES YES YES YES YES YES
technology AVALANCHE AVALANCHE AVALANCHE AVALANCHE AVALANCHE AVALANCHE AVALANCHE
Terminal surface TIN LEAD TIN LEAD TIN LEAD TIN LEAD TIN LEAD TIN LEAD TIN LEAD
Terminal form NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
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