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LM358TP/NOPB

Description
IC DUAL OP-AMP, 9000 uV OFFSET-MAX, 1 MHz BAND WIDTH, PBGA8, LEAD FREE, MICRO, BUMP, SMD-8, Operational Amplifier
CategoryAnalog mixed-signal IC    Amplifier circuit   
File Size997KB,25 Pages
ManufacturerNational Semiconductor(TI )
Websitehttp://www.ti.com
Environmental Compliance
Stay tuned Parametric Compare

LM358TP/NOPB Overview

IC DUAL OP-AMP, 9000 uV OFFSET-MAX, 1 MHz BAND WIDTH, PBGA8, LEAD FREE, MICRO, BUMP, SMD-8, Operational Amplifier

LM358TP/NOPB Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerNational Semiconductor(TI )
Parts packaging codeBGA
package instructionFBGA, BGA8,3X3,20
Contacts8
Reach Compliance Codecompliant
ECCN codeEAR99
Amplifier typeOPERATIONAL AMPLIFIER
ArchitectureVOLTAGE-FEEDBACK
Maximum average bias current (IIB)0.05 µA
Maximum bias current (IIB) at 25C0.25 µA
Nominal Common Mode Rejection Ratio85 dB
frequency compensationYES
Maximum input offset voltage9000 µV
JESD-30 codeS-PBGA-B8
JESD-609 codee1
length1.285 mm
low-dissonanceNO
Humidity sensitivity level1
Negative supply voltage upper limit
Nominal Negative Supply Voltage (Vsup)
Number of functions2
Number of terminals8
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
encapsulated codeFBGA
Encapsulate equivalent codeBGA8,3X3,20
Package shapeSQUARE
Package formGRID ARRAY, FINE PITCH
method of packingTAPE AND REEL
Peak Reflow Temperature (Celsius)260
power supply+-1.5/+-15/3/30 V
Certification statusNot Qualified
Maximum slew rate2 mA
Supply voltage upper limit32 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyBIPOLAR
Temperature levelCOMMERCIAL
Terminal surfaceTin/Silver/Copper (Sn/Ag/Cu)
Terminal formBALL
Terminal pitch0.5 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature40
Nominal Uniform Gain Bandwidth1000 kHz
Minimum voltage gain15000
width1.285 mm

LM358TP/NOPB Related Products

LM358TP/NOPB LM358H/NOPB LM358N/NOPB LM358MX/NOPB LM358M/NOPB LM358AMX/NOPB LM358AM/NOPB LM358AN/NOPB LM358TPX/NOPB
Description IC DUAL OP-AMP, 9000 uV OFFSET-MAX, 1 MHz BAND WIDTH, PBGA8, LEAD FREE, MICRO, BUMP, SMD-8, Operational Amplifier IC DUAL OP-AMP, 9000 uV OFFSET-MAX, 1 MHz BAND WIDTH, MBCY8, METAL CAN, TO-5, 8 PIN, Operational Amplifier IC DUAL OP-AMP, 9000 uV OFFSET-MAX, 1 MHz BAND WIDTH, PDIP8, PLASTIC, DIP-8, Operational Amplifier IC DUAL OP-AMP, 9000 uV OFFSET-MAX, 1 MHz BAND WIDTH, PDSO8, SOIC-8, Operational Amplifier IC DUAL OP-AMP, 9000 uV OFFSET-MAX, 1 MHz BAND WIDTH, PDSO8, SOIC-8, Operational Amplifier IC DUAL OP-AMP, 5000 uV OFFSET-MAX, 1 MHz BAND WIDTH, PDSO8, SOIC-8, Operational Amplifier IC DUAL OP-AMP, 5000 uV OFFSET-MAX, 1 MHz BAND WIDTH, PDSO8, SOIC-8, Operational Amplifier IC DUAL OP-AMP, 5000 uV OFFSET-MAX, 1 MHz BAND WIDTH, PDIP8, PLASTIC, DIP-8, Operational Amplifier IC DUAL OP-AMP, 9000 uV OFFSET-MAX, 1 MHz BAND WIDTH, PBGA8, LEAD FREE, MICRO, BUMP, SMD-8, Operational Amplifier
Is it Rohs certified? conform to conform to conform to conform to conform to conform to conform to conform to conform to
Parts packaging code BGA BCY DIP SOIC SOIC SOIC SOIC DIP BGA
package instruction FBGA, BGA8,3X3,20 TO-5, CAN8,.2 DIP, DIP8,.3 SOP, SOP8,.25 SOP, SOP8,.25 SOP, SOP8,.25 SOP, SOP8,.25 DIP, DIP8,.3 FBGA, BGA8,3X3,20
Contacts 8 8 8 8 8 8 8 8 8
Reach Compliance Code compliant compliant compliant compliant compliant compliant compliant compliant compliant
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Amplifier type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Architecture VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK
Maximum average bias current (IIB) 0.05 µA 0.05 µA 0.05 µA 0.05 µA 0.05 µA 0.2 µA 0.2 µA 0.2 µA 0.05 µA
Maximum bias current (IIB) at 25C 0.25 µA 0.25 µA 0.25 µA 0.25 µA 0.25 µA 0.1 µA 0.1 µA 0.1 µA 0.25 µA
Nominal Common Mode Rejection Ratio 85 dB 85 dB 85 dB 85 dB 85 dB 85 dB 85 dB 85 dB 85 dB
frequency compensation YES YES YES YES YES YES YES YES YES
Maximum input offset voltage 9000 µV 9000 µV 9000 µV 9000 µV 9000 µV 5000 µV 5000 µV 5000 µV 9000 µV
JESD-30 code S-PBGA-B8 O-MBCY-W8 R-PDIP-T8 R-PDSO-G8 R-PDSO-G8 R-PDSO-G8 R-PDSO-G8 R-PDIP-T8 S-PBGA-B8
JESD-609 code e1 e1 e3 e3 e3 e3 e3 e3 e1
low-dissonance NO NO NO NO NO NO NO NO NO
Humidity sensitivity level 1 1 1 1 1 1 1 1 1
Number of functions 2 2 2 2 2 2 2 2 2
Number of terminals 8 8 8 8 8 8 8 8 8
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
Package body material PLASTIC/EPOXY METAL PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code FBGA TO-5 DIP SOP SOP SOP SOP DIP FBGA
Encapsulate equivalent code BGA8,3X3,20 CAN8,.2 DIP8,.3 SOP8,.25 SOP8,.25 SOP8,.25 SOP8,.25 DIP8,.3 BGA8,3X3,20
Package shape SQUARE ROUND RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR SQUARE
Package form GRID ARRAY, FINE PITCH CYLINDRICAL IN-LINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE IN-LINE GRID ARRAY, FINE PITCH
Peak Reflow Temperature (Celsius) 260 260 260 260 260 260 260 260 260
power supply +-1.5/+-15/3/30 V +-1.5/+-15/3/30 V +-1.5/+-15/3/30 V +-1.5/+-15/3/30 V +-1.5/+-15/3/30 V +-1.5/+-15/3/30 V +-1.5/+-15/3/30 V +-1.5/+-15/3/30 V +-1.5/+-15/3/30 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum slew rate 2 mA 2 mA 2 mA 2 mA 2 mA 2 mA 2 mA 2 mA 2 mA
Supply voltage upper limit 32 V 32 V 32 V 32 V 32 V 32 V 32 V 32 V 32 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES NO NO YES YES YES YES NO YES
technology BIPOLAR BIPOLAR BIPOLAR BIPOLAR BIPOLAR BIPOLAR BIPOLAR BIPOLAR BIPOLAR
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form BALL WIRE THROUGH-HOLE GULL WING GULL WING GULL WING GULL WING THROUGH-HOLE BALL
Terminal location BOTTOM BOTTOM DUAL DUAL DUAL DUAL DUAL DUAL BOTTOM
Maximum time at peak reflow temperature 40 40 40 40 40 40 40 40 40
Nominal Uniform Gain Bandwidth 1000 kHz 1000 kHz 1000 kHz 1000 kHz 1000 kHz 1000 kHz 1000 kHz 1000 kHz 1000 kHz
Minimum voltage gain 15000 25000 25000 15000 15000 25000 25000 25000 15000
Maker National Semiconductor(TI ) - - National Semiconductor(TI ) National Semiconductor(TI ) National Semiconductor(TI ) National Semiconductor(TI ) National Semiconductor(TI ) National Semiconductor(TI )
length 1.285 mm - 9.817 mm 4.9 mm 4.9 mm 4.9 mm 4.9 mm 9.817 mm 1.285 mm
method of packing TAPE AND REEL RAIL RAIL TAPE AND REEL RAIL TAPE AND REEL - RAIL TAPE AND REEL
Terminal pitch 0.5 mm - 2.54 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 2.54 mm 0.5 mm
width 1.285 mm - 7.62 mm 3.9 mm 3.9 mm 3.9 mm 3.9 mm 7.62 mm 1.285 mm
Minimum Common Mode Rejection Ratio - 65 dB 65 dB 65 dB 65 dB 65 dB 65 dB 65 dB -
Nominal slew rate - 0.1 V/us 0.1 V/us 0.1 V/us 0.1 V/us 0.1 V/us 0.1 V/us 0.1 V/us -
Maximum seat height - - 5.08 mm 1.75 mm 1.75 mm 1.75 mm 1.75 mm 5.08 mm -
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