REVISION AD
((No OF POSITIONS / 20) x .7875[20.003]) + .440[11.18] REF
C
QSE-XXX-01-X-D-EMX-XX
No OF POSITIONS
-020, -040, -060
**-080, **-100
(PER ROW)
LEAD STYLE
-01: .1380 [3.505]
OPTION
*
-GP: GUIDE POST (60 POS MAX)
(SEE FIG 2, SEE SHEET 2)
-TY: TRAY PACKAGING
* EM3-GP = NOT TOOLED
EDGE MOUNT THICKNESS
-EM2: .064[1.63] +/-.004 PCB
(USE QSE-20-01-D-EM2-XX & C-162-01-X)
-EM3:
(USE QSE-20-01-D-EM3-XX & C-162-02-X)
(SEE NOTE 10)
ROW SPECIFICATION
-D: DOUBLE (USE QSE-20-01-D-EMX-XX)
((No OF POSITIONS / 20) x .7875[20.003]) + .0100[.254] REF
19 EQ SPACES
@ .0315[.800]
DO NOT
SCALE FROM
THIS PRINT
02
.2850 7.239
REF
01
.022 0.57
REF
.625 15.88
REF
C
.118 3.00
.1750 4.445
REF
SEE NOTE 12
"A"
PLATING SPECIFICATION
PLATING THICKNESSES ARE FOR
SIGNAL PINS ONLY. FOR GROUND
PLANE THICKNESSES, SEE PP-T-1G13-XX-X.
-F: 3µ" FLASH SELECTIVE GOLD IN CONTACT
AREA MATTE TIN ON TAIL (SEE NOTE 6)
(USE C-162-XX-F & T-1G13-01-F)
'A'
-L: 10µ" LIGHT SELECTIVE GOLD IN CONTACT
AREA WITH MATTE TIN ON TAIL
(USE C-162-XX-L & T-1G13-01-L)
-H: 30µ" HEAVY GOLD IN CONTACT AREA
3µ" FLASH GOLD ON TAILS
(USE C-162-XX-H & T-1G13-01-G)
-TL: TIN/LEAD (90/10 5%) CONTACT AND TAIL
-S: 30µ" SELECTIVE GOLD IN CONTACT AREA,
MATTE TIN ON TAIL
C
(USE C-162-XX-S & T-1G13-01-L)
.1380±.0030 3.505±0.08
.165±.003 4.19±0.076
(SEE NOTE 5)
C
C
* = SEE NOTE 10
** = SEE NOTE 13
QSE-20-01-D-EM2-XX
C-162-01-X
No OF BANKS
QSE-20-01-D-EM3-XX
C-162-02-X
SEE TABLE 1
.120 3.05 REF
T-1G13-01-X
.238 6.05
REF
C
.155 3.92
REF
"A"
.006 0.15
REF
.7250 18.415
REF
.0660±.0030 1.676±0.08
.0920±.0030 2.338±0.08
C
.1200 3.048
REF
.0400 1.016 REF
FIG 1
.0315 0.800
REF
2 MAX SWAY
C
(EITHER DIRECTION)
-EM2:
.064[1.63] +/-.004 PCB
SECTION "A"-"A"
SECTION "A"-"A"
-EM3:
SEE NOTE 10
[DIFFERENT AS SHOWN, OTHERWISE
SAME AS -EM2 PCB THICKNESS]
NOTES:
1.
C
REPRESENTS A CRITICAL DIMENSION.
2. MINIMUM CONTACT RETENTION: 6 OZ
3. MINIMUM GROUND PLANE RETENTION: 8 OZ
4. PARTS ARE MOLD TO POSITION.
5. MAXIMUM VARIANCE OF .002[0.05]
6. -L PLATING CAN BE SUBSTITUTED FOR -F PLATING.
7. NOTE DELETED.
8. BOARD THICKNESS TO BE MEASURED FROM SOLDER
PAD TO SOLDER PAD.
9. SEE WWW.SAMTEC. COM/PROCESSING/
EDGEMOUNT_TECTALK/INDEX.HTM FOR INFORMATION ON
PROCESSING EDGEMOUNT PARTS TO BOARDS.
10. -EM3 IS NOT A STANDARD OFFERING; AVAILABLE AS AN ASP ONLY.
PLEASE CONTACT SAMTEC INTERCONNECT PROCESSING GROUP WITH
ORDER INQUIRIES
11. NOTE DELETED.
12. SIDE WALLS ARE RIBBED AS NECESSARY TO CONTROL BOW.
13. AVAILABLE FOR EXISTING CUSTOMERS ONLY.
.100 2.54 REF
.1400 3.556 REF
** = SEE NOTE 13
UNLESS OTHERWISE SPECIFIED,
DIMENSIONS ARE IN INCHES.
TOLERANCES ARE:
DECIMALS
PROPRIETARY NOTE
THIS DOCUMENT CONTAINS INFORMATION
CONFIDENTIAL AND PROPRIETARY TO
SAMTEC, INC. AND SHALL NOT BE REPRODUCED
OR TRANSFERRED TO OTHER DOCUMENTS OR
DISCLOSED TO OTHERS OR USED FOR ANY
PURPOSE OTHER THAN THAT WHICH IT WAS
OBTAINED WITHOUT THE EXPRESSED WRITTEN
CONSENT OF SAMTEC, INC.
.XX: .01[.3]
.XXX: .005[.13]
.XXXX: .0020[.051]
ANGLES
2
520 PARK EAST BLVD, NEW ALBANY, IN 47150
PHONE: 812-944-6733
FAX: 812-948-5047
e-Mail info@SAMTEC.com
code 55322
MATERIAL:
DO NOT SCALE DRAWING
SHEET SCALE: 1.375:1
DESCRIPTION:
INSULATOR: LCP, UL 94VO
-EM2 COLOR: BLACK
-EM3 COLOR: NATURAL
CONTACT & GROUND PLANE: PHOS BRONZE
F:\DWG\MISC\MKTG\QSE-XXX-01-X-D-EMX-XX-MKT.SLDDRW
.8mm EDGE MOUNT HS SOCKET ASSEMBLY
DWG. NO.
QSE-XXX-01-X-D-EMX-XX
5/24/2000
SHEET
1
OF
2
BY:
DEAN P
REVISION AD
-GP: GUIDE POST
(DIFFERENT AS SHOWN, OTHERWISE SAME AS FIG 1)
(60 POSITION MAX)
(ONLY AVAILABLE WITH -EM2 OPTION)
{(NO OF POSITIONS / 20) x .7875[20.003]} + 1.044[26.52] REF
.207 5.26 REF
C
FIG 2
"B"
"B"
{(NO OF POSITIONS / 20) x .7875[20.003])
+ .225[5.715) REF
.140 3.56 REF (TYP)
"C"
QSE-20-01-D-EMX-XX-GP
.070 1.78
REF
.417 10.59
REF
"C"
.235 5.96 REF
SECTION "B"-"B"
SECTION "C"-"C"
.008 0.19 MAX
CRITICAL DIMENSION INSPECTION INSTRUCTION TABLE
ASSEMBLY OPERATION
IN-PROCESS INSPECTION
DETAIL 'A'
SCALE 10 : 1
LINE WHERE ROUNDED TOP
OF CONTACT TRANSITIONS
TO STRAIGHT BEAM
FILL C-162-XX-X
FILL T-1G13-01-X
WHERE APPLICABLE *
C1, C2, C4*, C5*, C7, C8
C6
PROPRIETARY NOTE
THIS DOCUMENT CONTAINS INFORMATION
CONFIDENTIAL AND PROPRIETARY TO
SAMTEC, INC. AND SHALL NOT BE REPRODUCED
OR TRANSFERRED TO OTHER DOCUMENTS OR
DISCLOSED TO OTHERS OR USED FOR ANY
PURPOSE OTHER THAN THAT WHICH IT WAS
OBTAINED WITHOUT THE EXPRESSED WRITTEN
CONSENT OF SAMTEC, INC.
520 PARK EAST BLVD, NEW ALBANY, IN 47150
PHONE: 812-944-6733
FAX: 812-948-5047
e-Mail info@SAMTEC.com
code 55322
DESCRIPTION:
DWG. NO.
DO NOT SCALE DRAWING
SHEET SCALE: 2:1
.8mm EDGE MOUNT HS SOCKET ASSEMBLY
F:\DWG\MISC\MKTG\QSE-XXX-01-X-D-EMX-XX-MKT.SLDDRW
BY:
DEAN P
QSE-XXX-01-X-D-EMX-XX
5/24/2000
SHEET
2
OF
2
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