IC 32K X 8 STANDARD SRAM, 100 ns, PDSO28, 0.450 INCH, PLASTIC, SOP-28, Static RAM
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | Toshiba Semiconductor |
| Parts packaging code | SOIC |
| package instruction | SOP, SOP28,.5 |
| Contacts | 28 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Maximum access time | 100 ns |
| I/O type | COMMON |
| JESD-30 code | R-PDSO-G28 |
| JESD-609 code | e0 |
| length | 18.5 mm |
| memory density | 262144 bit |
| Memory IC Type | STANDARD SRAM |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 28 |
| word count | 32768 words |
| character code | 32000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | -20 °C |
| organize | 32KX8 |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | SOP |
| Encapsulate equivalent code | SOP28,.5 |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | 240 |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum seat height | 2.7 mm |
| Maximum standby current | 0.00005 A |
| Minimum standby current | 2 V |
| Maximum slew rate | 0.07 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 8.8 mm |
| TC55257BFL-10(LT) | TC55257BPL-85(LT) | TC55257BFL-85(LT) | TC55257BFTL-85(LT) | TC55257BTRL-10(LT) | TC55257BPL-10(LT) | TC55257BSPL-10(LT) | TC55257BFTL-10(LT) | TC55257BSPL-85(LT) | TC55257BTRL-85(LT) | |
|---|---|---|---|---|---|---|---|---|---|---|
| Description | IC 32K X 8 STANDARD SRAM, 100 ns, PDSO28, 0.450 INCH, PLASTIC, SOP-28, Static RAM | IC 32K X 8 STANDARD SRAM, 85 ns, PDIP28, 0.600 INCH, PLASTIC, DIP-28, Static RAM | IC 32K X 8 STANDARD SRAM, 85 ns, PDSO28, 0.450 INCH, PLASTIC, SOP-28, Static RAM | IC 32K X 8 STANDARD SRAM, 85 ns, PDSO28, PLASTIC, TSOP-28, Static RAM | IC 32K X 8 STANDARD SRAM, 100 ns, PDSO28, PLASTIC, REVERSE, TSOP-28, Static RAM | IC 32K X 8 STANDARD SRAM, 100 ns, PDIP28, 0.600 INCH, PLASTIC, DIP-28, Static RAM | IC 32K X 8 STANDARD SRAM, 100 ns, PDIP28, 0.300 INCH, PLASTIC, DIP-28, Static RAM | IC 32K X 8 STANDARD SRAM, 100 ns, PDSO28, PLASTIC, TSOP-28, Static RAM | IC 32K X 8 STANDARD SRAM, 85 ns, PDIP28, 0.300 INCH, PLASTIC, DIP-28, Static RAM | IC 32K X 8 STANDARD SRAM, 85 ns, PDSO28, PLASTIC, REVERSE, TSOP-28, Static RAM |
| Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Parts packaging code | SOIC | DIP | SOIC | TSOP | TSOP | DIP | DIP | TSOP | DIP | TSOP |
| package instruction | SOP, SOP28,.5 | DIP, DIP28,.6 | SOP, SOP28,.5 | TSOP1, TSSOP28,.53,22 | TSOP1-R, TSSOP28,.53,22 | DIP, DIP28,.6 | DIP, DIP28,.1 | PLASTIC, TSOP-28 | DIP, DIP28,.1 | TSOP1-R, TSSOP28,.53,22 |
| Contacts | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknow |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Maximum access time | 100 ns | 85 ns | 85 ns | 85 ns | 100 ns | 100 ns | 100 ns | 100 ns | 85 ns | 85 ns |
| I/O type | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 code | R-PDSO-G28 | R-PDIP-T28 | R-PDSO-G28 | R-PDSO-G28 | R-PDSO-G28 | R-PDIP-T28 | R-PDIP-T28 | R-PDSO-G28 | R-PDIP-T28 | R-PDSO-G28 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| length | 18.5 mm | 37 mm | 18.5 mm | 11.8 mm | 11.8 mm | 37 mm | 34.9 mm | 11.8 mm | 34.9 mm | 11.8 mm |
| memory density | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bi |
| Memory IC Type | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| memory width | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
| word count | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words |
| character code | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| Minimum operating temperature | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C |
| organize | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | SOP | DIP | SOP | TSOP1 | TSOP1-R | DIP | DIP | TSOP1 | DIP | TSOP1-R |
| Encapsulate equivalent code | SOP28,.5 | DIP28,.6 | SOP28,.5 | TSSOP28,.53,22 | TSSOP28,.53,22 | DIP28,.6 | DIP28,.1 | TSSOP28,.53,22 | DIP28,.1 | TSSOP28,.53,22 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | IN-LINE | IN-LINE | SMALL OUTLINE, THIN PROFILE | IN-LINE | SMALL OUTLINE, THIN PROFILE |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Peak Reflow Temperature (Celsius) | 240 | 240 | 240 | 240 | 240 | 240 | 240 | 240 | 240 | 240 |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 2.7 mm | 5.3 mm | 2.7 mm | 1.2 mm | 1.2 mm | 5.3 mm | 4.45 mm | 1.2 mm | 4.45 mm | 1.2 mm |
| Maximum standby current | 0.00005 A | 0.00005 A | 0.00005 A | 0.00005 A | 0.00005 A | 0.00005 A | 0.00005 A | 0.00005 A | 0.00005 A | 0.00005 A |
| Minimum standby current | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V |
| Maximum slew rate | 0.07 mA | 0.07 mA | 0.07 mA | 0.07 mA | 0.07 mA | 0.07 mA | 0.07 mA | 0.07 mA | 0.07 mA | 0.07 mA |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | NO | YES | YES | YES | NO | NO | YES | NO | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | THROUGH-HOLE | THROUGH-HOLE | GULL WING | THROUGH-HOLE | GULL WING |
| Terminal pitch | 1.27 mm | 2.54 mm | 1.27 mm | 0.55 mm | 0.55 mm | 2.54 mm | 2.54 mm | 0.55 mm | 2.54 mm | 0.55 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | 8.8 mm | 15.24 mm | 8.8 mm | 8 mm | 8 mm | 15.24 mm | 7.62 mm | 8 mm | 7.62 mm | 8 mm |
| Maker | Toshiba Semiconductor | Toshiba Semiconductor | Toshiba Semiconductor | Toshiba Semiconductor | - | - | Toshiba Semiconductor | Toshiba Semiconductor | Toshiba Semiconductor | Toshiba Semiconductor |