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TC55257BFTL-10(LT)

Description
IC 32K X 8 STANDARD SRAM, 100 ns, PDSO28, PLASTIC, TSOP-28, Static RAM
Categorystorage    storage   
File Size186KB,7 Pages
ManufacturerToshiba Semiconductor
Websitehttp://toshiba-semicon-storage.com/
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TC55257BFTL-10(LT) Overview

IC 32K X 8 STANDARD SRAM, 100 ns, PDSO28, PLASTIC, TSOP-28, Static RAM

TC55257BFTL-10(LT) Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerToshiba Semiconductor
Parts packaging codeTSOP
package instructionPLASTIC, TSOP-28
Contacts28
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum access time100 ns
I/O typeCOMMON
JESD-30 codeR-PDSO-G28
JESD-609 codee0
length11.8 mm
memory density262144 bit
Memory IC TypeSTANDARD SRAM
memory width8
Number of functions1
Number of terminals28
word count32768 words
character code32000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature-20 °C
organize32KX8
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeTSOP1
Encapsulate equivalent codeTSSOP28,.53,22
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)240
power supply5 V
Certification statusNot Qualified
Maximum seat height1.2 mm
Maximum standby current0.00005 A
Minimum standby current2 V
Maximum slew rate0.07 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch0.55 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width8 mm

TC55257BFTL-10(LT) Related Products

TC55257BFTL-10(LT) TC55257BPL-85(LT) TC55257BFL-85(LT) TC55257BFTL-85(LT) TC55257BTRL-10(LT) TC55257BPL-10(LT) TC55257BSPL-10(LT) TC55257BFL-10(LT) TC55257BSPL-85(LT) TC55257BTRL-85(LT)
Description IC 32K X 8 STANDARD SRAM, 100 ns, PDSO28, PLASTIC, TSOP-28, Static RAM IC 32K X 8 STANDARD SRAM, 85 ns, PDIP28, 0.600 INCH, PLASTIC, DIP-28, Static RAM IC 32K X 8 STANDARD SRAM, 85 ns, PDSO28, 0.450 INCH, PLASTIC, SOP-28, Static RAM IC 32K X 8 STANDARD SRAM, 85 ns, PDSO28, PLASTIC, TSOP-28, Static RAM IC 32K X 8 STANDARD SRAM, 100 ns, PDSO28, PLASTIC, REVERSE, TSOP-28, Static RAM IC 32K X 8 STANDARD SRAM, 100 ns, PDIP28, 0.600 INCH, PLASTIC, DIP-28, Static RAM IC 32K X 8 STANDARD SRAM, 100 ns, PDIP28, 0.300 INCH, PLASTIC, DIP-28, Static RAM IC 32K X 8 STANDARD SRAM, 100 ns, PDSO28, 0.450 INCH, PLASTIC, SOP-28, Static RAM IC 32K X 8 STANDARD SRAM, 85 ns, PDIP28, 0.300 INCH, PLASTIC, DIP-28, Static RAM IC 32K X 8 STANDARD SRAM, 85 ns, PDSO28, PLASTIC, REVERSE, TSOP-28, Static RAM
Is it lead-free? Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible
Parts packaging code TSOP DIP SOIC TSOP TSOP DIP DIP SOIC DIP TSOP
package instruction PLASTIC, TSOP-28 DIP, DIP28,.6 SOP, SOP28,.5 TSOP1, TSSOP28,.53,22 TSOP1-R, TSSOP28,.53,22 DIP, DIP28,.6 DIP, DIP28,.1 SOP, SOP28,.5 DIP, DIP28,.1 TSOP1-R, TSSOP28,.53,22
Contacts 28 28 28 28 28 28 28 28 28 28
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown unknown unknow
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Maximum access time 100 ns 85 ns 85 ns 85 ns 100 ns 100 ns 100 ns 100 ns 85 ns 85 ns
I/O type COMMON COMMON COMMON COMMON COMMON COMMON COMMON COMMON COMMON COMMON
JESD-30 code R-PDSO-G28 R-PDIP-T28 R-PDSO-G28 R-PDSO-G28 R-PDSO-G28 R-PDIP-T28 R-PDIP-T28 R-PDSO-G28 R-PDIP-T28 R-PDSO-G28
JESD-609 code e0 e0 e0 e0 e0 e0 e0 e0 e0 e0
length 11.8 mm 37 mm 18.5 mm 11.8 mm 11.8 mm 37 mm 34.9 mm 18.5 mm 34.9 mm 11.8 mm
memory density 262144 bit 262144 bit 262144 bit 262144 bit 262144 bit 262144 bit 262144 bit 262144 bit 262144 bit 262144 bi
Memory IC Type STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM
memory width 8 8 8 8 8 8 8 8 8 8
Number of functions 1 1 1 1 1 1 1 1 1 1
Number of terminals 28 28 28 28 28 28 28 28 28 28
word count 32768 words 32768 words 32768 words 32768 words 32768 words 32768 words 32768 words 32768 words 32768 words 32768 words
character code 32000 32000 32000 32000 32000 32000 32000 32000 32000 32000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
Minimum operating temperature -20 °C -20 °C -20 °C -20 °C -20 °C -20 °C -20 °C -20 °C -20 °C -20 °C
organize 32KX8 32KX8 32KX8 32KX8 32KX8 32KX8 32KX8 32KX8 32KX8 32KX8
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSOP1 DIP SOP TSOP1 TSOP1-R DIP DIP SOP DIP TSOP1-R
Encapsulate equivalent code TSSOP28,.53,22 DIP28,.6 SOP28,.5 TSSOP28,.53,22 TSSOP28,.53,22 DIP28,.6 DIP28,.1 SOP28,.5 DIP28,.1 TSSOP28,.53,22
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE IN-LINE SMALL OUTLINE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE IN-LINE IN-LINE SMALL OUTLINE IN-LINE SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 240 240 240 240 240 240 240 240 240 240
power supply 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.2 mm 5.3 mm 2.7 mm 1.2 mm 1.2 mm 5.3 mm 4.45 mm 2.7 mm 4.45 mm 1.2 mm
Maximum standby current 0.00005 A 0.00005 A 0.00005 A 0.00005 A 0.00005 A 0.00005 A 0.00005 A 0.00005 A 0.00005 A 0.00005 A
Minimum standby current 2 V 2 V 2 V 2 V 2 V 2 V 2 V 2 V 2 V 2 V
Maximum slew rate 0.07 mA 0.07 mA 0.07 mA 0.07 mA 0.07 mA 0.07 mA 0.07 mA 0.07 mA 0.07 mA 0.07 mA
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES NO YES YES YES NO NO YES NO YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form GULL WING THROUGH-HOLE GULL WING GULL WING GULL WING THROUGH-HOLE THROUGH-HOLE GULL WING THROUGH-HOLE GULL WING
Terminal pitch 0.55 mm 2.54 mm 1.27 mm 0.55 mm 0.55 mm 2.54 mm 2.54 mm 1.27 mm 2.54 mm 0.55 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 8 mm 15.24 mm 8.8 mm 8 mm 8 mm 15.24 mm 7.62 mm 8.8 mm 7.62 mm 8 mm
Maker Toshiba Semiconductor Toshiba Semiconductor Toshiba Semiconductor Toshiba Semiconductor - - Toshiba Semiconductor Toshiba Semiconductor Toshiba Semiconductor Toshiba Semiconductor
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