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ECM2A4E1A10-24.000MTR

Description
QUARTZ CRYSTAL RESONATOR, 24 MHz, ROHS COMPLIANT, CERAMIC, SMD, 4 PIN
CategoryPassive components    Crystal/resonator   
File Size154KB,5 Pages
ManufacturerECLIPTEK
Websitehttp://www.ecliptek.com
Environmental Compliance  
Download Datasheet Parametric View All

ECM2A4E1A10-24.000MTR Overview

QUARTZ CRYSTAL RESONATOR, 24 MHz, ROHS COMPLIANT, CERAMIC, SMD, 4 PIN

ECM2A4E1A10-24.000MTR Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerECLIPTEK
package instructionROHS COMPLIANT, CERAMIC, SMD, 4 PIN
Reach Compliance Codecompliant
Other featuresAT-CUT CRYSTAL; TAPE AND REEL
Ageing3 PPM/YEAR
Crystal/Resonator TypePARALLEL - FUNDAMENTAL
Drive level100 µW
frequency stability0.0015%
frequency tolerance15 ppm
JESD-609 codee4
load capacitance10 pF
Manufacturer's serial numberECM2A
Installation featuresSURFACE MOUNT
Nominal operating frequency24 MHz
Maximum operating temperature70 °C
Minimum operating temperature
physical sizeL2.5XB2.0XH0.55 (mm)/L0.098XB0.079XH0.022 (inch)
Series resistance80 Ω
surface mountYES
Terminal surfaceNickel/Gold (Ni/Au)

ECM2A4E1A10-24.000MTR Preview

ECM2A4E1A10-24.000M TR
Series
RoHS Compliant (Pb-free) 2.0mm x 2.5mm 4 Pad
Ceramic SMD Crystal
Frequency Tolerance
±15ppm Maximum
Frequency Stability
±15ppm Maximum
Operating Temperature Range
0°C to +70°C
RoHS
Pb
Packaging Options
Tape & Reel
ECM2A 4 E 1 A 10 -24.000M TR
Nominal Frequency
24.000MHz
Load Capacitance
10pF Parallel Resonant
Mode of Operation
AT-Cut Fundamental
ELECTRICAL SPECIFICATIONS
Nominal Frequency
Frequency Tolerance
Frequency Stability
Aging at 25°C
Operating Temperature Range
Load Capacitance
Shunt Capacitance (C0)
Equivalent Series Resistance
Mode of Operation
Drive Level
Spurious Response
Storage Temperature Range
Insulation Resistance
24.000MHz
±15ppm Maximum
±15ppm Maximum
±3ppm/year Maximum
0°C to +70°C
10pF Parallel Resonant
5pF Maximum
80 Ohms Maximum
AT-Cut Fundamental
100µWatts Maximum
-3dB Minimum; Fo to Fo +5000ppm
-40°C to +90°C
500 Megaohms Minimum at 100Vdc
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
ESD Susceptibility
Fine Leak Test
Flammability
Gross Leak Test
Mechanical Shock
Moisture Resistance
Moisture Sensitivity
Resistance to Soldering Heat
Resistance to Solvents
Solderability
Temperature Cycling
Vibration
MIL-STD-883, Method 3015, Class 1, HBM: 1500V
MIL-STD-883, Method 1014, Condition A
UL94-V0
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 1004
J-STD-020, MSL 1
MIL-STD-202, Method 210, Condition K
MIL-STD-202, Method 215
MIL-STD-883, Method 2003
MIL-STD-883, Method 1010, Condition B
MIL-STD-883, Method 2007, Condition A
www.ecliptek.com | Specification Subject to Change Without Notice | Rev B 3/11/2011 | Page 1 of 5
ECM2A4E1A10-24.000M TR
MECHANICAL DIMENSIONS (all dimensions in millimeters)
PIN
1
CONNECTION
Crystal
Cover/Ground
Crystal
Cover/Ground
2.00
±0.10
MARKING
ORIENTATION
0.65 ±0.10
4
1
0.95
±0.10
3
2
0.675 ±0.100
(X4)
2
0.775
±0.100
(X4)
3
4
LINE MARKING
1
2
24.0
YZZ
Y=Last Digit of Year
ZZ=Week of the Year
2.50
±0.10
0.55 MAX
Suggested Solder Pad Layout
All Dimensions in Millimeters
1.0 (X4)
1.2 (X4)
0.5
Solder Land
(X4)
0.3
All Tolerances are ±0.1
www.ecliptek.com | Specification Subject to Change Without Notice | Rev B 3/11/2011 | Page 2 of 5
ECM2A4E1A10-24.000M TR
Tape & Reel Dimensions
Quantity Per Reel: 1000 Units
4.00 ±0.10
2.00 ±0.10
DIA 1.50 ±0.10
0.25 ±0.05
3.50 ±0.10
8.00 ±0.20
4.50 ±0.10
2.80
±0.10
4.00 ±0.10
*Compliant to EIA 481A
2.30 ±0.10
1.00 ±0.10
1.5 MIN
DIA 40 MIN
Access Hole at
Slot Location
14.4 MAX
330 MAX
DIA 50 MIN
DIA 20.2 MIN
2.5 MIN Width
10.0 MIN Depth
Tape slot in Core
for Tape Start
8.4 +1.5/-0.0
DIA 13.0 ±0.2
www.ecliptek.com | Specification Subject to Change Without Notice | Rev B 3/11/2011 | Page 3 of 5
ECM2A4E1A10-24.000M TR
Recommended Solder Reflow Methods
T
P
Critical Zone
T
L
to T
P
Ramp-up
Ramp-down
Temperature (T)
T
L
T
S
Max
T
S
Min
t
S
Preheat
t 25°C to Peak
t
L
t
P
Time (t)
High Temperature Infrared/Convection
T
S
MAX to T
L
(Ramp-up Rate)
Preheat
- Temperature Minimum (T
S
MIN)
- Temperature Typical (T
S
TYP)
- Temperature Maximum (T
S
MAX)
- Time (t
S
MIN)
Ramp-up Rate (T
L
to T
P
)
Time Maintained Above:
- Temperature (T
L
)
- Time (t
L
)
Peak Temperature (T
P
)
Target Peak Temperature (T
P
Target)
Time within 5°C of actual peak (t
p
)
Ramp-down Rate
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
3°C/second Maximum
150°C
175°C
200°C
60 - 180 Seconds
3°C/second Maximum
217°C
60 - 150 Seconds
260°C Maximum for 10 Seconds Maximum
250°C +0/-5°C
20 - 40 seconds
6°C/second Maximum
8 minutes Maximum
Level 1
www.ecliptek.com | Specification Subject to Change Without Notice | Rev B 3/11/2011 | Page 4 of 5
ECM2A4E1A10-24.000M TR
Recommended Solder Reflow Methods
T
P
Critical Zone
T
L
to T
P
Ramp-up
Ramp-down
Temperature (T)
T
L
T
S
Max
T
S
Min
t
S
Preheat
t 25°C to Peak
t
L
t
P
Time (t)
Low Temperature Infrared/Convection 240°C
T
S
MAX to T
L
(Ramp-up Rate)
Preheat
- Temperature Minimum (T
S
MIN)
- Temperature Typical (T
S
TYP)
- Temperature Maximum (T
S
MAX)
- Time (t
S
MIN)
Ramp-up Rate (T
L
to T
P
)
Time Maintained Above:
- Temperature (T
L
)
- Time (t
L
)
Peak Temperature (T
P
)
Target Peak Temperature (T
P
Target)
Time within 5°C of actual peak (t
p
)
Ramp-down Rate
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
5°C/second Maximum
N/A
150°C
N/A
60 - 120 Seconds
5°C/second Maximum
150°C
200 Seconds Maximum
240°C Maximum
240°C Maximum 1 Time / 230°C Maximum 2 Times
10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time
5°C/second Maximum
N/A
Level 1
Low Temperature Manual Soldering
185°C Maximum for 10 seconds Maximum, 2 times Maximum.
High Temperature Manual Soldering
260°C Maximum for 5 seconds Maximum, 2 times Maximum.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev B 3/11/2011 | Page 5 of 5
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