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NCSS12-R008TRF

Description
Current Sensing Chip Resistors
File Size84KB,6 Pages
ManufacturerNIC
Websitehttps://www.niccomp.com
Download Datasheet View All

NCSS12-R008TRF Overview

Current Sensing Chip Resistors

Current Sensing Chip Resistors
FEATURES
SURFACE MOUNTABLE 0805, 1206, 2010 AND 2512 CASE SIZE
LOW RESISTANCE METAL STRIP CONSTRUCTION
PRECISON TOLERANCE (±1%)
TAPED & REEL PACKAGING FOR EASY PICK AND PLACE
REFLOW COMPATIBLE
Resistance
Tolerance
(Code)
NCSS Series
includes all homogeneous materials
RoHS
Compliant
SPECIFICATIONS
Type
EIA
Size
Power Rating
at 70°C
1/8W (B)
NCSS10
0805
1/4W (A)
1/2W (S)
1/4W (A)
NCSS12
1206
1/2W (S)
1W (C)
1/2W (S)
NCSS20
2010
3/4W (I)
1W (C)
1.5W (D)
1W (C)
NCSS25
2512
1.5W (D)
2W (E)
±1% (F)
±2% (G)
±5% (J)
See Part Number System for Details
Resistance
Range*
Operating
Temperature
Range (°C)
Temperature Coefficient
(ppm/°C, +25°C ~ +125°C)
±100ppm
5mΩ ~ 20mΩ
1mΩ = ±200ppm
2mΩ ~ 10mΩ = ±100ppm
>10mΩ = ±75ppm
1mΩ ~ 30mΩ
-55°C ~ +170°C
5mΩ ~ 10mΩ = ±100ppm
>10mΩ = ±75ppm
5mΩ ~ 20mΩ
1mΩ = ±275ppm
2mΩ ~ 10mΩ = ±100ppm
>10mΩ = ±75ppm
1mΩ ~ 50mΩ
1mΩ ~ 15mΩ
1mΩ ~ 10mΩ
*Contact NIC regarding availability of values not shown
ENVIRONMENTAL CHARACTERISTICS
Item
Temperature Coefficient
of Resistance
Load Life
Short Time Overload
Moisture Resistance
(no load)
Temperature Cycling
<±1%
<±0.5%
<±1%
<±0.5%
0805
Specification
1206
2010
Within specified value
<±1%
<±0.5%
<±1.0%
<±0.5%
<±0.5%
<±1%
<±0.5%
<±1%
<±0.5%
<±0.5%
<±1%
<±0.5%
<±1%
<±0.5%
<±0.5%
2512
Test Method
+25°C ~ +125°C
1,000 hours at rated power, +70°C, 1.5 hours
ON, 0.5 hours OFF
5 x rated power for 5 seconds
+85°C, 85% RH, 1000 hours
-55°C & +155°C, 300 cycles,
15 minutes at each temperature
+260°C ± 5°C for 10 sec. ±1 sec.,Two cycles
(20 sec. ±1 sec. for 2512 size)
+245°C ± 5°C, 2 sec. ± 0.5sec.
+170°C for 1,000 hours
-55°C for 1,000 hours
Bending within 2mm
100VDC for 1 minute
Reference Standard
IEC60115-1 4.8
JIS-C5201 4.8
IEC60115-1 4.25.1
JIS-C5201 4.25.1
IEC60115-1 4.13
JIS-C5201 4.13
IEC60115-1 4.24.2 1a
JIS-C5201 4.24.2 1a
IEC60115-1 4.19
JIS-C5201 4.19
IEC60115-1 4.18
JIS-C5201 4.18
IEC60115-1 4.17
JIS-C5201 4.17
IEC60115-1 4.23.2
JIS-C5201 4.23.2
IEC60115-1 4.23.4
JIS-C5201 4.23.4
IEC60115-1 4.33
JIS-C5201 4.33
IEC60115-1 4.6
JIS-C5201 4.6
Resistance to Soldering Heat <±0.5%
Solderability
High Temperature Exposure
Low Temperature Storage
Substrate Bending
Insulation Resistance
At least 95% coverage of electrode
surface
<±1%
<±0.5%
<±1%
<±1%
<±0.5%
<±0.5%
<±1%
<±0.5%
<±0.5%
<±1%
<±0.5%
<±0.5%
>100MΩ
NIC COMPONENTS CORP.
www.niccomp.com
www.lowESR.com
www.RFpassives.com
www.SMTmagnetics.com
SPECIFICATIONS ARE SUBJECT TO CHANGE
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