The documentation and process conversion
measures necessary to comply with this
revision shall be completed by 20 September 1997
INCH POUND
MIL-PRF-19500/124H
20 June 1997
SUPERSEDING
MIL-S-19500/124G
15 October 1992
PERFORMANCE SPECIFICATION
SEMICONDUCTOR DEVICE, DIODE, SILICON, VOLTAGE REGULATOR B AND RB
TYPES 1N2970 THROUGH 1N2977, 1N2979, 1N2980, 1N2982, 1N2984
THROUGH 1N2986, 1N2988 THROUGH 1N2993, 1N2995, 1N2997, 1N2999
THROUGH 1N3005, 1N3007, 1N3008, 1N3009, 1N3011, 1N3012, 1N3014, 1N3015,
PLUS A AND RA TYPES 1N3993 THROUGH 1N3998, JAN, JANTX, JANTXV, AND JANS
This specification is approved for use by all Depart-
ments and Agencies of the Department of Defense.
1. SCOPE
1.1 Scope. This specification covers the performance requirements for 10 watt, silicon, voltage regulator diodes: B type (standard
polarity); RB type (reverse polarity). Four levels of product assurance are provided for each encapsulated device type as specified in
MIL-PRF-19500.
1.2 Physical dimensions. See figure 1 (D0-4).
1.3 Maximum ratings. Maximum ratings are as shown in columns 4, 8, and 10 of table III herein and as follows:
-65°C
≤
T
J
≤+175°C;
P
T
= 10 W at T
C
= +55°C; derate at .083 W/°C above +55°C.
-65°C
≤
T
STG
≤
+200°C.
1.4 Primary electrical characteristics. Primary electrical characteristics are as shown in columns 2, 9, 12, and 14 of table III herein,
and as follows:
Thermal resistance (R
θ
JC
) = 12°C/W maximum.
Beneficial comments (recommendations, additions, deletions) and any pertinent data which may be of use in improving this document
should be addressed to: Commander, Defense Supply Center Columbus, ATTN: DSCC-VAT, 3990 East Broad Street, Columbus, OH
43216-5000, by using the Standardization Document Improvement Proposal (DD Form 1426) appearing at the end of this document or
by letter.
AMSC N/A
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
FSC 5961
MIL-PRF-19500/124H
2. APPLICABLE DOCUMENTS
2.1 General. The documents listed in this section are specified in sections 3 and 4 of this specification. This section does not include
documents cited in other sections of this specification or recommended for additional information or as examples. While every effort has
been made to ensure the completeness of this list, document users are cautioned that they must meet all specified requirements
documents cited in sections 3 and 4 of this specification, whether or not they are listed.
2.2 Government documents.
2.2.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a part of this document
to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of the Department
of Defense Index of Specifications and Standards (DODISS) and supplement thereto, cited in the solicitation (see 6.2).
SPECIFICATION
DEPARTMENT OF DEFENSE
MIL-PRF-19500 - Semiconductor Devices, General Specification for.
STANDARD
MILITARY
MIL-STD-750 - Test Methods for Semiconductor Devices.
(Unless otherwise indicated, copies of the above specifications, standards, and handbooks are available from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.3 Order of precedence. In the event of a conflict between the text of this document and the references cited herein (except for
related associated specifications or specification sheets), the text of this document takes precedence. Nothing in this document,
however, supersedes applicable laws and regulations unless a specific exemption has been obtained.
3. REQUIREMENTS
3.1 Qualification. Devices furnished under this specification shall be products that are authorized by the qualifying activity for listing
on the applicable qualified products list before contract award (see 4.2 and 6.3).
3.2 Associated detail specification. The individual item performance requirements shall be in accordance with MIL-PRF-19500, and
as specified herein.
3.3 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein shall be as specified in
MIL-PRF-19500.
3.4 Design, construction, and physical dimensions. The design, construction, and physical dimensions for the purpose of
interchangeability shall be as specified on figure 1 herein.
a.
b.
Device types 1N2970B through 1N3015B and 1N3993RA through 1N3998RA shall have the anode connected to the stud.
Device types 1N2970RB through 1N3015RB and 1N3993A through 1N3998A shall have the cathode connected to the stud.
3.4.1 Lead finish. Unless otherwise specified, lead finish shall be solderable in accordance with MIL-PRF-19500, MIL-STD-750, and
herein. Lead finish shall be gold, silver, or tin plated. Where a choice of lead finish is desired, it shall be specified in the contract (see
6.2).
3.4.2 Diode construction. These devices shall be constructed in a manner and using materials which enable the diodes to meet the
applicable requirements of MIL-PRF-19500 and this document.
3.5 Marking. Devices shall be marked as specified in MIL-PRF-19500.
3.6 Reverse polarity. Reverse polarity units (see 3.3, a and b) shall be marked with an "R" preceding the "A" or "B" in the type
designation, as applicable.
2
MIL-PRF-19500/124H
FIGURE 1. Physical dimensions.
3
MIL-PRF-19500/124H
Symbol
CH
C
HF
HF
1
E
HT
HT
1
DAH
UD
SD
m
SL
SU
∅t
W
Dimensions
Inches
Min
.300
.012
----
.255
.423
.075
.060
.600
.163
----
----
.422
----
.060
----
Max
.405
.065
.505
.424
.438
.175
.175
.800
.189
----
.250
.453
.078
.095
----
Millimeters
Min
Max
7.62
10.29
0.30
1.65
----
12.83
6.48
10.77
10.74
11.13
1.90
4.44
1.52
4.44
15.24
20.32
4.14
4.80
----
----
----
6.35
10.72
11.51
----
1.98
1.52
2.41
----
----
Notes
2
1
5
3
4
NOTES:
1. Complete threads to extend to within 2.5 threads of seating plane.
2. Chamfer on undercut on one or both ends of hexagonal base is optional.
3. Angular orientation of this terminal is undefined.
4. Length of incomplete or undercut threads of UD.
5. 10-32- UNF-2A maximum pitch diameter of plated threads shall be basic pitch diameter .1697 (4.310 mm)
reference. (Screw thread standards for Federal Services 1957) Handbook H28 P1.
6. Metric equivalents are given for general information only.
7. Dimensions are in inches.
FIGURE 1. Physical dimensions. - Continued.
4
MIL-PRF-19500/124H
4. QUALITY ASSURANCE PROVISIONS
4.1 Classification of inspections. The inspection requirements specified herein are classified as follows:
a. Qualification inspection (see 4.2).
b. Screening (see 4.3)
c. Conformance inspection (see 4.4).
4.2 Qualification inspection. Qualification inspection shall be in accordance with MIL-PRF-19500.
4.3 Screening (JANS, JANTXV, JANTX levels only). Screening shall be in accordance with MIL-PRF-19500, appendix E, (table IV)
and as specified herein. The following measurements shall be made in accordance with table I herein. Devices that exceed the limits of
table I herein shall not be acceptable.
Screen (see
appendix E,
table IV of
MIL-PRF-19500)
7.(b)
9
11
12
13
Measurement
JANS level
JANTX and JANTXV levels
MIL-STD-750,
test method 1071,
MIL-STD-750,
test method 1071,
condition C, step 2
condition C, step 2
I
R
and V
Z
(for devices with
Not applicable
V
Z(nom)
≥
10 V dc; see column 2
of table III)
I
R
and V
Z
;
∆I
R
= 100 percent of
I
R
and V
Z
initial value or 1 of column 12 of
table III, whichever is greater,
∆V
Z
=
±
2.5 of initial value (for
devices with V
Z(nom)
≥
10 V dc,
see column 2 of table III)
See 4.2.1
See 4.2.1
Subgroups
2, 3, and 4 of table I
Subgroup
2 of table I herein;
∆I
R
herein;
∆I
R
= 100 percent of
= 100 percent of initial value
initial value or 1 of column 12 of
or 1 of column 12 of table III,
table III, whichever is greater;
whichever is greater;
∆V
Z
=
±
2.5 of initial value.
∆V
Z
=
±
2.5 of initial value
4.3.1 Power burn-in conditions. Power burn-in conditions are as follows:
I
Z
= Column 15 of table III; V
Z
= Column 2 of table III; T
C
= 150
±
5°C.
4.4 Conformance inspection. Conformance inspection shall be in accordance with MIL-PRF-19500.
4.4.1 Group A inspection. Group A inspection shall be conducted in accordance with appendix E, table V of MIL-PRF-19500 and
table I herein. End-point electrical measurements shall be in accordance with the applicable steps of table IV herein.
5
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