TransFeed
AVX Multilayer Ceramic Transient Voltage Suppressors
TVS Protection and EMI Attenuation in a Single 0805 Chip - V2F Series
GENERAL DESCRIPTION
AVX has combined the best electrical characteristics of its
TransGuard Transient Voltage Suppressors (TVS) and its
Feedthru Capacitors into a single chip for state-of-the-art
overvoltage circuit protection and EMI reduction over a
broad range of frequencies. This unique combination of
multilayer ceramic construction in a feedthru configuration
gives the circuit designer a single 0805 chip that responds
to transient events faster than any TVS device on the mar-
ket today, and provides significant EMI attenuation when in
the off-state.
The reduction in parallel inductance, typical of the feedthru
chip construction when compared to the construction of
standard TVS or ceramic capacitor chips, gives the
TransFeed product two very important electrical advan-
tages: (1) faster “turn-on” time. Calculated response times
of <200 pSec are not unusual with this device, and mea-
sured response times range from 200 – 250 pSec. The
TransFeed “turn-on” characteristic is less than half that of
an equivalent TransGuard part — and TransGuards clamp
transient voltages faster than any other bipolar TVS solution
such as diodes; (2) the second electrical advantage of
lower parallel inductance, coupled with optimal series
inductance, is the enhanced attenuation characteristics of
the TransFeed product. Not only is there significantly
greater attenuation at a higher self-resonance frequency,
Schematic Diagram
IN
OUT
Electrical Model
IN
L
S
R
V
L
S
C
R
ON
L
P
OUT
R
P
but the roll-off characteristic becomes much flatter, result-
ing in EMI filtering over a much broader frequency spec-
trum. Typical applications include filtering/protection on
Microcontroller I/O Lines, Interface I/O Lines, Power Line
Conditioning and Power Regulation.
Where designers are concerned with both transient voltage
protection and EMI attenuation, either due to the electrical
performance of their circuits or due to required compliance
to specific EMC regulations, the TransFeed product is an
ideal choice.
HOW TO ORDER
V
Varistor
2
F
Feedthru
Capacitor
1
05
Voltage
05 =
09 =
14 =
18 =
5.6V
9.0V
14.0V
18.0V
A
150
Varistor
Clamping
Voltage
150 = 15.5V
200 = 20.0V
300 = 30.0V
400 = 40.0V
500 = 50.0V
Y
2
DC
Resistance
1 = 0.150 Ohms
2 = 0.200 Ohms
3 = 0.250 Ohms
E
D
Packaging
Code
Pcs./Reel
D = 1,000
R = 4,000
T = 10,000
X
Chip Size
2 = 0805
No. of
Elements
Energy
Rating
X = 0.05J
A = 0.1J
C = 0.3J
Capacitance
Tolerance
Y = +100/-50%
Feedthru
Current
D = 500 mA
E = 750 mA
F = 1.0 Amp
Termination Finish
X = Pt/Pd/Ag
(Non-Plated)
P = Ni/Sn Alloy (Plated)
Contact Factory for Availability
20
TransFeed
AVX Multilayer Ceramic Transient Voltage Suppressors
TVS Protection and EMI Attenuation in a Single 0805 Chip - V2F Series
DIMENSIONS
L
0805
millimeters (inches)
W
T
BW
BL
EW
X
S
2.01 ± 0.20
1.25 ± 0.20
0.76 ± 0.03
0.46 ± 0.10
0.18 + 0.25 -0.08
0.25 ± 0.13
1.02 ± 0.10
0.23 ± 0.05
(0.079 ± 0.008) (0.049 ± 0.008) (0.030 ± 0.003) (0.018 ± 0.004) (0.007 + 0.010 -0.003) (0.010 ± 0.005) (0.040 ± 0.004) (0.009 ± 0.002)
L
S
X
T
BW
C
L
BL
W
EW
RECOMMENDED SOLDER PAD LAYOUT
(Typical Dimensions)
T
0805
3.45 (0.136)
millimeters (inches)
L
1.02 (0.040)
P
0.51 (0.020)
S
0.76 (0.030)
W
1.27 (0.050)
C
0.46 (0.018)
4 Pad Layout
T
P
3 Pad Layout
T
P
P
P
S
INPUT
W
OUTPUT
INPUT
S
W
OUTPUT
C
L
C
L
Note:
It is only necessary to ground
one center terminal. However,
AVX recommends that both
side terminals be connected.
21
TransFeed
AVX Multilayer Ceramic Transient Voltage Suppressors
TVS Protection and EMI Attenuation in a Single 0805 Chip - V2F Series
TRANSFEED ELECTRICAL SPECIFICATIONS
(0805 CHIP SIZE)
AVX
Part Number
Symbol
Units
Test Condition
V2F105A150Y2E _ _
V2F109A200Y2E _ _
V2F114A300Y2E _ _
V2F118A400Y2E _ _
V2F118X500Y3D _ _
V2F105C150Y1F _ _
V2F109C200Y1F _ _
V2F114C300Y1F _ _
V2F118C400Y1F _ _
Working Breakdown Clamping
Voltage
Voltage
Voltage
V
WM
Volts
(max.)
<50µA
5.6
9.0
14.0
18.0
<18.0
5.6
9.0
14.0
18.0
V
B
Volts
V
C
Volts
(max.)
8/20µS†
15.5
20.0
30.0
40.0
<50.0
15.5
20.0
30.0
40.0
Peak
Current
I
peak
Amp
(max.)
8/20µs
30
30
30
30
20
120
120
120
120
Transient
Energy
E
trans
Joules
(max.)
10/1000µS
0.1
0.1
0.1
0.1
0.05
0.3
0.3
0.3
0.3
DC Resistance
Capacitance
Ohms
C
pF
(typ.)
0.5Vrms @:
1 MHz
7.6 - 9.3
11.0 - 14.0
16.5 - 20.3
22.9 - 28.0
N/A
7.1 - 8.7
10.5 - 13.5
15.9 - 19.4
22.5 - 27.5
800
575
300
200
<100
2500
1800
900
500
0.200
0.200
0.200
0.200
0.250
0.150
0.150
0.150
0.150
750 mA
750 mA
750 mA
750 mA
500 mA
1 Amp
1 Amp
1 Amp
1 Amp
Ohms
Ω
Feedthru
Current
I
Amp.
1mA DC
Termination Finish: X = Pt/Pd/Ag (Non-Plated)
P = Ni/Sn Alloy (Plated)
Packaging (Pcs/Reel): see page 2
V
C
—Maximum peak voltage across the varistor measured at a specified pulse current and waveform
†Transient Energy Rating
0.05 Joule
0.01 Joule
0.2 - 0.3 Joules
Pulse Current & Waveform
1A 8/20µS
2A 8/20µS
5A 8/20µS
PERFORMANCE CHARACTERISTICS
dB Attenuation vs Frequency
0
0
TransFeed 0.1J
18LC
-10
18A
14A
9A
-30
5A
-40
TransFeed 0.3J
-10
18C
-20
-20
14C
-30
9C
-40
5C
S21 (dB)
-50
S21 (dB)
1
Frequency (GHz)
10
-50
-60
-60
-70
0.01
0.1
-70
0.01
0.1
Frequency (GHz)
1
10
22
NXP MCU
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