IDT72T7285L10BB datasheet, PDF

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IDT72T7285L10BB: DescriptionFIFO, 16KX72, 4.5ns, Synchronous, CMOS, PBGA324, 19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-324; Categorystorage storage; File Size532KB，53 Pages; ManufacturerIDT (Integrated Device Technology)

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IDT72T7285L10BB Overview

FIFO, 16KX72, 4.5ns, Synchronous, CMOS, PBGA324, 19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-324

IDT72T7285L10BB Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	IDT (Integrated Device Technology)
Parts packaging code	BGA
package instruction	BGA, BGA324,18X18,40
Contacts	324
Reach Compliance Code	not_compliant
ECCN code	EAR99
Maximum access time	4.5 ns
Other features	ASYNCHRONOUS OPERATION ALSO POSSIBLE
Maximum clock frequency (fCLK)	100 MHz
period time	10 ns
JESD-30 code	S-PBGA-B324
JESD-609 code	e0
length	19 mm
memory density	1179648 bit
Memory IC Type	OTHER FIFO
memory width	72
Humidity sensitivity level	3
Number of functions	1
Number of terminals	324
word count	16384 words
character code	16000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	16KX72
Exportable	YES
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Encapsulate equivalent code	BGA324,18X18,40
Package shape	SQUARE
Package form	GRID ARRAY
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	225
power supply	2.5 V
Certification status	Not Qualified
Maximum seat height	1.97 mm
Maximum standby current	0.05 A
Maximum slew rate	0.06 mA
Maximum supply voltage (Vsup)	2.625 V
Minimum supply voltage (Vsup)	2.375 V
Nominal supply voltage (Vsup)	2.5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn63Pb37)
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	20
width	19 mm

IDT72T7285L10BB Preview

2.5 VOLT HIGH-SPEED TeraSync

FIFO 72-BIT CONFIGURATIONS

16,384 x 72, 32,768 x 72,

65,536 x 72, 131,072 x 72

IDT72T7285, IDT72T7295,

IDT72T72105, IDT72T72115

FEATURES:

•

Choose among the following memory organizations:

IDT72T7285



16,384 x 72

IDT72T7295



32,768 x 72

IDT72T72105



65,536 x 72

IDT72T72115



131,072 x 72

Up to 225 MHz Operation of Clocks

User selectable HSTL/LVTTL Input and/or Output

Read Enable & Read Clock Echo outputs aid high speed operation

User selectable Asynchronous read and/or write port timing

2.5V LVTTL or 1.8V, 1.5V HSTL Port Selectable Input/Ouput voltage

3.3V Input tolerant

Mark & Retransmit, resets read pointer to user marked position

Write Chip Select (WCS) input disables Write Port HSTL inputs

Read Chip Select (RCS) synchronous to RCLK

Programmable Almost-Empty and Almost-Full flags, each flag can

default to one of eight preselected offsets

Program programmable flags by either serial or parallel means

Selectable synchronous/asynchronous timing modes for Almost-

Empty and Almost-Full flags

Separate SCLK input for Serial programming of flag offsets

•

User selectable input and output port bus-sizing

- x72 in to x72 out

- x72 in to x36 out

- x72 in to x18 out

- x36 in to x72 out

- x18 in to x72 out

Big-Endian/Little-Endian user selectable byte representation

Auto power down minimizes standby power consumption

Master Reset clears entire FIFO

Partial Reset clears data, but retains programmable settings

Empty, Full and Half-Full flags signal FIFO status

Select IDT Standard timing (using

and

flags) or First Word

Fall Through timing (using

and

flags)

Output enable puts data outputs into high impedance state

JTAG port, provided for Boundary Scan function

Available in 324-pin (19mm x 19mm)Plastic Ball Grid Array (PBGA)

Easily expandable in depth and width

Independent Read and Write Clocks (permit reading and writing

simultaneously)

High-performance submicron CMOS technology

Industrial temperature range (–40°C to +85°C) is available

FUNCTIONAL BLOCK DIAGRAM

-D

(x72, x36 or x18)

WEN

WCLK/WR

WCS

SEN

SCLK

INPUT REGISTER

OFFSET REGISTER

FF/IR

PAF

EF/OR

PAE

FWFT/SI

PFM

FSEL0

FSEL1

ASYW

WRITE CONTROL

LOGIC

WRITE POINTER

MRS

PRS

TCK

TRST

TMS

TDO

TDI

Vref

WHSTL

RHSTL

SHSTL

CONTROL

LOGIC

BUS

CONFIGURATION

RESET

LOGIC

RAM ARRAY

16,384 x 72

32,768 x 72

65,536 x 72

131,072 x 72

FLAG

LOGIC

READ POINTER

OUTPUT REGISTER

READ

CONTROL

LOGIC

MARK

ASYR

JTAG CONTROL

(BOUNDARY SCAN)

RCLK/RD

REN

RCS

HSTL I/0

CONTROL

EREN

5994 drw01

-Q

(x72, x36 or x18)

ERCLK

IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc. The TeraSync FIFO is a trademark of Integrated Device Technology, Inc.

COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES



SEPTEMBER 2003

DSC-5994/12

IDT72T7285/72T7295/72T72105/72T72115 2.5V TeraSync 72-BIT FIFO



16,384 x 72, 32,768 x 72, 65,536 x 72, 131,072 x 72

COMMERCIAL AND INDUSTRIAL

TEMPERATURE RANGES

PIN CONFIGURATION

A1 BALL PAD CORNER

D60

D61

D63

D66

D69

WCLK

PRS

GND

EREN

RCLK

Q69

Q66

Q64

Q63

DDQ

D59

D58

D62

D64

D67

D70

WEN

MRS

GND

PAF

REN

RCS

Q70

Q67

Q65

Q61

Q62

D57

D56

D55

D65

D68

D71

WCS

GND

PAE

MARK

Q71

Q68

Q58

Q59

Q60

D54

D53

D52

FWFT/SI

FS0

SHSTL

FS1

GND

RHSTL

ASYR

PFM

Q55

Q56

Q57

D51

D50

D49

GND

DDQ

Q52

Q53

Q54

D48

D47

D46

GND

DDQ

Q49

Q50

Q51

D45

SEN

SCLK

WHSTL

GND

DDQ

Q46

Q47

Q48

D44

D43

D42

ASYW

GND

DDQ

Q43

Q44

Q45

D41

D40

D39

VREF

GND

DDQ

Q40

Q41

Q42

D36

D37

D38

GND

DDQ

Q39

Q38

Q37

D33

D34

D35

GND

DDQ

Q36

Q35

Q34

D30

D31

D32

GND

DDQ

Q33

Q32

Q31

D27

D28

D29

GND

DDQ

Q30

Q29

Q28

D24

D25

D26

GND

DDQ

Q27

Q26

Q25

D21

D22

D23

GND

DDQ

Q24

Q23

Q22

D19

D20

D13

D10

TMS

TDO

GND

Q11

Q14

Q21

Q20

D18

D17

D14

D11

TRST

TDI

GND

Q12

Q15

Q18

Q19

D16

D15

D12

TCK

GND

ERCLK

Q10

Q13

Q16

Q17

DDQ

5994 drw02

PBGA: 1mm pitch, 19mm x 19mm (BB324-1, order code: BB)

TOP VIEW

IDT72T7285/72T7295/72T72105/72T72115 2.5V TeraSync 72-BIT FIFO



16,384 x 72, 32,768 x 72, 65,536 x 72, 131,072 x 72

COMMERCIAL AND INDUSTRIAL

TEMPERATURE RANGES

DESCRIPTION:

The IDT72T7285/72T7295/72T72105/72T72115 are exceptionally deep,

extremely high speed, CMOS First-In-First-Out (FIFO) memories with clocked

read and write controls and a flexible Bus-Matching x72/x36/x18 data flow.

These FIFOs offer several key user benefits:

• Flexible x72/x36/x18 Bus-Matching on both read and write ports

• A user selectable MARK location for retransmit

• User selectable I/O structure for HSTL or LVTTL

• Asynchronous/Synchronous translation on the read or write ports

• The first word data latency period, from the time the first word is written to an

empty FIFO to the time it can be read, is fixed and short.

• High density offerings up to 9 Mbit

Bus-Matching TeraSync FIFOs are particularly appropriate for network,

video, telecommunications, data communications and other applications that

need to buffer large amounts of data and match busses of unequal sizes.

Each FIFO has a data input port (D

) and a data output port (Q

), both of

which can assume either a 72-bit, 36-bit or a 18-bit width as determined by the

state of external control pins Input Width (IW), Output Width (OW), and Bus-

Matching (BM) pin during the Master Reset cycle.

The input port can be selected as either a Synchronous (clocked) interface,

or Asynchronous interface. During Synchronous operation the input port is

controlled by a Write Clock (WCLK) input and a Write Enable (WEN) input. Data

present on the Dn data inputs is written into the FIFO on every rising edge of

WCLK when

WEN

is asserted. During Asynchronous operation only the WR

input is used to write data into the FIFO. Data is written on a rising edge of WR,

the

WEN

input should be tied to its active state, (LOW).

The output port can be selected as either a Synchronous (clocked) interface,

or Asynchronous interface. During Synchronous operation the output port is

controlled by a Read Clock (RCLK) input and Read Enable (REN) input. Data

is read from the FIFO on every rising edge of RCLK when

REN

is asserted.

During Asynchronous operation only the RD input is used to read data from the

FIFO. Data is read on a rising edge of RD, the

REN

input should be tied to its

active state, LOW. When Asynchronous operation is selected on the output port

the FIFO must be configured for Standard IDT mode, also the

RCS

should be

tied LOW and the

input used to provide three-state control of the outputs, Qn.

The output port can be selected for either 2.5V LVTTL or HSTL operation,

this operation is selected by the state of the RHSTL input during a master reset.

An Output Enable (OE) input is provided for three-state control of the outputs.

A Read Chip Select (RCS) input is also provided, the

RCS

input is synchronized

to the read clock, and also provides three-state control of the Qn data outputs.

When

RCS

is disabled, the data outputs will be high impedance. During

Asynchronous operation of the output port,

RCS

should be enabled, held LOW.

Echo Read Enable,

EREN

and Echo Read Clock, ERCLK outputs are

provided. These are outputs from the read port of the FIFO that are required

for high speed data communication, to provide tighter synchronization between

the data being transmitted from the Qn outputs and the data being received by

the input device. Data read from the read port is available on the output bus with

respect to

EREN

and ERCLK, this is very useful when data is being read at

high speed. The ERCLK and

EREN

outputs are non-functional when the Read

port is setup for Asynchronous mode.

The frequencies of both the RCLK and the WCLK signals may vary from 0

to f

MAX

with complete independence. There are no restrictions on the frequency

of the one clock input with respect to the other.

There are two possible timing modes of operation with these devices: IDT

Standard mode and First Word Fall Through (FWFT) mode.

IDT Standard mode,

the first word written to an empty FIFO will not appear

on the data output lines unless a specific read operation is performed. A read

operation, which consists of activating

REN

and enabling a rising RCLK edge,

will shift the word from internal memory to the data output lines.

FWFT mode,

the first word written to an empty FIFO is clocked directly

to the data output lines after three transitions of the RCLK signal. A

REN

does

not have to be asserted for accessing the first word. However, subsequent

words written to the FIFO do require a LOW on

REN

for access. The state of

the FWFT/SI input during Master Reset determines the timing mode in use.

For applications requiring more data storage capacity than a single FIFO

can provide, the FWFT timing mode permits depth expansion by chaining FIFOs

in series (i.e. the data outputs of one FIFO are connected to the corresponding

data inputs of the next). No external logic is required.

These FIFOs have five flag pins,

EF/OR

(Empty Flag or Output Ready),

FF/IR

(Full Flag or Input Ready),

(Half-full Flag),

PAE

(Programmable

Almost-Empty flag) and

PAF

(Programmable Almost-Full flag). The

and

functions are selected in IDT Standard mode. The

and

functions are

selected in FWFT mode.

HF, PAE

and

PAF

are always available for use,

irrespective of timing mode.

PAE

and

PAF

can be programmed independently to switch at any point in

memory. Programmable offsets determine the flag switching threshold and can

be loaded by two methods: parallel or serial. Eight default offset settings are also

provided, so that

PAE

can be set to switch at a predefined number of locations

from the empty boundary and the

PAF

threshold can also be set at similar

predefined values from the full boundary. The default offset values are set during

Master Reset by the state of the FSEL0, FSEL1, and

pins.

For serial programming,

SEN

together with

on each rising edge of

SCLK, are used to load the offset registers via the Serial Input (SI). For parallel

programming,

WEN

together with

on each rising edge of WCLK, are used

to load the offset registers via D

REN

together with

on each rising edge

of RCLK can be used to read the offsets in parallel from Q

regardless of whether

serial or parallel offset loading has been selected.

During Master Reset (MRS) the following events occur: the read and write

pointers are set to the first location of the FIFO. The FWFT pin selects IDT

Standard mode or FWFT mode.

The Partial Reset (PRS) also sets the read and write pointers to the first

location of the memory. However, the timing mode, programmable flag

programming method, and default or programmed offset settings existing before

Partial Reset remain unchanged. The flags are updated according to the timing

mode and offsets in effect.

PRS

is useful for resetting a device in mid-operation,

when reprogramming programmable flags would be undesirable.

It is also possible to select the timing mode of the

PAE

(Programmable Almost-

Empty flag) and

PAF

(Programmable Almost-Full flag) outputs. The timing

modes can be set to be either asynchronous or synchronous for the

PAE

and

PAF

flags.

If asynchronous

PAE/PAF

configuration is selected, the

PAE

is asserted

LOW on the LOW-to-HIGH transition of RCLK.

PAE

is reset to HIGH on the LOW-

to-HIGH transition of WCLK. Similarly, the

PAF

is asserted LOW on the LOW-

to-HIGH transition of WCLK and

PAF

is reset to HIGH on the LOW-to-HIGH

transition of RCLK.

If synchronous

PAE/PAF

configuration is selected , the

PAE

is asserted and

updated on the rising edge of RCLK only and not WCLK. Similarly,

PAF

asserted and updated on the rising edge of WCLK only and not RCLK. The mode

desired is configured during Master Reset by the state of the Programmable Flag

Mode (PFM) pin.

This device includes a Retransmit from Mark feature that utilizes two control

inputs, MARK and ,

(Retransmit). If the MARK input is enabled with respect

to the RCLK, the memory location being read at that point will be marked. Any

subsequent retransmit operation,

goes LOW, will reset the read pointer to

this ‘marked’ location.

IDT72T7285/72T7295/72T72105/72T72115 2.5V TeraSync 72-BIT FIFO



16,384 x 72, 32,768 x 72, 65,536 x 72, 131,072 x 72

COMMERCIAL AND INDUSTRIAL

TEMPERATURE RANGES

DESCRIPTION (CONTINUED)

The device can be configured with different input and output bus widths as

shown in Table 1.

A Big-Endian/Little-Endian data word format is provided. This function is

useful when data is written into the FIFO in long word format (x36/x18) and read

out of the FIFO in small word (x18/x9) format. If Big-Endian mode is selected,

then the most significant byte (word) of the long word written into the FIFO will

be read out of the FIFO first, followed by the least significant byte. If Little-Endian

format is selected, then the least significant byte of the long word written into the

FIFO will be read out first, followed by the most significant byte. The mode desired

is configured during master reset by the state of the Big-Endian (BE) pin. See

Figure 5 for

Bus-Matching Byte Arrangement.

The Interspersed/Non-Interspersed Parity (IP) bit function allows the user

to select the parity bit in the word loaded into the parallel port (D

-Dn) when

programming the flag offsets. If Interspersed Parity mode is selected, then the

FIFO will assume that the parity bit is located in bit positions D8, D17, D26 and

D35 during the parallel programming of the flag offsets. If Non-Interspersed

Parity mode is selected, then D8 and D17 are assumed to be valid bits. IP mode

is selected during Master Reset by the state of the IP input pin.

If, at any time, the FIFO is not actively performing an operation, the chip will

automatically power down. Once in the power down state, the standby supply

current consumption is minimized. Initiating any operation (by activating control

inputs) will immediately take the device out of the power down state.

Both an Asynchronous Output Enable pin (OE) and Synchronous Read

Chip Select pin (RCS) are provided on the FIFO. The Synchronous Read Chip

Select is synchronized to the RCLK. Both the output enable and read chip select

control the output buffer of the FIFO, causing the buffer to be either HIGH

impedance or LOW impedance.

A JTAG test port is provided, here the FIFO has fully functional Boundary

Scan feature, compliant with IEEE 1449.1 Standard Test Access Port and

Boundary Scan Architecture.

The TeraSync FIFO has the capability of operating its ports (write and/or

read) in either LVTTL or HSTL mode, each ports selection independent of the

other. The write port selection is made via WHSTL and the read port selection

via RHSTL. An additional input SHSTL is also provided, this allows the user

to select HSTL operation for other pins on the device (not associated with the

write or read ports).

The IDT72T7285/72T7295/72T72105/72T72115 are fabricated using

IDT’s high speed submicron CMOS technology.

IDT72T7285/72T7295/72T72105/72T72115 2.5V TeraSync 72-BIT FIFO



16,384 x 72, 32,768 x 72, 65,536 x 72, 131,072 x 72

COMMERCIAL AND INDUSTRIAL

TEMPERATURE RANGES

PARTIAL RESET (PRS)

WRITE CLOCK (WCLK/WR)

WRITE ENABLE (WEN)

WRITE CHIP SELECT (WCS)

LOAD (LD)

(x72, x36, x18) DATA IN (D

- D

)

SERIAL CLOCK (SCLK)

SERIAL ENABLE(SEN)

FIRST WORD FALL THROUGH/

SERIAL INPUT (FWFT/SI)

FULL FLAG/INPUT READY (FF/IR)

PROGRAMMABLE ALMOST-FULL (PAF)

MASTER RESET (MRS)

READ CLOCK (RCLK/RD)

READ ENABLE (REN)

OUTPUT ENABLE (OE)

IDT

72T7285

72T7295

72T72105

72T72115

READ CHIP SELECT (RCS)

(x72, x36, x18) DATA OUT (Q

- Q

)

RCLK ECHO, ERCLK

REN

ECHO,

EREN

MARK

RETRANSMIT (RT)

EMPTY FLAG/OUTPUT READY (EF/OR)

PROGRAMMABLE ALMOST-EMPTY (PAE)

HALF-FULL FLAG (HF)

BIG-ENDIAN/LITTLE-ENDIAN (BE)

INTERSPERSED/

NON-INTERSPERSED PARITY (IP)

5994 drw03

INPUT WIDTH (IW)

OUTPUT WIDTH (OW)

BUS-

MATCHING

(BM)

Figure 1. Single Device Configuration Signal Flow Diagram

TABLE 1 — BUS-MATCHING CONFIGURATION MODES

NOTE:

1. Pin status during Master Reset.

Write Port Width

x72

x36

x18

Read Port Width

x72

x36

x18

x72

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