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WS128K32-45G2LIA

Description
SRAM Module, 128KX32, 45ns, CMOS, CQFP68, 22.40 MM, 5.08 MM HEIGHT, CERAMIC, QFP-68
Categorystorage    storage   
File Size437KB,10 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Download Datasheet Parametric View All

WS128K32-45G2LIA Overview

SRAM Module, 128KX32, 45ns, CMOS, CQFP68, 22.40 MM, 5.08 MM HEIGHT, CERAMIC, QFP-68

WS128K32-45G2LIA Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerMicrosemi
Parts packaging codeQFP
package instruction22.40 MM, 5.08 MM HEIGHT, CERAMIC, QFP-68
Contacts68
Reach Compliance Codeunknown
ECCN code3A991.B.2.A
Maximum access time45 ns
Other featuresUSER CONFIGURABLE AS 512K X 8
Spare memory width16
I/O typeCOMMON
JESD-30 codeS-CQFP-G68
JESD-609 codee0
length22.36 mm
memory density4194304 bit
Memory IC TypeSRAM MODULE
memory width32
Number of functions1
Number of terminals68
word count131072 words
character code128000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize128KX32
Output characteristics3-STATE
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeQFP
Encapsulate equivalent codeQFP68,.99SQ,50
Package shapeSQUARE
Package formFLATPACK
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Certification statusNot Qualified
Maximum seat height5.1 mm
Maximum standby current0.002 A
Minimum standby current2 V
Maximum slew rate0.6 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTIN LEAD
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
width22.36 mm
White Electronic Designs
FEATURES
n
n
n
n
n
n
n
n
WS128K32-XXX
128Kx32 SRAM MODULE, SMD 5962-93187 & 5962-95595
Access Times of 15, 17, 20, 25, 35, 45, 55ns
MIL-STD-883 Compliant Devices Available
Packaging
• 66 pin, PGA Type, 1.075" square, Hermetic Ce
ramic HIP (Package 400)
• 68 lead, 40mm CQFP (G4T)
1
, 3.56mm (0.140")
(Package 502)
• 68 lead, 22.4mm CQFP (G2U), 3.56mm (0.140"),
(Package 510)
• 68 lead, 22.4mm (0.880") square, CQFP (G2L),
5.08mm (0.200") high, (Package 528).
• 68 lead, 23.9mm Low Profile CQFP (G1U)
1
,
3.57mm (0.140"), (Package 519)
• 68 lead, 23.9mm Low Profile CQFP (G1T), 4.06
mm (0.160"), (Package 524)
n
Organized as 128Kx32; User Configurable as
256Kx16 or 512Kx8
Commercial, Industrial and Military Temperature
Ranges
5 Volt Power Supply
TTL Compatible Inputs and Outputs
Built in Decoupling Caps and Multiple Ground Pins
for Low Noise Operation
Weight:
WS128K32-XG1UX
1
- 5 grams typical
WS128K32-XG1TX - 5 grams typical
WS128K32-XG2UX - 8 grams typical
WS128K32-XG2LX - 8 grams typical
WS128K32-XH1X - 13 grams typical
WS128K32-XG4TX
1
- 20 grams typical
All devices are upgradeable to 512Kx32
n
Low Power CMOS
n
Note 1: Package Not Recommended For New Design
FIG. 1
P
IN
C
ONFIGURATION
F
OR
WS128K32N-XH1X
T
OP
V
IEW
P
IN
D
ESCRIPTION
I/O
0-31
Data Inputs/Outputs
A
0-16
WE
1-4
CS
1-4
OE
V
CC
GND
NC
Address Inputs
Write Enables
Chip Selects
Output Enable
Power Supply
Ground
Not Connected
B
LOCK
D
IAGRAM
May 2003 Rev. 12
1
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
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