|
MC74F38J |
54F38/B2C |
N74F38N-B |
| Description |
NAND Gate, TTL, CDIP14 |
NAND Gate, TTL, CQCC20 |
NAND Gate, TTL, PDIP14, |
| Is it Rohs certified? |
incompatible |
incompatible |
incompatible |
| Maker |
Philips Semiconductors (NXP Semiconductors N.V.) |
Philips Semiconductors (NXP Semiconductors N.V.) |
Philips Semiconductors (NXP Semiconductors N.V.) |
| Reach Compliance Code |
unknown |
unknown |
unknown |
| JESD-30 code |
R-XDIP-T14 |
S-XQCC-N20 |
R-PDIP-T14 |
| JESD-609 code |
e0 |
e0 |
e0 |
| Logic integrated circuit type |
NAND GATE |
NAND GATE |
NAND GATE |
| MaximumI(ol) |
0.064 A |
0.02 A |
0.064 A |
| Number of terminals |
14 |
20 |
14 |
| Maximum operating temperature |
70 °C |
125 °C |
70 °C |
| Output characteristics |
OPEN-COLLECTOR |
OPEN-COLLECTOR |
OPEN-COLLECTOR |
| Package body material |
CERAMIC |
CERAMIC |
PLASTIC/EPOXY |
| encapsulated code |
DIP |
QCCN |
DIP |
| Encapsulate equivalent code |
DIP14,.3 |
LCC20,.35SQ |
DIP14,.3 |
| Package shape |
RECTANGULAR |
SQUARE |
RECTANGULAR |
| Package form |
IN-LINE |
CHIP CARRIER |
IN-LINE |
| power supply |
5 V |
5 V |
5 V |
| Maximum supply current (ICC) |
30 mA |
30 mA |
30 mA |
| Prop。Delay @ Nom-Sup |
13 ns |
14.5 ns |
13 ns |
| Schmitt trigger |
NO |
NO |
NO |
| Nominal supply voltage (Vsup) |
5 V |
5 V |
5 V |
| surface mount |
NO |
YES |
NO |
| technology |
TTL |
TTL |
TTL |
| Temperature level |
COMMERCIAL |
MILITARY |
COMMERCIAL |
| Terminal surface |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
| Terminal form |
THROUGH-HOLE |
NO LEAD |
THROUGH-HOLE |
| Terminal pitch |
2.54 mm |
1.27 mm |
2.54 mm |
| Terminal location |
DUAL |
QUAD |
DUAL |
| Certification status |
Not Qualified |
Not Qualified |
- |