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89HPES12T3G2ZBBCI

Description
CABGA-324, Tray
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size405KB,31 Pages
ManufacturerIDT (Integrated Device Technology)
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89HPES12T3G2ZBBCI Overview

CABGA-324, Tray

89HPES12T3G2ZBBCI Parametric

Parameter NameAttribute value
Brand NameIntegrated Device Technology
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerIDT (Integrated Device Technology)
Parts packaging codeCABGA
package instruction19 X 19 MM, 1 MM PITCH, MS-034/AAAG-1, CABGA-324
Contacts324
Manufacturer packaging codeBC324
Reach Compliance Codenot_compliant
ECCN codeEAR99
Address bus width
Bus compatibilityPCI
maximum clock frequency125 MHz
Drive interface standardsIEEE 1149.1
External data bus width
JESD-30 codeS-PBGA-B324
JESD-609 codee0
length19 mm
Humidity sensitivity level3
Number of terminals324
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Encapsulate equivalent codeBGA324,18X18,40
Package shapeSQUARE
Package formGRID ARRAY
Peak Reflow Temperature (Celsius)225
power supply1,2.5,3.3 V
Certification statusNot Qualified
Maximum seat height1.72 mm
Maximum supply voltage1.1 V
Minimum supply voltage0.9 V
Nominal supply voltage1 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn63Pb37)
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width19 mm
uPs/uCs/peripheral integrated circuit typeBUS CONTROLLER, PCI
12-Lane 3-Port
Gen2 PCI Express® Switch
®
89HPES12T3G2
Data Sheet
The 89HPES12T3G2 is a member of IDT’s PRECISE™ family of PCI
Express® switching solutions. The PES12T3G2 is a 12-lane, 3-port
Gen2 peripheral chip that performs PCI Express Base switching with a
feature set optimized for high performance applications such as servers,
storage, and communications/networking. It provides connectivity and
switching functions between a PCI Express upstream port and two
downstream ports and supports switching between downstream ports.
Device Overview
Features
High Performance PCI Express Switch
– Twelve 5 Gbps Gen2 PCI Express lanes
– Three switch ports
• One x4 upstream port
• Two x4 downstream ports
– Low latency cut-through switch architecture
– Support for Max Payload Size up to 2048 bytes
– One virtual channel
– Eight traffic classes
– PCI Express Base Specification Revision 2.0 compliant
Flexible Architecture with Numerous Configuration Options
– Automatic per port link width negotiation to x4, x2 or x1
– Automatic lane reversal on all ports
– Automatic polarity inversion
– Ability to load device configuration from serial EEPROM
Legacy Support
– PCI compatible INTx emulation
– Bus locking
Highly Integrated Solution
– Incorporates on-chip internal memory for packet buffering and
queueing
– Integrates twelve 5 Gbps embedded SerDes with 8b/10b
encoder/decoder (no separate transceivers needed)
• Receive equalization (RxEQ)
Reliability, Availability, and Serviceability (RAS) Features
– Internal end-to-end parity protection on all TLPs ensures data
integrity even in systems that do not implement end-to-end
CRC (ECRC)
– Supports ECRC and Advanced Error Reporting
– Supports PCI Express Native Hot-Plug, Hot-Swap capable I/O
– Compatible with Hot-Plug I/O expanders used on PC mother-
boards
– Supports Hot-Swap
Block Diagram
3-Port Switch Core / 12 PCI Express Lanes
Frame Buffer
Route Table
Port
Arbitration
Scheduler
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
SerDes
SerDes
SerDes
(Port 0)
(Port 2)
Figure 1 Internal Block Diagram
(Port 4)
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc.
1 of 30
August 10, 2011
DSC 6930

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Description CABGA-324, Tray CABGA-324, Reel CABGA-324, Tray CABGA-324, Tray CABGA-324, Reel TCXO CABGA-324, Tray CABGA-324, Reel
Brand Name Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology - Integrated Device Technology Integrated Device Technology
Is it lead-free? Contains lead Lead free Lead free Lead free Contains lead - Contains lead Contains lead
Is it Rohs certified? incompatible conform to conform to conform to incompatible - incompatible incompatible
Maker IDT (Integrated Device Technology) IDT (Integrated Device Technology) - IDT (Integrated Device Technology) IDT (Integrated Device Technology) - IDT (Integrated Device Technology) IDT (Integrated Device Technology)
Parts packaging code CABGA CABGA CABGA CABGA CABGA - CABGA CABGA
package instruction 19 X 19 MM, 1 MM PITCH, MS-034/AAAG-1, CABGA-324 BGA, BGA324,18X18,40 19 X 19 MM, 1 MM PITCH, GREEN, MS-034/AAAG-1, CABGA-324 CABGA-324 CABGA-324 - CABGA-324 CABGA-324
Contacts 324 324 324 324 324 - 324 324
Manufacturer packaging code BC324 BCG324 BCG324 BCG324 BC324 - BC324 BC324
Reach Compliance Code not_compliant compliant compliant compliant not_compliant - not_compliant not_compliant
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 - EAR99 EAR99
Bus compatibility PCI PCI; SMBUS PCI PCI PCI; SMBUS - PCI PCI; SMBUS
maximum clock frequency 125 MHz 125 MHz 125 MHz 125 MHz 125 MHz - 125 MHz 125 MHz
JESD-30 code S-PBGA-B324 S-PBGA-B324 S-PBGA-B324 S-PBGA-B324 S-PBGA-B324 - S-PBGA-B324 S-PBGA-B324
JESD-609 code e0 e1 e1 e1 e0 - e0 e0
length 19 mm 19 mm 19 mm 19 mm 19 mm - 19 mm 19 mm
Humidity sensitivity level 3 3 3 3 3 - 3 3
Number of terminals 324 324 324 324 324 - 324 324
Maximum operating temperature 85 °C 70 °C 85 °C 70 °C 70 °C - 70 °C 70 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA BGA BGA BGA BGA - BGA BGA
Encapsulate equivalent code BGA324,18X18,40 BGA324,18X18,40 BGA324,18X18,40 BGA324,18X18,40 BGA324,18X18,40 - BGA324,18X18,40 BGA324,18X18,40
Package shape SQUARE SQUARE SQUARE SQUARE SQUARE - SQUARE SQUARE
Package form GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY - GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Celsius) 225 260 260 260 225 - 225 225
power supply 1,2.5,3.3 V 1,2.5,3.3 V 1,2.5,3.3 V 3.3 V 3.3 V - 1,2.5,3.3 V 1,2.5,3.3 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified - Not Qualified Not Qualified
Maximum seat height 1.72 mm 1.72 mm 1.72 mm 1.72 mm 1.72 mm - 1.72 mm 1.72 mm
Maximum supply voltage 1.1 V 1.1 V 1.1 V 1.1 V 1.1 V - 1.1 V 1.1 V
Minimum supply voltage 0.9 V 0.9 V 0.9 V 0.9 V 0.9 V - 0.9 V 0.9 V
Nominal supply voltage 1 V 1 V 1 V 1 V 1 V - 1 V 1 V
surface mount YES YES YES YES YES - YES YES
technology CMOS CMOS CMOS CMOS CMOS - CMOS CMOS
Temperature level INDUSTRIAL COMMERCIAL INDUSTRIAL COMMERCIAL COMMERCIAL - COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn63Pb37) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Lead (Sn63Pb37) - Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37)
Terminal form BALL BALL BALL BALL BALL - BALL BALL
Terminal pitch 1 mm 1 mm 1 mm 1 mm 1 mm - 1 mm 1 mm
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM - BOTTOM BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED 30 30 NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED
width 19 mm 19 mm 19 mm 19 mm 19 mm - 19 mm 19 mm
uPs/uCs/peripheral integrated circuit type BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI - BUS CONTROLLER, PCI BUS CONTROLLER, PCI
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