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BSX63SMD-JQR

Description
3A, 60V, NPN, Si, POWER TRANSISTOR, TO-276AB, HERMETICALLY SEALED, CERAMIC, SMD1, 3 PIN
CategoryDiscrete semiconductor    The transistor   
File Size10KB,1 Pages
ManufacturerSEMELAB
Download Datasheet Parametric Compare View All

BSX63SMD-JQR Overview

3A, 60V, NPN, Si, POWER TRANSISTOR, TO-276AB, HERMETICALLY SEALED, CERAMIC, SMD1, 3 PIN

BSX63SMD-JQR Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerSEMELAB
Parts packaging codeTO-276AB
package instructionCHIP CARRIER, R-CBCC-N3
Contacts3
Reach Compliance Codecompliant
ECCN codeEAR99
Shell connectionCOLLECTOR
Maximum collector current (IC)3 A
Collector-emitter maximum voltage60 V
ConfigurationSINGLE
Minimum DC current gain (hFE)63
JEDEC-95 codeTO-276AB
JESD-30 codeR-CBCC-N3
Number of components1
Number of terminals3
Package body materialCERAMIC, METAL-SEALED COFIRED
Package shapeRECTANGULAR
Package formCHIP CARRIER
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Polarity/channel typeNPN
Certification statusNot Qualified
surface mountYES
Terminal formNO LEAD
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
Transistor component materialsSILICON
Nominal transition frequency (fT)30 MHz
BSX63SMD
Dimensions in mm (inches).
0.89
(0.035)
min.
3.70 (0.146)
3.41 (0.134)
3.70 (0.146)
3.41 (0.134)
3.60 (0.142)
Max.
4.14 (0.163)
3.84 (0.151)
Bipolar NPN Device in a
Hermetically sealed
Ceramic Surface Mount
Package for High
Reliability Applications
1
3
0.76
(0.030)
min.
16.02 (0.631)
15.73 (0.619)
Bipolar NPN Device.
V
CEO
= 60V
I
C
= 3A
10.69 (0.421)
10.39 (0.409)
2
9.67 (0.381)
9.38 (0.369)
11.58 (0.456)
11.28 (0.444)
0.50 (0.020)
0.26 (0.010)
All Semelab hermetically sealed products
can be processed in accordance with the
requirements of BS, CECC and JAN,
JANTX, JANTXV and JANS specifications
SMD1 (TO276AB)
PINOUTS
1 – Base
2 – Collector
3 – Emitter
Parameter
V
CEO
*
I
C(CONT)
h
FE
f
t
P
D
Test Conditions
Min.
Typ.
Max.
60
3
Units
V
A
-
Hz
@ 1/1 (V
CE
/ I
C
)
63
30M
160
5
W
* Maximum Working Voltage
This is a shortform datasheet. For a full datasheet please contact
sales@semelab.co.uk.
Semelab Plc reserves the right to change test conditions, parameter limits and package dimensions without notice. Information furnished by Semelab is believed
to be both accurate and reliable at the time of going to press. However Semelab assumes no responsibility for any errors or omissions discovered in its use.
Semelab plc.
Telephone +44(0)1455 556565. Fax +44(0)1455 552612.
E-mail:
sales@semelab.co.uk
Website:
http://www.semelab.co.uk
Generated
15-Aug-02

BSX63SMD-JQR Related Products

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Description 3A, 60V, NPN, Si, POWER TRANSISTOR, TO-276AB, HERMETICALLY SEALED, CERAMIC, SMD1, 3 PIN 3A, 60V, NPN, Si, POWER TRANSISTOR, TO-276AB, HERMETICALLY SEALED, CERAMIC, SMD1, 3 PIN 3A, 60V, NPN, Si, POWER TRANSISTOR, TO-276AB, HERMETICALLY SEALED, CERAMIC, SMD1, 3 PIN 3A, 60V, NPN, Si, POWER TRANSISTOR, TO-276AB, HERMETICALLY SEALED, CERAMIC, SMD1, 3 PIN 3A, 60V, NPN, Si, POWER TRANSISTOR, TO-276AB, HERMETICALLY SEALED, CERAMIC, SMD1, 3 PIN
Is it lead-free? Contains lead Lead free Contains lead Lead free Lead free
Is it Rohs certified? incompatible conform to incompatible conform to conform to
Maker SEMELAB SEMELAB SEMELAB SEMELAB SEMELAB
Parts packaging code TO-276AB TO-276AB TO-276AB TO-276AB TO-276AB
package instruction CHIP CARRIER, R-CBCC-N3 CHIP CARRIER, R-CBCC-N3 CHIP CARRIER, R-CBCC-N3 CHIP CARRIER, R-CBCC-N3 CHIP CARRIER, R-CBCC-N3
Contacts 3 3 3 3 3
Reach Compliance Code compliant compliant compliant compliant compliant
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99
Shell connection COLLECTOR COLLECTOR COLLECTOR COLLECTOR COLLECTOR
Maximum collector current (IC) 3 A 3 A 3 A 3 A 3 A
Collector-emitter maximum voltage 60 V 60 V 60 V 60 V 60 V
Configuration SINGLE SINGLE SINGLE SINGLE SINGLE
Minimum DC current gain (hFE) 63 63 63 63 63
JEDEC-95 code TO-276AB TO-276AB TO-276AB TO-276AB TO-276AB
JESD-30 code R-CBCC-N3 R-CBCC-N3 R-CBCC-N3 R-CBCC-N3 R-CBCC-N3
Number of components 1 1 1 1 1
Number of terminals 3 3 3 3 3
Package body material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form CHIP CARRIER CHIP CARRIER CHIP CARRIER CHIP CARRIER CHIP CARRIER
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
Polarity/channel type NPN NPN NPN NPN NPN
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
surface mount YES YES YES YES YES
Terminal form NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
Transistor component materials SILICON SILICON SILICON SILICON SILICON
Nominal transition frequency (fT) 30 MHz 30 MHz 30 MHz 30 MHz 30 MHz
JESD-609 code - e4 - e4 e4
Terminal surface - GOLD - GOLD GOLD
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