IC LVQ SERIES, HEX 1-INPUT INVERT GATE, PDSO14, 0.300 INCH, EIAJ TYPE2, PLASTIC, SOP-14, Gate
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | Toshiba Semiconductor |
| Parts packaging code | SOIC |
| Contacts | 14 |
| Reach Compliance Code | unknown |
| JESD-30 code | R-PDSO-G14 |
| JESD-609 code | e0 |
| Load capacitance (CL) | 50 pF |
| Logic integrated circuit type | INVERTER |
| MaximumI(ol) | 0.012 A |
| Number of terminals | 14 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | SOP |
| Encapsulate equivalent code | SOP14,.3 |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE |
| power supply | 3.3 V |
| Prop。Delay @ Nom-Sup | 15 ns |
| Certification status | Not Qualified |
| Schmitt trigger | YES |
| Nominal supply voltage (Vsup) | 3.3 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| TC74LVQ14F | TC74LVQ14FELP | TC74LVQ14FEL | TC74LVQ14FSEL | TC74LVQ14FSELP | TC74LVQ14FNEL | TC74LVQ14FNELP | |
|---|---|---|---|---|---|---|---|
| Description | IC LVQ SERIES, HEX 1-INPUT INVERT GATE, PDSO14, 0.300 INCH, EIAJ TYPE2, PLASTIC, SOP-14, Gate | IC LVQ SERIES, HEX 1-INPUT INVERT GATE, PDSO14, 0.300 INCH, EIAJ TYPE2, PLASTIC, SOP-14, Gate | IC LVQ SERIES, HEX 1-INPUT INVERT GATE, PDSO14, 0.300 INCH, EIAJ TYPE2, PLASTIC, SOP-14, Gate | IC LVQ SERIES, HEX 1-INPUT INVERT GATE, PDSO14, 0.225 INCH, EIAJ TYPE1, PLASTIC, SSOP-14, Gate | IC LVQ SERIES, HEX 1-INPUT INVERT GATE, PDSO14, 0.225 INCH, EIAJ TYPE1, PLASTIC, SSOP-14, Gate | IC LVQ SERIES, HEX 1-INPUT INVERT GATE, PDSO14, 0.150 INCH, PLASTIC, MS-012AB, SOP-14, Gate | IC LVQ SERIES, HEX 1-INPUT INVERT GATE, PDSO14, 0.150 INCH, PLASTIC, MS-012AB, SOP-14, Gate |
| Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Parts packaging code | SOIC | SOIC | SOIC | SSOP | SSOP | SOIC | SOIC |
| Contacts | 14 | 14 | 14 | 14 | 14 | 14 | 14 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| JESD-30 code | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 |
| Load capacitance (CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| Logic integrated circuit type | INVERTER | INVERTER | INVERTER | INVERTER | INVERTER | INVERTER | INVERTER |
| Number of terminals | 14 | 14 | 14 | 14 | 14 | 14 | 14 |
| Maximum operating temperature | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | SOP | SOP | SOP | LSSOP | LSSOP | SOP | SOP |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Nominal supply voltage (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| surface mount | YES | YES | YES | YES | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| Terminal form | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 0.65 mm | 0.65 mm | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Maker | Toshiba Semiconductor | Toshiba Semiconductor | Toshiba Semiconductor | - | - | Toshiba Semiconductor | Toshiba Semiconductor |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | - | - |
| Terminal surface | Tin/Lead (Sn/Pb) | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | - | - |
| package instruction | - | SOP, | SOP, | LSSOP, | LSSOP, | SOP, | 0.150 INCH, PLASTIC, MS-012AB, SOP-14 |
| Is Samacsys | - | N | N | N | N | - | - |
| series | - | LVQ | LVQ | LVQ | LVQ | LVQ | LVQ |
| length | - | 10.3 mm | 10.3 mm | 5 mm | 5 mm | 8.65 mm | 8.65 mm |
| Number of functions | - | 6 | 6 | 6 | 6 | 6 | 6 |
| Number of entries | - | 1 | 1 | 1 | 1 | 1 | 1 |
| Peak Reflow Temperature (Celsius) | - | 240 | 240 | 240 | 240 | 240 | 240 |
| propagation delay (tpd) | - | 15 ns | 15 ns | 15 ns | 15 ns | 15 ns | 15 ns |
| Maximum seat height | - | 1.9 mm | 1.9 mm | 1.6 mm | 1.6 mm | 1.75 mm | 1.75 mm |
| Maximum supply voltage (Vsup) | - | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| Minimum supply voltage (Vsup) | - | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V |
| Maximum time at peak reflow temperature | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | - | 5.3 mm | 5.3 mm | 4.4 mm | 4.4 mm | 3.9 mm | 3.9 mm |
| Base Number Matches | - | 1 | 1 | 1 | 1 | - | - |
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