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MPC8347ZUAJDA

Description
32-BIT, 533MHz, MICROPROCESSOR, PBGA672, 35 X 35 MM, 1.46 MM HEIGHT, 1 MM PITCH, TBGA-672
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size1MB,120 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Download Datasheet Parametric View All

MPC8347ZUAJDA Overview

32-BIT, 533MHz, MICROPROCESSOR, PBGA672, 35 X 35 MM, 1.46 MM HEIGHT, 1 MM PITCH, TBGA-672

MPC8347ZUAJDA Parametric

Parameter NameAttribute value
MakerNXP
Parts packaging codeBGA
package instructionLBGA,
Contacts672
Reach Compliance Codeunknown
ECCN code3A001.A.3
Other featuresALSO REQUIRES 2.5V AND 3.3V SUPPLY
Address bus width32
bit size32
boundary scanYES
maximum clock frequency66 MHz
External data bus width32
FormatFLOATING POINT
Integrated cacheYES
JESD-30 codeS-PBGA-B672
length35 mm
low power modeYES
Number of terminals672
Package body materialPLASTIC/EPOXY
encapsulated codeLBGA
Package shapeSQUARE
Package formGRID ARRAY, LOW PROFILE
Certification statusNot Qualified
Maximum seat height1.69 mm
speed533 MHz
Maximum supply voltage1.26 V
Minimum supply voltage1.14 V
Nominal supply voltage1.2 V
surface mountYES
technologyCMOS
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
width35 mm
uPs/uCs/peripheral integrated circuit typeMICROPROCESSOR
Freescale Semiconductor
Technical Data
MPC8347EAEC
Rev. 2, 8/2006
MPC8347EA PowerQUICC™ II Pro
Integrated Host Processor Hardware
Specifications
The MPC8347EA contains a PowerPC™ processor core
(built on Power Architecture™ technology) with system
logic for networking, storage, and general-purpose
embedded applications. For functional characteristics of the
processor, refer to the
MPC8349EA PowerQUICC™ II Pro
Integrated Host Processor Reference Manual,
Rev. 0.
To locate published errata or updates for this document,
contact your Freescale sales office.
NOTE
The information in this document is accurate
for revision 3.0 silicon and later. For
information on revision 1.1 silicon and earlier
versions, see the
MPC8347E
PowerQUICC™ II Pro Integrated Host
Processor Hardware Specifications.
See
Section 23.1, “Part Numbers Fully
Addressed by this Document,”
for silicon
revision level determination.
Contents
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . 7
Power Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 12
Clock Input Timing . . . . . . . . . . . . . . . . . . . . . . . . . . 14
RESET Initialization . . . . . . . . . . . . . . . . . . . . . . . . . 16
DDR and DDR2 SDRAM . . . . . . . . . . . . . . . . . . . . . 19
DUART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Ethernet: Three-Speed Ethernet, MII Management . 29
USB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Local Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
JTAG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
I2C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
PCI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
Timers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
GPIO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
SPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
Package and Pin Listings . . . . . . . . . . . . . . . . . . . . . 70
Clocking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
Thermal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103
System Design Information . . . . . . . . . . . . . . . . . . 111
Document Revision History . . . . . . . . . . . . . . . . . . 117
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 117
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© Freescale Semiconductor, Inc., 2006. All rights reserved.
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