|
IDT72255L20PFI |
IDT72265L20PFI |
IDT72265L20TFI |
IDT72255L20TFI |
| Description |
FIFO, 8KX18, 12ns, Synchronous, CMOS, PQFP64, TQFP-64 |
FIFO, 16KX18, 12ns, Synchronous, CMOS, PQFP64, TQFP-64 |
FIFO, 16KX18, 12ns, Synchronous, CMOS, PQFP64, STQFP-64 |
FIFO, 8KX18, 12ns, Synchronous, CMOS, PQFP64, STQFP-64 |
| Is it Rohs certified? |
incompatible |
incompatible |
incompatible |
incompatible |
| Maker |
IDT (Integrated Device Technology) |
IDT (Integrated Device Technology) |
IDT (Integrated Device Technology) |
IDT (Integrated Device Technology) |
| Parts packaging code |
QFP |
QFP |
QFP |
QFP |
| package instruction |
TQFP-64 |
TQFP-64 |
STQFP-64 |
STQFP-64 |
| Contacts |
64 |
64 |
64 |
64 |
| Reach Compliance Code |
not_compliant |
not_compliant |
not_compliant |
not_compliant |
| ECCN code |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
| Maximum access time |
12 ns |
12 ns |
12 ns |
12 ns |
| Other features |
RETRANSMIT; AUTO POWER DOWN; EASY EXPANDABLE IN DEPTH AND WIDTH |
RETRANSMIT; AUTO POWER DOWN; EASY EXPANDABLE IN DEPTH AND WIDTH |
RETRANSMIT; AUTO POWER DOWN; EASY EXPANDABLE IN DEPTH AND WIDTH |
RETRANSMIT; AUTO POWER DOWN; EASY EXPANDABLE IN DEPTH AND WIDTH |
| Maximum clock frequency (fCLK) |
50 MHz |
50 MHz |
50 MHz |
50 MHz |
| period time |
20 ns |
20 ns |
20 ns |
20 ns |
| JESD-30 code |
S-PQFP-G64 |
S-PQFP-G64 |
S-PQFP-G64 |
S-PQFP-G64 |
| JESD-609 code |
e0 |
e0 |
e0 |
e0 |
| length |
14 mm |
14 mm |
10 mm |
10 mm |
| memory density |
147456 bit |
294912 bit |
294912 bit |
147456 bit |
| Memory IC Type |
OTHER FIFO |
OTHER FIFO |
OTHER FIFO |
OTHER FIFO |
| memory width |
18 |
18 |
18 |
18 |
| Humidity sensitivity level |
3 |
3 |
3 |
3 |
| Number of functions |
1 |
1 |
1 |
1 |
| Number of terminals |
64 |
64 |
64 |
64 |
| word count |
8192 words |
16384 words |
16384 words |
8192 words |
| character code |
8000 |
16000 |
16000 |
8000 |
| Operating mode |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
| Maximum operating temperature |
85 °C |
85 °C |
85 °C |
85 °C |
| Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
| organize |
8KX18 |
16KX18 |
16KX18 |
8KX18 |
| Exportable |
YES |
YES |
YES |
YES |
| Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
| encapsulated code |
LQFP |
LQFP |
LFQFP |
LFQFP |
| Encapsulate equivalent code |
QFP64,.66SQ,32 |
QFP64,.66SQ,32 |
QFP64,.47SQ,20 |
QFP64,.47SQ,20 |
| Package shape |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
| Package form |
FLATPACK, LOW PROFILE |
FLATPACK, LOW PROFILE |
FLATPACK, LOW PROFILE, FINE PITCH |
FLATPACK, LOW PROFILE, FINE PITCH |
| Parallel/Serial |
PARALLEL |
PARALLEL |
PARALLEL |
PARALLEL |
| power supply |
5 V |
5 V |
5 V |
5 V |
| Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
| Maximum seat height |
1.6 mm |
1.6 mm |
1.6 mm |
1.6 mm |
| Maximum standby current |
0.015 A |
0.015 A |
0.015 A |
0.015 A |
| Maximum slew rate |
0.18 mA |
0.18 mA |
0.18 mA |
0.18 mA |
| Maximum supply voltage (Vsup) |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
| Minimum supply voltage (Vsup) |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
| Nominal supply voltage (Vsup) |
5 V |
5 V |
5 V |
5 V |
| surface mount |
YES |
YES |
YES |
YES |
| technology |
CMOS |
CMOS |
CMOS |
CMOS |
| Temperature level |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
| Terminal surface |
Tin/Lead (Sn85Pb15) |
Tin/Lead (Sn85Pb15) |
Tin/Lead (Sn85Pb15) |
Tin/Lead (Sn85Pb15) |
| Terminal form |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
| Terminal pitch |
0.8 mm |
0.8 mm |
0.5 mm |
0.5 mm |
| Terminal location |
QUAD |
QUAD |
QUAD |
QUAD |
| width |
14 mm |
14 mm |
10 mm |
10 mm |