FIFO, 4KX9, 15ns, Asynchronous, CQCC32, LCC-32
| Parameter Name | Attribute value |
| Maker | IDT (Integrated Device Technology) |
| Parts packaging code | QFJ |
| package instruction | QCCN, |
| Contacts | 32 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Maximum access time | 15 ns |
| period time | 25 ns |
| JESD-30 code | R-CQCC-N32 |
| JESD-609 code | e0 |
| memory density | 36864 bit |
| memory width | 9 |
| Number of functions | 1 |
| Number of terminals | 32 |
| word count | 4096 words |
| character code | 4000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| organize | 4KX9 |
| Exportable | NO |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | QCCN |
| Package shape | RECTANGULAR |
| Package form | CHIP CARRIER |
| Parallel/Serial | PARALLEL |
| Certification status | Not Qualified |
| surface mount | YES |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | TIN LEAD |
| Terminal form | NO LEAD |
| Terminal location | QUAD |
| IDT72B04S15LB | IDT72B04S15JB | IDT72B04S15P | IDT72B04S15PB | IDT72B04S15L | IDT72B04S15J | IDT72B04S15DB | IDT72B04S15D | |
|---|---|---|---|---|---|---|---|---|
| Description | FIFO, 4KX9, 15ns, Asynchronous, CQCC32, LCC-32 | FIFO, 4KX9, 15ns, Asynchronous, PQCC32, PLASTIC, LCC-32 | FIFO, 4KX9, 15ns, Asynchronous, PDIP28, PLASTIC, DIP-28 | FIFO, 4KX9, 15ns, Asynchronous, PDIP28, PLASTIC, DIP-28 | FIFO, 4KX9, 15ns, Asynchronous, CQCC32, LCC-32 | FIFO, 4KX9, 15ns, Asynchronous, PQCC32, PLASTIC, LCC-32 | FIFO, 4KX9, 15ns, Asynchronous, CDIP28, CERDIP-28 | FIFO, 4KX9, 15ns, Asynchronous, CDIP28, CERDIP-28 |
| Parts packaging code | QFJ | QFJ | DIP | DIP | QFJ | QFJ | DIP | DIP |
| package instruction | QCCN, | PLASTIC, LCC-32 | DIP, | DIP, | QCCN, | PLASTIC, LCC-32 | DIP, | DIP, |
| Contacts | 32 | 32 | 28 | 28 | 32 | 32 | 28 | 28 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Maximum access time | 15 ns | 15 ns | 15 ns | 15 ns | 15 ns | 15 ns | 15 ns | 15 ns |
| period time | 25 ns | 25 ns | 25 ns | 25 ns | 25 ns | 25 ns | 25 ns | 25 ns |
| JESD-30 code | R-CQCC-N32 | R-PQCC-J32 | R-PDIP-T28 | R-PDIP-T28 | R-CQCC-N32 | R-PQCC-J32 | R-GDIP-T28 | R-GDIP-T28 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| memory density | 36864 bit | 36864 bit | 36864 bit | 36864 bit | 36864 bit | 36864 bit | 36864 bit | 36864 bit |
| memory width | 9 | 9 | 9 | 9 | 9 | 9 | 9 | 9 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 32 | 32 | 28 | 28 | 32 | 32 | 28 | 28 |
| word count | 4096 words | 4096 words | 4096 words | 4096 words | 4096 words | 4096 words | 4096 words | 4096 words |
| character code | 4000 | 4000 | 4000 | 4000 | 4000 | 4000 | 4000 | 4000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C | 125 °C | 70 °C | 125 °C | 70 °C | 70 °C | 125 °C | 70 °C |
| organize | 4KX9 | 4KX9 | 4KX9 | 4KX9 | 4KX9 | 4KX9 | 4KX9 | 4KX9 |
| Exportable | NO | NO | NO | NO | NO | NO | NO | NO |
| Package body material | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| encapsulated code | QCCN | QCCJ | DIP | DIP | QCCN | QCCJ | DIP | DIP |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | CHIP CARRIER | CHIP CARRIER | IN-LINE | IN-LINE | CHIP CARRIER | CHIP CARRIER | IN-LINE | IN-LINE |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| surface mount | YES | YES | NO | NO | YES | YES | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY | COMMERCIAL | MILITARY | COMMERCIAL | COMMERCIAL | MILITARY | COMMERCIAL |
| Terminal surface | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
| Terminal form | NO LEAD | J BEND | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | J BEND | THROUGH-HOLE | THROUGH-HOLE |
| Terminal location | QUAD | QUAD | DUAL | DUAL | QUAD | QUAD | DUAL | DUAL |
| Maker | IDT (Integrated Device Technology) | - | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |