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SST26VF032B-104I/SM

Description
NOR Flash Serial (SPI, Dual SPI, Quad SPI) 3V/3.3V 32M-bit 32M/16M/8M x 1/2-bit/4-bit 8-Pin SOIJ Tube
Categorystorage    storage   
File Size1MB,81 Pages
ManufacturerMicrochip
Websitehttps://www.microchip.com
Environmental Compliance
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SST26VF032B-104I/SM Overview

NOR Flash Serial (SPI, Dual SPI, Quad SPI) 3V/3.3V 32M-bit 32M/16M/8M x 1/2-bit/4-bit 8-Pin SOIJ Tube

SST26VF032B-104I/SM Parametric

Parameter NameAttribute value
EU restricts the use of certain hazardous substancesCompliant
ECCN (US)3A991b.1.a.
Part StatusActive
HTS8542.32.00.71
Cell TypeNOR
Chip Density (bit)32M
ArchitectureSectored
Boot BlockYes
Block OrganizationSymmetrical
Location of Boot BlockBottom|Top
Address Bus Width (bit)32
Sector Size4Kbyte x 1024
Page Size256byte
Number of Bits/Word (bit)1/2/4
Number of Words32M/16M/8M
ProgrammabilityYes
Timing TypeSynchronous
Maximum Erase Time (S)0.05/Chip
Maximum Programming Time (ms)1.5/Page
Process TechnologyCMOS
Interface TypeSerial (SPI, Dual SPI, Quad SPI)
Minimum Operating Supply Voltage (V)2.3
Typical Operating Supply Voltage (V)3|3.3
Maximum Operating Supply Voltage (V)3.6
Programming Voltage (V)2.7 to 3.6
Operating Current (mA)20
Program Current (mA)25
Minimum Operating Temperature (°C)-40
Maximum Operating Temperature (°C)85
Supplier Temperature GradeIndustrial
Command CompatibleNo
ECC SupportNo
Support of Page ModeNo
Minimum Endurance (Cycles)100000
PackagingTube
Supplier PackageSOIJ
Pin Count8
Standard Package NameSOP
MountingSurface Mount
Package Height1.98(Max)
Package Length5.26
Package Width5.25
PCB changed8
Lead ShapeGull-wing
SST26VF032B/SST26VF032BA
2.5V/3.0V 32-Mbit Serial Quad I/O™ (SQI™) Flash Memory
Features
• Single Voltage Read and Write Operations:
- 2.7V-3.6V or 2.3V-3.6V
• Serial Interface Architecture:
- Nibble-wide multiplexed I/O’s with SPI-like serial
command structure
- Mode 0 and Mode 3
- x1/x2/x4 Serial Peripheral Interface (SPI) Protocol
• High-Speed Clock Frequency:
- 2.7V-3.6V: 104 MHz maximum
- 2.3V-3.6V: 80 MHz maximum
• Burst Modes:
- Continuous linear burst
- 8/16/32/64 Byte linear burst with wrap-around
• Superior Reliability:
- Endurance: 100,000 Cycles (minimum)
- Greater than 100 years Data Retention
• Low-Power Consumption:
- Active Read current: 15 mA (typical @ 104 MHz)
- Standby Current: 15 µA (typical)
• Fast Erase Time:
- Sector/Block Erase: 18 ms (typ), 25 ms
(maximum)
- Chip Erase: 35 ms (typical), 50 ms (maximum)
• Page-Program:
- 256 bytes per page in x1 or x4 mode
• End-of-Write Detection:
- Software polling BUSY bit in STATUS register
• Flexible Erase Capability:
- Uniform 4-Kbyte sectors
- Four 8-KByte top and bottom parameter overlay
blocks
- One 32-Kbyte top and bottom overlay block
- Uniform 64-Kbyte overlay blocks
• Write-Suspend:
- Suspend Program or Erase operation to access
another block/sector
• Software Reset (RST) mode
• Software Write Protection:
- Individual-Block Write Protection with permanent
lock-down capability
- 64-Kbyte blocks, two 32-Kbyte blocks, and
eight 8-Kbyte parameter blocks
- Read Protection on top and bottom 8-Kbyte
parameter blocks
• Security ID:
- One-Time Programmable (OTP) 2-KByte, Secure ID:
- 64-bit unique, factory preprogrammed identifier
- User-programmable area
• Temperature Range:
- Industrial: -40°C to +85°C
- Industrial Plus: -40°C to +105°C
- Extended: -40°C to +125°C
• Automotive AEC-Q100 Grade 1, Grade 2 and
Grade 3
• Packages Available:
- 8-contact WDFN (6 mm x 5 mm)
- 8-lead SOIJ (5.28 mm)
- 24-ball TBGA (6 mm x 8 mm)
• All Devices are RoHS Compliant
Product Description
The Serial Quad I/O™ (SQI™) family of Flash memory
devices features a six-wire, 4-bit I/O interface that allows for
low-power, high-performance operation in a low pin-count
package. SST26VF032B/032BA also support full com-
mand-set compatibility to traditional Serial Peripheral Inter-
face (SPI) protocol. System designs using SQI Flash
devices occupy less board space and ultimately lower
system costs.
All members of the 26 Series, SQI family are manufactured
with proprietary, high-performance CMOS SuperFlash
®
technology. The split-gate cell design and thick-oxide tun-
neling injector attain better reliability and manufacturability
compared with alternate approaches.
SST26VF032B/032BA significantly improve performance
and reliability, while lowering power consumption. These
devices write (Program or Erase) with a single power supply
of 2.3-3.6V. The total energy consumed is a function of the
applied voltage, current, and time of application. Since for
any given voltage range, the SuperFlash technology uses
less current to program and has a shorter erase time, the
total energy consumed during any Erase or Program opera-
tion is less than alternative Flash memory technologies.
Two configurations are available upon order.
SST26VF032B default at power-up has the WP# and
HOLD# pins enabled, and the SIO2 and SIO3 pins
disabled,
to
initiate
SPI-protocol
operations.
SST26VF032BA default at power-up has the WP# and
HOLD# pins disabled, and the SIO2 and SIO3 pins
enabled, to initiate Quad I/O operations. See
Section 4.5.8 “I/O Configuration (IOC)”
for more
information about configuring WP#/HOLD# and SIO2/
SIO3 pins. See
Figure 2-1
for pin assignments.
DS20005218J-page 1
2013-2020 Microchip Technology Inc.

SST26VF032B-104I/SM Related Products

SST26VF032B-104I/SM SST26VF032BT-104I/SM
Description NOR Flash Serial (SPI, Dual SPI, Quad SPI) 3V/3.3V 32M-bit 32M/16M/8M x 1/2-bit/4-bit 8-Pin SOIJ Tube NOR Flash Serial (SPI, Dual SPI, Quad SPI) 3V/3.3V 32M-bit 32M/16M/8M x 1/2-bit/4-bit 8-Pin SOIJ T/R
EU restricts the use of certain hazardous substances Compliant Compliant
ECCN (US) 3A991b.1.a. 3A991b.1.a.
Part Status Active Active
HTS 8542.32.00.71 8542.32.00.71
Cell Type NOR NOR
Chip Density (bit) 32M 32M
Architecture Sectored Sectored
Boot Block Yes Yes
Block Organization Symmetrical Symmetrical
Location of Boot Block Bottom|Top Top|Bottom
Address Bus Width (bit) 32 32
Sector Size 4Kbyte x 1024 4Kbyte x 1024
Page Size 256byte 256byte
Number of Bits/Word (bit) 1/2/4 1/2/4
Number of Words 32M/16M/8M 32M/16M/8M
Programmability Yes Yes
Timing Type Synchronous Synchronous
Maximum Erase Time (S) 0.05/Chip 0.05/Chip
Maximum Programming Time (ms) 1.5/Page 1.5/Page
Process Technology CMOS CMOS
Interface Type Serial (SPI, Dual SPI, Quad SPI) Serial (SPI, Dual SPI, Quad SPI)
Minimum Operating Supply Voltage (V) 2.3 2.3
Typical Operating Supply Voltage (V) 3|3.3 3.3|3
Maximum Operating Supply Voltage (V) 3.6 3.6
Programming Voltage (V) 2.7 to 3.6 2.7 to 3.6
Operating Current (mA) 20 20
Program Current (mA) 25 25
Minimum Operating Temperature (°C) -40 -40
Maximum Operating Temperature (°C) 85 85
Supplier Temperature Grade Industrial Industrial
Command Compatible No No
ECC Support No No
Support of Page Mode No No
Minimum Endurance (Cycles) 100000 100000
Packaging Tube Tape and Reel
Supplier Package SOIJ SOIJ
Pin Count 8 8
Standard Package Name SOP SOP
Mounting Surface Mount Surface Mount
Package Height 1.98(Max) 1.98(Max)
Package Length 5.26 5.26
Package Width 5.25 5.25
PCB changed 8 8
Lead Shape Gull-wing Gull-wing

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