EEWORLDEEWORLDEEWORLD

Part Number

Search

MT28C128516W18DFW-F605P70TBWT

Description
Memory Circuit, 4MX16, CMOS, PBGA77, FBGA-77
Categorystorage    storage   
File Size200KB,15 Pages
ManufacturerMicron Technology
Websitehttp://www.mdtic.com.tw/
Download Datasheet Parametric View All

MT28C128516W18DFW-F605P70TBWT Overview

Memory Circuit, 4MX16, CMOS, PBGA77, FBGA-77

MT28C128516W18DFW-F605P70TBWT Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerMicron Technology
Parts packaging codeBGA
package instructionLFBGA,
Contacts77
Reach Compliance Codecompliant
Other featuresCELLULARRAM IS ORGANIZED AS 1M X 16; CONTAINS ADDITIONAL 4M X 16 FLASH
JESD-30 codeR-PBGA-B77
JESD-609 codee0
length10 mm
memory density67108864 bit
Memory IC TypeMEMORY CIRCUIT
memory width16
Number of functions1
Number of terminals77
word count4194304 words
character code4000000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-25 °C
organize4MX16
Package body materialPLASTIC/EPOXY
encapsulated codeLFBGA
Package shapeRECTANGULAR
Package formGRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)235
Certification statusNot Qualified
Maximum seat height1.4 mm
Maximum supply voltage (Vsup)1.95 V
Minimum supply voltage (Vsup)1.7 V
surface mountYES
technologyCMOS
Temperature levelOTHER
Terminal surfaceTIN LEAD SILVER
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature30
width8 mm
128Mb MULTIBANK ASYNC/PAGE OR BURST FLASH
16Mb/32Mb/64Mb ASYNC/PAGE CellularRAM
FLASH AND
COMBO MEMORY
Features
CellularRAM
MT28C128516W18/W30D (ADVANCE
‡‡
)
MT28C128532W18/W30D
MT28C128564W18/W30D
Low Voltage, Wireless Temperature
Stacked die Combo package
• Includes two 64Mb Flash devices
• Choice of either 16Mb, 32Mb, or 64Mb
CellularRAM device
Basic configuration
Flash
• Flexible multibank architecture
• 4 Meg x 16 configuration
• Async/Page/Burst interface
• Support for true concurrent operations with no
latency
CellularRAM
• Low-power, high-density design
• 1 Meg x 16, 2 Meg x 16, or 4 Meg x 16 configurations
• Async/Page interface
F_V
CC
, V
CC
Q, F_V
PP
, C_V
CC
voltages
• 1.70V (MIN)/1.95V (MAX) F_V
CC
, C_V
CC
• 1.70V (MIN)/2.24V (MAX) V
CC
Q (W18)
• 2.20V (MIN)/3.30V (MAX) V
CC
Q (W30)
• 1.80V (TYP) F_V
PP
(in-system PROGRAM/ERASE)
• 12V ±5% (HV) F_V
PP
tolerant (factory programming
compatibility)
Fast programming Algorithm (FPA)
Enhanced suspend options
• ERASE-SUSPEND-to-READ within same bank
• PROGRAM-SUSPEND-to-READ within same bank
• ERASE-SUSPEND-to-PROGRAM within same bank
Each Flash contains two 64-bit chip protection registers
for security purposes
100,000 ERASE cycles per block
Cross-compatible command set support
• Extended command set
• Common Flash interface (CFI) compliant
Manufacturer’s Identification Code (ManID)
Micron
®
Intel
®
‡‡
Figure 1: 77-Ball FBGA
1
A
B
C
D
E
F
G
H
J
K
A4
2
A18
3
A19
4
C_VSS
5
F_VCC
6
F_VCC
7
A21
8
A11
A5
C_LB#
C_VSS
NC
F_CLK
RFU
A12
A3
A17
F_VPP
C_WE#
C_CE#
A9
A13
A2
A7
F_WP#
F_ADV#
A20
A10
A15
A1
A6
C_UB#
F_RST#
F_WE#
A8
A14
A16
A0
DQ8
DQ2
DQ10
DQ5
DQ13
F_WAIT#
F_CE2#
C_OE#
DQ0
DQ1
DQ3
DQ12
DQ14
DQ7
F_OE2#
NC
F_OE1#
DQ9
DQ11
DQ4
DQ6
DQ15
VCCQ
F_CE1#
NC
NC
NC
C_VCC
F_VCC
VCCQ
C_ZZ#
C_VSS
VSSQ
VCCQ
F_VCC
C_VSS
VSSQ
F_VSS
C_VSS
Top View
(Ball Down)
NOTE:
Balls B6, D5, and F7 are only used for Flash burst operation.
MT28C128516W18/W30D is advance status.
Options
Flash Timing
• 60ns (W18)
1
• 70ns (W18/W30)
Flash Burst Frequency
• 66 MHz
1
(W18)
• 54 MHz (W18/W30)
Flash Boot Block Configuration
• Top/Top
• Top/Bottom
• Bottom/Top
• Bottom/Bottom
CellularRAM Timing
• 70ns
• 85ns
I/O Voltage Range
• VccQ 1.70V–2.24V (W18)
• VccQ 2.20V–3.30V (W30)
Manufacturer’s Identification Code (ManID)
• Micron (0x2Ch)
• Intel (0x89h)
Operating Temperature Range
• Wireless Temperature (-25°C to +85°C)
Package
• 77-ball FBGA (Standard) 8 x 10 grid
• 77-ball FBGA (Lead-free) 8 x 10 grid
2
NOTE:
1. Contact factory for availability.
2. Contact factory for details.
09005aef80b10a55
MT28C128564W18D.fm - Rev. F Pub 2/04 EN
1
‡‡
©2004 Micron Technology, Inc. All rights reserved.
PRODUCTS AND SPECIFICATIONS DISCUSSED HEREIN ARE SUBJECT TO CHANGE BY MICRON WITHOUT NOTICE. PRODUCTS AND SPECIFICATIONS DIS-
CUSSED HEREIN ARE FOR EVALUATION AND REFERENCE PURPOSES ONLY AND ARE SUBJECT TO CHANGE
BY
MICRON WITHOUT NOTICE. PRODUCTS ARE
ONLY WARRANTED BY MICRON TO MEET MICRON'S PRODUCTION DATA SHEET SPECIFICATIONS.
Have you ever used Shenzhen Yuanfeng's ARM development experiment box S32410?
Are there any friends who have used Shenzhen Yuanfeng's ARM development experiment box S32410? They no longer provide technical support, and I would like to communicate with you!...
nwf1987 ARM Technology
Will periodically (10ms) calling the fprintf function to store data (100 bytes) in real time to an electronic disk cause serious damage to the hard disk?
[font=宋体][size=4]In the project, the fprintf function is called periodically (10ms) to store data (100 bytes) in real time to the electronic disk. The operation flow of each cycle is: call fopen to op...
wpz123321 Embedded System
Recruiting QT software engineers (PC side), QT software engineers (Linux side), hardware design engineers, R&D test engineers,...
Company Introduction: Shenzhen Sigowill Bio Meditech Limited was established in 2013. It has been focusing on the technology development and innovation in the field of professional medical systems, pr...
whiteclh Recruitment
11 years of electric competition DC-AC power supply based on stm32f407 program
stm32f407TIM1 outputs 2 complementary PWMs with dead time, and timer 3 overflow interrupt is used to determine the falling edge to lock frequency and phase...
轩轩black Electronics Design Contest
A simple dialog program is created in EVC4.0. The following error occurs when running.
I created a simple dialog program in EVC4.0. When running it, the following phenomenon occurred: Downloading files Failed downloading. This is my first time using it. I don't know if it is an error. I...
blueeyeheyin Embedded System
Configuration problem of UART chip during dsp serial communication
I'm looking at SEED's 6713 UART routines recently, and there are a few things I don't understand. I can't verify it without a development board, please give me some advice. The following is the connec...
背着氧气的鱼 DSP and ARM Processors

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1797  2209  1811  1746  269  37  45  36  6  50 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号