M35B32-WMC6G datasheet, PDF - EEWORLD Datasheet

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M35B32-WMC6G: Description4KX8 SPI BUS SERIAL EEPROM, PDSO8, 2 X 3 MM, ROHS COMPLIANT, UFDFPN-8; Categorystorage storage; File Size321KB，42 Pages; ManufacturerSTMicroelectronics; Websitehttp://www.st.com/; Environmental Compliance

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M35B32-WMC6G Overview

4KX8 SPI BUS SERIAL EEPROM, PDSO8, 2 X 3 MM, ROHS COMPLIANT, UFDFPN-8

M35B32-WMC6G Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	STMicroelectronics
Parts packaging code	DFP
package instruction	2 X 3 MM, ROHS COMPLIANT, UFDFPN-8
Contacts	8
Reach Compliance Code	compliant
ECCN code	EAR99
Maximum clock frequency (fCLK)	10 MHz
Data retention time - minimum	40
Durability	1000000 Write/Erase Cycles
JESD-30 code	R-PDSO-G8
length	4.4 mm
memory density	32768 bit
Memory IC Type	EEPROM
memory width	8
Number of functions	1
Number of terminals	8
word count	4096 words
character code	4000
Operating mode	SYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-40 °C
organize	4KX8
Package body material	PLASTIC/EPOXY
encapsulated code	TSSOP
Encapsulate equivalent code	SOLCC8,.11,20
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial	SERIAL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	3/5 V
Certification status	Not Qualified
Maximum seat height	1.2 mm
Serial bus type	SPI
Maximum standby current	0.000005 A
Maximum slew rate	0.004 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	2.5 V
surface mount	YES
technology	CMOS
Temperature level	AUTOMOTIVE
Terminal form	GULL WING
Terminal pitch	0.65 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	3 mm
Maximum write cycle time (tWC)	5 ms
write protect	HARDWARE

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M35B32

32 Kbit, 256-byte page, fast program EEPROM memory

accessed by SPI bus interface

Target specification

Features

■

SPI bus compatible serial interface

32 Kbit of EEPROM divided into two sectors:

– Data sector

– Event sector

Large page size: 256 bytes

Fast programming:

– Event sector: 256 bytes programmed in

less than 1 ms

– Data sector: 256 bytes written in less than

5 ms

Low energy EEPROM in either Read, Write,

Program or Erase modes

2.5 V to 5.5 V single supply voltage

Operating temperature range:

– –40°C to +85°C

– –40°C to +125°C

Operating frequency, f

= 20 MHz

Electronic signature: 20 10 0Ch

Data cycling:

– Data sector: more than 1 Million write

cycles

– Event sector: more than 10 000 write

cycles

Data retention:

– Data sector: more than 40 years’ data

retention

– Event sector: 1 year

Packages

– ECOPACK

(RoHS compliant)

UFDFPN8 (MC)

2 x 3 mm

SO8 (MN)

150 mil width

■

TSSOP8 (DW)

169 mil width

■

May 2011

Doc ID 18391 Rev 3

1/42

www.st.com

This is preliminary information on a new product foreseen to be developed. Details are subject to change without notice.

Contents

M35B32

Contents

Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Signal description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

2.1

2.2

2.3

2.4

2.5

2.6

2.7

2.8

Serial Data output (Q) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Serial Data input (D) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Serial Clock (C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Chip Select (S) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Reset (RESET) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Write Protect (W) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

supply voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

SPI modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Operating features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

4.1

4.2

4.3

4.4

An easy way to modify data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

A fast way to store data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Polling during a write, program or erase cycle . . . . . . . . . . . . . . . . . . . . . 12

Protection modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Memory organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

6.1

6.2

6.3

6.4

Write Enable (WREN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Write Disable (WRDI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Read Identification (RDID) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

Read Status Register (RDSR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

6.4.1

6.4.2

6.4.3

WIP bit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

WEL bit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

BPi bits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

6.5

6.6

6.7

2/42

Write Status Register (WRSR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

Read Data Bytes (READ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Page Write (PW) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Doc ID 18391 Rev 3

List of tables

M35B32

List of tables

Table 1.

Table 2.

Table 3.

Table 4.

Table 5.

Table 6.

Table 7.

Table 8.

Table 9.

Table 10.

Table 11.

Table 12.

Table 13.

Table 14.

Table 15.

Table 16.

Signal names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Instruction set . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Read Identification (RDID) data-out sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

Value of the WEL bit after decoding a Page Write, Page Program, Page

Erase or Sector Erase instruction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

Operating conditions (range 6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

Operating conditions (range 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

AC measurement conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

DC characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

SO8N – 8-lead plastic small outline, 150 mils body width, mechanical data . . . . . . . . . . . 37

TSSOP8 – 8-lead thin shrink small outline, package mechanical data. . . . . . . . . . . . . . . . 38

UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead

2 x 3 mm, data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

4/42

Doc ID 18391 Rev 3

M35B32

List of figures

Figure 1.

Figure 2.

Figure 3.

Figure 4.

Figure 5.

Figure 6.

Figure 7.

Figure 8.

Figure 9.

Figure 10.

Figure 11.

Figure 12.

Figure 13.

Figure 14.

Figure 15.

Figure 16.

Figure 17.

Figure 18.

Figure 19.

Figure 20.

Figure 21.

Figure 22.

Figure 23.

Figure 24.

Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

8-pin package connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

SPI modes supported . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Bus master and memory devices on the SPI bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Memory organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Write Enable (WREN) instruction sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Write Disable (WRDI) instruction sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Read Identification (RDID) instruction sequence and data-out sequence . . . . . . . . . . . . . 18

Read Status Register (RDSR) instruction sequence and data-out sequence . . . . . . . . . . 20

Write Status Register (WRSR) instruction sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

Read Data Bytes (READ) instruction sequence and data-out sequence . . . . . . . . . . . . . . 22

Page Write (PW) instruction sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

Page Program (PP) instruction sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

Page Erase (PE) instruction sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

Sector Erase (SE) instruction sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

AC measurement I/O waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

Serial input timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

Write Protect setup and hold timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

Output timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

Reset AC waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

SO8N – 8-lead plastic small outline, 150 mils body width, package outline . . . . . . . . . . . . 37

TSSOP8 – 8-lead thin shrink small outline, package outline . . . . . . . . . . . . . . . . . . . . . . . 38

Ultra thin Fine pitch Dual Flat Package No lead (UFDFPN8), 2 × 3mm

package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

Doc ID 18391 Rev 3

5/42

M35B32-WMC6G Related Products

	M35B32-WMC6G	M35B32-WMC63GK	M35B32-WDW3P/K	M35B32-WMC3TP/K	M35B32-WMC3TG/K	M35B32-WMC3P/K	M35B32-WMN3G/K	M35B32-WMN3P/K	M35B32-WDW3TP/K
Description	4KX8 SPI BUS SERIAL EEPROM, PDSO8, 2 X 3 MM, ROHS COMPLIANT, UFDFPN-8	IC,SERIAL EEPROM,4KX8,CMOS,LLCC,8PIN,PLASTIC	4KX8 SPI BUS SERIAL EEPROM, PDSO8, ROHS COMPLIANT, TSSOP-8	4KX8 SPI BUS SERIAL EEPROM, PDSO8, 2 X 3 MM, ROHS COMPLIANT, UFDFPN-8	4KX8 SPI BUS SERIAL EEPROM, PDSO8, 2 X 3 MM, ROHS COMPLIANT, UFDFPN-8	4KX8 SPI BUS SERIAL EEPROM, PDSO8, 2 X 3 MM, ROHS COMPLIANT, UFDFPN-8	4KX8 SPI BUS SERIAL EEPROM, PDSO8, 0.150 INCH, ROHS COMPLIANT, PLASTIC, SOP-8	4KX8 SPI BUS SERIAL EEPROM, PDSO8, 0.150 INCH, ROHS COMPLIANT, PLASTIC, SOP-8	4KX8 SPI BUS SERIAL EEPROM, PDSO8, ROHS COMPLIANT, TSSOP-8
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to	conform to	conform to	conform to
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compli
JESD-30 code	R-PDSO-G8	R-PDSO-N8	R-PDSO-G8	R-PDSO-N8	R-PDSO-N8	R-PDSO-N8	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8
memory density	32768 bit	32768 bit	32768 bit	32768 bit	32768 bit	32768 bit	32768 bit	32768 bit	32768 bi
Memory IC Type	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM
memory width	8	8	8	8	8	8	8	8	8
Number of terminals	8	8	8	8	8	8	8	8	8
word count	4096 words	4096 words	4096 words	4096 words	4096 words	4096 words	4096 words	4096 words	4096 words
character code	4000	4000	4000	4000	4000	4000	4000	4000	4000
Maximum operating temperature	125 °C	85 °C	125 °C	125 °C	125 °C	125 °C	85 °C	85 °C	125 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
organize	4KX8	4KX8	4KX8	4KX8	4KX8	4KX8	4KX8	4KX8	4KX8
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TSSOP	SON	SOP	HVSON	HVSON	HVSON	TSSOP	TSSOP	SOP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE
Parallel/Serial	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL
Serial bus type	SPI	SPI	SPI	SPI	SPI	SPI	SPI	SPI	SPI
surface mount	YES	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	AUTOMOTIVE	INDUSTRIAL	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	INDUSTRIAL	INDUSTRIAL	AUTOMOTIVE
Terminal form	GULL WING	NO LEAD	GULL WING	NO LEAD	NO LEAD	NO LEAD	GULL WING	GULL WING	GULL WING
Terminal pitch	0.65 mm	0.5 mm	1.27 mm	0.5 mm	0.5 mm	0.5 mm	0.65 mm	0.65 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maker	STMicroelectronics	-	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics
Parts packaging code	DFP	-	SOIC	DFP	DFP	DFP	SOIC	SOIC	SOIC
package instruction	2 X 3 MM, ROHS COMPLIANT, UFDFPN-8	-	ROHS COMPLIANT, TSSOP-8	2 X 3 MM, ROHS COMPLIANT, UFDFPN-8	HVSON,	HVSON,	0.150 INCH, ROHS COMPLIANT, PLASTIC, SOP-8	0.150 INCH, ROHS COMPLIANT, PLASTIC, SOP-8	SOP, TSSOP8,.25
Contacts	8	-	8	8	8	8	8	8	8
ECCN code	EAR99	-	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum clock frequency (fCLK)	10 MHz	-	10 MHz	10 MHz	10 MHz	10 MHz	10 MHz	10 MHz	10 MHz
Data retention time - minimum	40	40	40	-	-	-	40	40	40
Durability	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	-	-	-	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles
length	4.4 mm	-	4.9 mm	3 mm	3 mm	3 mm	4.4 mm	4.4 mm	4.9 mm
Number of functions	1	-	1	1	1	1	1	1	1
Operating mode	SYNCHRONOUS	-	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Encapsulate equivalent code	SOLCC8,.11,20	SOLCC8,.11,20	TSSOP8,.25	-	-	-	SOP8,.25	SOP8,.25	TSSOP8,.25
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	3/5 V	3/5 V	3/5 V	-	-	-	3/5 V	3/5 V	3/5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	-	-	-	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.2 mm	-	1.75 mm	0.6 mm	0.6 mm	0.6 mm	1.2 mm	1.2 mm	1.75 mm
Maximum standby current	0.000005 A	0.000005 A	0.000005 A	-	-	-	0.000005 A	0.000005 A	0.000005 A
Maximum slew rate	0.004 mA	0.004 mA	0.004 mA	-	-	-	0.004 mA	0.004 mA	0.004 mA
Maximum supply voltage (Vsup)	5.5 V	-	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	2.5 V	-	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V
Maximum time at peak reflow temperature	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	3 mm	-	3.9 mm	2 mm	2 mm	2 mm	3 mm	3 mm	3.9 mm
Maximum write cycle time (tWC)	5 ms	-	5 ms	5 ms	5 ms	5 ms	5 ms	5 ms	5 ms
write protect	HARDWARE	HARDWARE	HARDWARE	-	-	-	HARDWARE	HARDWARE	HARDWARE

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