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LMC555CBP

Description
1 Func, 3MHz, CMOS, PBGA8, MO-211BC, SMD-8
CategoryAnalog mixed-signal IC    The signal circuit   
File Size2MB,19 Pages
ManufacturerRochester Electronics
Websitehttps://www.rocelec.com/
Download Datasheet Parametric Compare View All

LMC555CBP Overview

1 Func, 3MHz, CMOS, PBGA8, MO-211BC, SMD-8

LMC555CBP Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerRochester Electronics
Parts packaging codeDSBGA
package instructionMO-211BC, SMD-8
Contacts8
Reach Compliance Codeunknown
ECCN codeEAR99
Analog Integrated Circuits - Other TypesPULSE; RECTANGULAR
JESD-30 codeR-PBGA-B8
JESD-609 codee0
length1.412 mm
Humidity sensitivity level1
Number of functions1
Number of terminals8
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Maximum output frequency3 GHz
Package body materialPLASTIC/EPOXY
encapsulated codeFBGA
Package shapeRECTANGULAR
Package formGRID ARRAY, FINE PITCH
Peak Reflow Temperature (Celsius)260
Certification statusNot Qualified
Maximum supply voltage (Vsup)12 V
Minimum supply voltage (Vsup)1.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formBALL
Terminal pitch0.5 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature40
width1.387 mm
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LMC555CBP Related Products

LMC555CBP LMC555CTPX/NOPB LMC555CBPX
Description 1 Func, 3MHz, CMOS, PBGA8, MO-211BC, SMD-8 PULSE; RECTANGULAR, 3MHz, TIMER, PBGA8, ROHS COMPLIANT, MO-211BC, SMD-8 1 Func, 3MHz, CMOS, PBGA8, MO-211BC, SMD-8
Is it lead-free? Contains lead Contains lead Contains lead
Parts packaging code DSBGA DSBGA DSBGA
package instruction MO-211BC, SMD-8 ROHS COMPLIANT, MO-211BC, SMD-8 FBGA,
Contacts 8 8 8
Reach Compliance Code unknown unknown unknown
Analog Integrated Circuits - Other Types PULSE; RECTANGULAR PULSE; RECTANGULAR PULSE; RECTANGULAR
JESD-30 code R-PBGA-B8 R-PBGA-B8 R-PBGA-B8
JESD-609 code e0 e1 e0
length 1.412 mm 1.412 mm 1.412 mm
Humidity sensitivity level 1 1 1
Number of functions 1 1 1
Number of terminals 8 8 8
Maximum operating temperature 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C
Maximum output frequency 3 GHz 3 GHz 3 GHz
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code FBGA FBGA FBGA
Package shape RECTANGULAR RECTANGULAR RECTANGULAR
Package form GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH
Peak Reflow Temperature (Celsius) 260 260 260
Certification status Not Qualified COMMERCIAL Not Qualified
Maximum supply voltage (Vsup) 12 V 12 V 12 V
Minimum supply voltage (Vsup) 1.5 V 1.5 V 1.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V
surface mount YES YES YES
technology CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) TIN SILVER COPPER Tin/Lead (Sn/Pb)
Terminal form BALL BALL BALL
Terminal pitch 0.5 mm 0.5 mm 0.5 mm
Terminal location BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature 40 40 40
width 1.387 mm 1.387 mm 1.387 mm
Is it Rohs certified? incompatible - incompatible
Maker Rochester Electronics - Rochester Electronics
ECCN code EAR99 - EAR99

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