DP8461N datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > Analog mixed-signal IC> Drivers and interfaces> DP8461N

DP8461N: DescriptionDATA SYNCHRONIZER OR ENDEC, PDIP24, 0.300 INCH, SKINNY, PLASTIC, DIP-24; CategoryAnalog mixed-signal IC Drivers and interfaces; File Size964KB，26 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

Stay tuned Parametric Compare

DP8461N Overview

DATA SYNCHRONIZER OR ENDEC, PDIP24, 0.300 INCH, SKINNY, PLASTIC, DIP-24

DP8461N Parametric

Parameter Name	Attribute value
Maker	Texas Instruments
package instruction	DIP,
Reach Compliance Code	unknown
Interface integrated circuit type	DATA SYNCHRONIZER OR ENDEC
JESD-30 code	R-PDIP-T24
length	31.915 mm
Number of functions	1
Number of terminals	24
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Certification status	Not Qualified
Maximum seat height	5.08 mm
Maximum supply voltage	5.25 V
Minimum supply voltage	4.75 V
Nominal supply voltage	5 V
surface mount	NO
technology	BIPOLAR
Temperature level	COMMERCIAL
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	7.62 mm

DP8461N Related Products

	DP8461N	DP8465J	DP8465N	DP8455N	DP8461J
Description	DATA SYNCHRONIZER OR ENDEC, PDIP24, 0.300 INCH, SKINNY, PLASTIC, DIP-24	DATA SYNCHRONIZER OR ENDEC, CDIP24, CERAMIC, DIP-24	DATA SYNCHRONIZER OR ENDEC, PDIP24, 0.300 INCH, SKINNY, PLASTIC, DIP-24	DATA SYNCHRONIZER OR ENDEC, PDIP20, PLASTIC, DIP-20	DATA SYNCHRONIZER OR ENDEC, CDIP24, CERAMIC, DIP-24
package instruction	DIP,	DIP,	DIP,	DIP,	DIP,
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown
Interface integrated circuit type	DATA SYNCHRONIZER OR ENDEC	DATA SYNCHRONIZER OR ENDEC	DATA SYNCHRONIZER OR ENDEC	DATA SYNCHRONIZER OR ENDEC	DATA SYNCHRONIZER OR ENDEC
JESD-30 code	R-PDIP-T24	R-GDIP-T24	R-PDIP-T24	R-PDIP-T20	R-GDIP-T24
Number of functions	1	1	1	1	1
Number of terminals	24	24	24	20	24
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C
Package body material	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED
encapsulated code	DIP	DIP	DIP	DIP	DIP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	5.08 mm	5.715 mm	5.08 mm	5.08 mm	5.715 mm
Maximum supply voltage	5.25 V	5.25 V	5.25 V	5.25 V	5.25 V
Minimum supply voltage	4.75 V	4.75 V	4.75 V	4.75 V	4.75 V
Nominal supply voltage	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO	NO
technology	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL
width	7.62 mm	7.62 mm	7.62 mm	7.62 mm	7.62 mm
Maker	Texas Instruments	Texas Instruments	Texas Instruments	-	Texas Instruments
length	31.915 mm	-	31.915 mm	26.075 mm	-
Base Number Matches	-	1	1	1	-

Recommended Resources

Transceiver circuit diagram of single-channel power line communication

Photoelectric control power saving circuit

Multi-light sensor Brinell hardness detection circuit

Bridge power amplifier circuit for DC motor speed regulation

555 automatic constant current charging circuit with uninterrupted power supply

555 electronic fishing game circuit

2015-11-26_TI MCU and Wireless Connectivity Seminar: [align=left]On November 26, 2015, Texas Instruments Incorporated (TI) held the 2015 TI MCU and Wireless Connection Technology Seminar at the InterContinental Hotel Shenzhen. The conference showcased T...; mars4zhu Integrated technical exchanges

High Frequency Contactless Smart Card Terminal Creative Progress Post: Sorry, I just finished omapl138's 264 encoding project and am preparing to post the program!...; gxliu08 Renesas Electronics MCUs

How to enable TI 15.4-Stack to support 470M frequency band: TI 15.4-Stack is an IEEE 802.15.4e/g RF communication stack. It is an integral part of the SimpleLink CC13xx/CC26x2 Software Development Kit (SDK) and supports star topology networks for either Sub-1G...; fish001 RF/Wirelessly

A question about automotive electronics testing: [color=black][align=left]I am doing a test on an automobile, and the problem I am facing now is how to simulate the dynamic characteristics of a battery (lead-acid battery)? Since batteries have diffe...; feaeaw Automotive Electronics

Show the WEBENCH design process + simple 5V to 3.3V DCDC converter design: 1. Before designing, we must first determine what we want to design. Since the mainstream integrated chips such as single-chip microcomputers have adopted a power supply voltage of 3.3V or lower, the ...; bobde163 Analogue and Mixed Signal

Lecture on Magnetic Application Technology Ⅱ High Frequency Magnetic Measurement: [:P][:O]Lecture on applied magnetic technology Ⅱ High frequency magnetic measurement Applied magnetics 2The miniaturization, high speed and multifunctionality of electronic devices have developed with...; fighting Analog electronics

Shortcut: E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF EG EH EI EJ EK EL EM EN EO EP EQ ER ES ET EU EV EW EX EY EZ F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF FG FH FI FJ FK FL FM FN FO FP FQ FR FS FT FU FV FW FX FY FZ G0 G1 G2 G3 G4 G5 G6 G7 G8 G9 GA GB GC GD GE GF GG GH GI GJ GK GL GM GN GO GP GQ GR GS GT GU GV GW GX GZ H0 H1 H2 H3 H4 H5 H6 H7 H8 HA HB HC HD HE HF HG HH HI HJ HK HL HM HN HO HP HQ HR HS HT HU HV HW HX HY HZ I1 I2 I3 I4 I5 I6 I7 IA IB IC ID IE IF IG IH II IK IL IM IN IO IP IQ IR IS IT IU IV IW IX J0 J1 J2 J6 J7 JA JB JC JD JE JF JG JH JJ JK JL JM JN JP JQ JR JS JT JV JW JX JZ K0 K1 K2 K3 K4 K5 K6 K7 K8 K9 KA KB KC KD KE KF KG KH KI KJ KK KL KM KN KO KP KQ KR KS KT KU KV KW KX KY KZ

Popular Components