D2708 datasheet, PDF - EEWORLD Datasheet

D2708: DescriptionUVPROM, 1KX8, 450ns, NMOS, PDIP24, DIP-24; Categorystorage storage; File Size139KB，4 Pages; ManufacturerIntel; Websitehttp://www.intel.com/

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D2708 Overview

UVPROM, 1KX8, 450ns, NMOS, PDIP24, DIP-24

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Intel
Parts packaging code	DIP
package instruction	DIP-24
Contacts	24
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	450 ns
Other features	IT ALSO REQUIRES 12V VDD SUPPLY
JESD-30 code	R-PDIP-T24
JESD-609 code	e0
memory density	8192 bit
Memory IC Type	UVPROM
memory width	8
Negative supply voltage rating	-5 V
Number of functions	1
Number of terminals	24
word count	1024 words
character code	1000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	1KX8
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP24,.6
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum supply voltage (Vsup)	5.25 V
Minimum supply voltage (Vsup)	4.75 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	NMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED

	D2708	C2708	MC2708/B	D2708-6
Description	UVPROM, 1KX8, 450ns, NMOS, PDIP24, DIP-24	OTP ROM, 1KX8, MOS, CDIP24,	OTP ROM, 1KX8, MOS, CDIP24,	OTP ROM, 1KX8, MOS, CDIP24,
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible
package instruction	DIP-24	DIP, DIP24,.6	DIP, DIP24,.6	DIP, DIP24,.6
Reach Compliance Code	unknown	unknown	compliant	unknow
Maximum access time	450 ns	450 ns	450 ns	550 ns
JESD-30 code	R-PDIP-T24	R-XDIP-T24	R-XDIP-T24	R-XDIP-T24
JESD-609 code	e0	e0	e0	e0
memory density	8192 bit	8192 bit	8192 bit	8192 bi
Memory IC Type	UVPROM	OTP ROM	OTP ROM	OTP ROM
memory width	8	8	8	8
Number of terminals	24	24	24	24
word count	1024 words	1024 words	1024 words	1024 words
character code	1000	1000	1000	1000
Maximum operating temperature	70 °C	70 °C	100 °C	70 °C
organize	1KX8	1KX8	1KX8	1KX8
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	CERAMIC	CERAMIC	CERAMIC
encapsulated code	DIP	DIP	DIP	DIP
Encapsulate equivalent code	DIP24,.6	DIP24,.6	DIP24,.6	DIP24,.6
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
surface mount	NO	NO	NO	NO
technology	NMOS	MOS	MOS	MOS
Temperature level	COMMERCIAL	COMMERCIAL	OTHER	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL

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