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D2708-6

Description
OTP ROM, 1KX8, MOS, CDIP24,
Categorystorage    storage   
File Size139KB,4 Pages
ManufacturerIntel
Websitehttp://www.intel.com/
Download Datasheet Parametric Compare View All

D2708-6 Overview

OTP ROM, 1KX8, MOS, CDIP24,

D2708-6 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerIntel
package instructionDIP, DIP24,.6
Reach Compliance Codeunknow
Maximum access time550 ns
JESD-30 codeR-XDIP-T24
JESD-609 codee0
memory density8192 bi
Memory IC TypeOTP ROM
memory width8
Number of terminals24
word count1024 words
character code1000
Maximum operating temperature70 °C
Minimum operating temperature
organize1KX8
Output characteristics3-STATE
Package body materialCERAMIC
encapsulated codeDIP
Encapsulate equivalent codeDIP24,.6
Package shapeRECTANGULAR
Package formIN-LINE
Certification statusNot Qualified
surface mountNO
technologyMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL

D2708-6 Related Products

D2708-6 C2708 MC2708/B D2708
Description OTP ROM, 1KX8, MOS, CDIP24, OTP ROM, 1KX8, MOS, CDIP24, OTP ROM, 1KX8, MOS, CDIP24, UVPROM, 1KX8, 450ns, NMOS, PDIP24, DIP-24
Is it Rohs certified? incompatible incompatible incompatible incompatible
package instruction DIP, DIP24,.6 DIP, DIP24,.6 DIP, DIP24,.6 DIP-24
Reach Compliance Code unknow unknown compliant unknown
Maximum access time 550 ns 450 ns 450 ns 450 ns
JESD-30 code R-XDIP-T24 R-XDIP-T24 R-XDIP-T24 R-PDIP-T24
JESD-609 code e0 e0 e0 e0
memory density 8192 bi 8192 bit 8192 bit 8192 bit
Memory IC Type OTP ROM OTP ROM OTP ROM UVPROM
memory width 8 8 8 8
Number of terminals 24 24 24 24
word count 1024 words 1024 words 1024 words 1024 words
character code 1000 1000 1000 1000
Maximum operating temperature 70 °C 70 °C 100 °C 70 °C
organize 1KX8 1KX8 1KX8 1KX8
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE
Package body material CERAMIC CERAMIC CERAMIC PLASTIC/EPOXY
encapsulated code DIP DIP DIP DIP
Encapsulate equivalent code DIP24,.6 DIP24,.6 DIP24,.6 DIP24,.6
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE IN-LINE IN-LINE
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
surface mount NO NO NO NO
technology MOS MOS MOS NMOS
Temperature level COMMERCIAL COMMERCIAL OTHER COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm 2.54 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL
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