MC14511BCLD datasheet, PDF - EEWORLD Datasheet

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MC14511BCLD: DescriptionIC,LED DISPLAY DRIVER,7-SEG,COMMON-CATHODE,CMOS,DIP,16PIN,CERAMIC; CategoryAnalog mixed-signal IC Drivers and interfaces; File Size371KB，6 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

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MC14511BCLD Overview

IC,LED DISPLAY DRIVER,7-SEG,COMMON-CATHODE,CMOS,DIP,16PIN,CERAMIC

MC14511BCLD Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	NXP
package instruction	DIP, DIP16,.3
Reach Compliance Code	unknown
Other features	COMMON-CATHODE
display mode	SEGMENT
JESD-30 code	R-XDIP-T16
JESD-609 code	e0
Number of segments	7
Number of terminals	16
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP16,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5/15 V
surface mount	NO
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

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MC14511BCLD Related Products

	MC14511BCLD	MC14511BALD	MC14511BALDS	MC14511BCPD	MC14511BCLDS	MC14511BDW
Description	IC,LED DISPLAY DRIVER,7-SEG,COMMON-CATHODE,CMOS,DIP,16PIN,CERAMIC	IC,LED DISPLAY DRIVER,7-SEG,COMMON-CATHODE,CMOS,DIP,16PIN,CERAMIC	IC,LED DISPLAY DRIVER,7-SEG,COMMON-CATHODE,CMOS,DIP,16PIN,CERAMIC	IC,LED DISPLAY DRIVER,7-SEG,COMMON-CATHODE,CMOS,DIP,16PIN,PLASTIC	IC,LED DISPLAY DRIVER,7-SEG,COMMON-CATHODE,CMOS,DIP,16PIN,CERAMIC	IC,LED DISPLAY DRIVER,7-SEG,COMMON-CATHODE,CMOS,SOP,16PIN,PLASTIC
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	NXP	NXP	NXP	NXP	NXP	NXP
package instruction	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	SOP, SOP16,.25
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown
Other features	COMMON-CATHODE	COMMON-CATHODE	COMMON-CATHODE	COMMON-CATHODE	COMMON-CATHODE	COMMON-CATHODE
display mode	SEGMENT	SEGMENT	SEGMENT	SEGMENT	SEGMENT	SEGMENT
JESD-30 code	R-XDIP-T16	R-XDIP-T16	R-XDIP-T16	R-PDIP-T16	R-XDIP-T16	R-PDSO-G16
JESD-609 code	e0	e0	e0	e0	e0	e0
Number of segments	7	7	7	7	7	7
Number of terminals	16	16	16	16	16	16
Maximum operating temperature	85 °C	125 °C	125 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-55 °C	-55 °C	-40 °C	-40 °C	-40 °C
Package body material	CERAMIC	CERAMIC	CERAMIC	PLASTIC/EPOXY	CERAMIC	PLASTIC/EPOXY
encapsulated code	DIP	DIP	DIP	DIP	DIP	SOP
Encapsulate equivalent code	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	SOP16,.25
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	SMALL OUTLINE
power supply	5/15 V	5/15 V	5/15 V	5/15 V	5/15 V	5/15 V
surface mount	NO	NO	NO	NO	NO	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	MILITARY	MILITARY	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	GULL WING
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL

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