IC,LED DISPLAY DRIVER,7-SEG,COMMON-CATHODE,CMOS,SOP,16PIN,PLASTIC
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | NXP |
| package instruction | SOP, SOP16,.25 |
| Reach Compliance Code | unknown |
| Other features | COMMON-CATHODE |
| display mode | SEGMENT |
| JESD-30 code | R-PDSO-G16 |
| JESD-609 code | e0 |
| Number of segments | 7 |
| Number of terminals | 16 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | SOP |
| Encapsulate equivalent code | SOP16,.25 |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE |
| power supply | 5/15 V |
| Certification status | Not Qualified |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| MC14511BDW | MC14511BALD | MC14511BALDS | MC14511BCPD | MC14511BCLDS | MC14511BCLD | |
|---|---|---|---|---|---|---|
| Description | IC,LED DISPLAY DRIVER,7-SEG,COMMON-CATHODE,CMOS,SOP,16PIN,PLASTIC | IC,LED DISPLAY DRIVER,7-SEG,COMMON-CATHODE,CMOS,DIP,16PIN,CERAMIC | IC,LED DISPLAY DRIVER,7-SEG,COMMON-CATHODE,CMOS,DIP,16PIN,CERAMIC | IC,LED DISPLAY DRIVER,7-SEG,COMMON-CATHODE,CMOS,DIP,16PIN,PLASTIC | IC,LED DISPLAY DRIVER,7-SEG,COMMON-CATHODE,CMOS,DIP,16PIN,CERAMIC | IC,LED DISPLAY DRIVER,7-SEG,COMMON-CATHODE,CMOS,DIP,16PIN,CERAMIC |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | NXP | NXP | NXP | NXP | NXP | NXP |
| package instruction | SOP, SOP16,.25 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| Other features | COMMON-CATHODE | COMMON-CATHODE | COMMON-CATHODE | COMMON-CATHODE | COMMON-CATHODE | COMMON-CATHODE |
| display mode | SEGMENT | SEGMENT | SEGMENT | SEGMENT | SEGMENT | SEGMENT |
| JESD-30 code | R-PDSO-G16 | R-XDIP-T16 | R-XDIP-T16 | R-PDIP-T16 | R-XDIP-T16 | R-XDIP-T16 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 |
| Number of segments | 7 | 7 | 7 | 7 | 7 | 7 |
| Number of terminals | 16 | 16 | 16 | 16 | 16 | 16 |
| Maximum operating temperature | 85 °C | 125 °C | 125 °C | 85 °C | 85 °C | 85 °C |
| Minimum operating temperature | -40 °C | -55 °C | -55 °C | -40 °C | -40 °C | -40 °C |
| Package body material | PLASTIC/EPOXY | CERAMIC | CERAMIC | PLASTIC/EPOXY | CERAMIC | CERAMIC |
| encapsulated code | SOP | DIP | DIP | DIP | DIP | DIP |
| Encapsulate equivalent code | SOP16,.25 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | SMALL OUTLINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| power supply | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V |
| surface mount | YES | NO | NO | NO | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | INDUSTRIAL | MILITARY | MILITARY | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |