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MC14511BDW

Description
IC,LED DISPLAY DRIVER,7-SEG,COMMON-CATHODE,CMOS,SOP,16PIN,PLASTIC
CategoryAnalog mixed-signal IC    Drivers and interfaces   
File Size371KB,6 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
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MC14511BDW Overview

IC,LED DISPLAY DRIVER,7-SEG,COMMON-CATHODE,CMOS,SOP,16PIN,PLASTIC

MC14511BDW Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerNXP
package instructionSOP, SOP16,.25
Reach Compliance Codeunknown
Other featuresCOMMON-CATHODE
display modeSEGMENT
JESD-30 codeR-PDSO-G16
JESD-609 codee0
Number of segments7
Number of terminals16
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Encapsulate equivalent codeSOP16,.25
Package shapeRECTANGULAR
Package formSMALL OUTLINE
power supply5/15 V
Certification statusNot Qualified
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL

MC14511BDW Related Products

MC14511BDW MC14511BALD MC14511BALDS MC14511BCPD MC14511BCLDS MC14511BCLD
Description IC,LED DISPLAY DRIVER,7-SEG,COMMON-CATHODE,CMOS,SOP,16PIN,PLASTIC IC,LED DISPLAY DRIVER,7-SEG,COMMON-CATHODE,CMOS,DIP,16PIN,CERAMIC IC,LED DISPLAY DRIVER,7-SEG,COMMON-CATHODE,CMOS,DIP,16PIN,CERAMIC IC,LED DISPLAY DRIVER,7-SEG,COMMON-CATHODE,CMOS,DIP,16PIN,PLASTIC IC,LED DISPLAY DRIVER,7-SEG,COMMON-CATHODE,CMOS,DIP,16PIN,CERAMIC IC,LED DISPLAY DRIVER,7-SEG,COMMON-CATHODE,CMOS,DIP,16PIN,CERAMIC
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible
Maker NXP NXP NXP NXP NXP NXP
package instruction SOP, SOP16,.25 DIP, DIP16,.3 DIP, DIP16,.3 DIP, DIP16,.3 DIP, DIP16,.3 DIP, DIP16,.3
Reach Compliance Code unknown unknown unknown unknown unknown unknown
Other features COMMON-CATHODE COMMON-CATHODE COMMON-CATHODE COMMON-CATHODE COMMON-CATHODE COMMON-CATHODE
display mode SEGMENT SEGMENT SEGMENT SEGMENT SEGMENT SEGMENT
JESD-30 code R-PDSO-G16 R-XDIP-T16 R-XDIP-T16 R-PDIP-T16 R-XDIP-T16 R-XDIP-T16
JESD-609 code e0 e0 e0 e0 e0 e0
Number of segments 7 7 7 7 7 7
Number of terminals 16 16 16 16 16 16
Maximum operating temperature 85 °C 125 °C 125 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -55 °C -55 °C -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY CERAMIC CERAMIC PLASTIC/EPOXY CERAMIC CERAMIC
encapsulated code SOP DIP DIP DIP DIP DIP
Encapsulate equivalent code SOP16,.25 DIP16,.3 DIP16,.3 DIP16,.3 DIP16,.3 DIP16,.3
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE
power supply 5/15 V 5/15 V 5/15 V 5/15 V 5/15 V 5/15 V
surface mount YES NO NO NO NO NO
technology CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL MILITARY MILITARY INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form GULL WING THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
Terminal pitch 1.27 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL

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