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UPC8152TB

Description
SILICON MMIC LOW CURRENT AMPLIFIER FOR MOBILE COMMUNICATIONS
File Size2MB,26 Pages
ManufacturerCEL
Websitehttp://www.cel.com/
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UPC8152TB Overview

SILICON MMIC LOW CURRENT AMPLIFIER FOR MOBILE COMMUNICATIONS

DATA SHEET
BIPOLAR ANALOG INTEGRATED CIRCUIT
μ
PC8178TK
SILICON MMIC LOW CURRENT AMPLIFIER
FOR MOBILE COMMUNICATIONS
DESCRIPTION
μ
PC8178TB in 6-pin super minimold.
TK suffix IC which is smaller package than TB suffix IC contributes to reduce mounting space by 50 %.
This IC is manufactured using our 30 GHz f
max
UHS0 (Ultra High Speed Process) silicon bipolar process.
FEATURES
• Excellent isolation
: ISL = 40 dB TYP. @ f = 1.0 GHz
ISL = 42 dB TYP. @ f = 2.4 GHz
ISL = 41 dB TYP. @ f = 1.9 GHz
• Power gain
: G
P
= 11.0 dB TYP. @ f = 1.0 GHz
• Gain 1 dB compression output power : P
O (1 dB)
=
−5.5
dBm TYP. @ f = 1.0 GHz
P
O (1 dB)
=
−8.0
dBm TYP. @ f = 1.9 GHz
P
O (1 dB)
=
−8.0
dBm TYP. @ f = 2.4 GHz
• Operating frequency
• Light weight
• High-density surface mounting
APPLICAION
• Buffer amplifiers on 0.1 to 2.4 GHz mobile communications system
DI
Document No. PU10063EJ02V0DS (2nd edition)
Date Published March 2005 CP(K)
SC
Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge.
The mark
shows major revised points.
O
NT
: 3 mg (Standard value)
G
P
= 11.0 dB TYP. @ f = 1.9 GHz
G
P
= 11.0 dB TYP. @ f = 2.4 GHz
: 0.1 to 2.4 GHz (Output port LC matching)
: 6-pin lead-less minimold package (1.5
×
1.3
×
0.55 mm)
IN
• Supply voltage
• Low current consumption
: V
CC
= 2.4 to 3.3 V
: I
CC
= 1.9 mA TYP. @ V
CC
= 3.0 V
UE
wide band matched IC.
μ
PC8178TK adopts 6-pin lead-less minimold package using same chip as the conventional
can realize low current consumption with external chip inductor which can not be realized on internal 50
Ω
The
μ
PC8178TK is a silicon monolithic integrated circuit designed as amplifier for mobile communications. This IC
D

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Description SILICON MMIC LOW CURRENT AMPLIFIER FOR MOBILE COMMUNICATIONS SILICON MMIC LOW CURRENT AMPLIFIER FOR MOBILE COMMUNICATIONS
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