L8219P datasheet, PDF - EEWORLD Datasheet

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L8219P: DescriptionSTEPPER MOTOR CONTROLLER, 2.5A, PDSO36, POWER, SO-36; CategoryOther integrated circuit (IC) The signal circuit; File Size159KB，13 Pages; ManufacturerSTMicroelectronics; Websitehttp://www.st.com/; Environmental Compliance

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L8219P Overview

STEPPER MOTOR CONTROLLER, 2.5A, PDSO36, POWER, SO-36

L8219P Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	STMicroelectronics
Parts packaging code	SOIC
package instruction	POWER, SO-36
Contacts	36
Reach Compliance Code	not_compliant
ECCN code	EAR99
Analog Integrated Circuits - Other Types	STEPPER MOTOR CONTROLLER
JESD-30 code	R-PDSO-G36
JESD-609 code	e3
length	15.9 mm
Number of functions	1
Number of terminals	36
Maximum operating temperature	70 °C
Minimum operating temperature
Maximum output current	2.5 A
Package body material	PLASTIC/EPOXY
encapsulated code	SSOP
Encapsulate equivalent code	SSOP36,.56
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5,45 V
Certification status	Not Qualified
Maximum seat height	3.6 mm
Maximum supply voltage (Vsup)	5.25 V
Minimum supply voltage (Vsup)	4.75 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	BIPOLAR
Temperature level	COMMERCIAL
Terminal surface	Matte Tin (Sn)
Terminal form	GULL WING
Terminal pitch	0.65 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	11 mm

L8219P Preview

L8219

HIGH CURRENT STEPPER MOTOR DRIVER

PRODUCT PREVIEW

IMPROVED STEP ANGLE SPLITTING &

TORQUE

ABLE TO DRIVE BOTH WINDINGS OF

BIPOLAR STEPPER MOTOR

OUTPUT CURRENT UP TO 1.5A EACH

WINDING

WIDE VOLTAGE RANGE 10V TO 46V

HALF-STEP, FULL-STEP AND MICROSTEPP-

ING MODE

BUILT-IN PROTECTION DIODES

INTERNAL PWM CURRENT CONTROL

LOW OUTPUT SATURATION VOLTAGE

DESIGNED FOR UNSTABILIZED MOTOR

SUPPLY VOLTAGE

INTERNAL THERMAL SHUTDOWN

TWO POWER PACKAGES ARE AVAILABLE:

- SO28EP Exposed Pad

- PowerSO36

SO28EP

PowerSO36

ORDERING NUMBERS:

L8219LP

L8219P

DESCRIPTION

The L8219 is a bipolar monolithic integrated circuits

intended to control and drive both winding of a bipolar

stepper motor or bidirectionally control two DC mo-

BLOCK DIAGRAM

COMPINP1

tors.The L8219 with a few external components form

a complete control and drive circuit for LS-TTL or mi-

croprocessor controlled stepper motor system.The

power stage is a dual full bridge capable of sustaining

46V and including four diodes for current recircula-

tion.A cross conduction protection is provided to

avoid simultaneous cross conduction during switch-

ing current direction.An internal pulse-width-modula-

tion (PWM) controls the output current to 1.5A with

peak start-up current up to 1.75A.Wide range of cur-

rent control from 1.5A (each bridge) is permitted by

means of two logic inputs and an external voltage ref-

erence. A phase input to each bridge determines the

load current direction.A thermal protection circuitry

disables the outputs if the chip temperature exceeds

safe operating limits.

PH1

EN1

REF1

2bit

DAC

OUT1A

LOGIC

OUT1B

THERMAL

SHUTDOWN

OUT2A

2bit

DAC

LOGIC

OUT2B

WINDING

REF2

COMPINP2

PH2

EN2

D99IN1075A

August 2002

This is preliminary information on a new product now in development. Details are subject to change without notice.

1/13

L8219

PINS CONNECTIONS

(Top views)

OUT2B

GND

OUT2A

COMPINP2

VS2

GND

EN2

I02

I12

PH2

VREF2

VSS

D99IN1074A

OUT1B

GND

OUT1A

N.C.

COMPINP1

VS1

GND

EN1

I01

I11

PH1

VREF1

SO28EP

VS1

COMPINP1

N.C.

OUT1A

GND

OUT1B

OUT2B

GND

OUT2A

N.C.

COMPINP2

VS2

D99IN1073A

GND

EN1

N.C.

I01

I11

PH1

VREF1

VSS

VREF2

PH2

I12

I02

N.C.

EN2

GND

PowerSO36

2/13

L8219

PIN FUNCTION

SO28

PowerSO36

Name

OUT2B

Description

7, 21

Bridge-2

Ouput connection. The output stage is a "H" bridge formed by four transistors and

four diodes connected to ground suitable for switching applications.

Rs2

Bridge-2

Power stage sink transistors emitter connection.Sensing resistor is connected from

this pin and ground.

GND2 Ground

OUT2A same as OUT2B

COMPI Bridge-2

MP2

An internal low pass filter RcCc is integrated.

Vs2

Bridge-2 Power supply voltage.

19,36

GND

Ground

EN2

Bridge2

When the enable input is set high the bridge is immediately switched-off skipping the

delay time of the current control loop turning-off (I0=I1=H)

Bridge-2

I02

Logic input to set up the output current level, which is also determined by the

sensing resistor and reference voltage(see also Functional description and table 1).

I12

same as I02 (see table 1)

PH2

Bridge-2

This TTL-compatible logic inputs sets the direction of current flow through the load. A

high level causes current to flow from OUTPUT A (source) to OUTPUT B (sink). A

schmitt trigger on this input provides good noise immunity and a delay circuit

prevents output stage short circuits during switching.

Vref2

Bridge-2

A voltage applied to this pin sets the reference voltage of the comparators, this

determinig the output current (also depending on Rs and the the two inputs INPUT 0

and INPUT 1).

R2C2

Bridge-2

An external RC network connected to this pin sets the toff time of the higher power

transistors.The pulse generator is a monostable triggerd by the output of the

comparators (toff = 1.1 RTCT)

Vss

Supply voltage input for the logic circuitry.

R1C1

Bridge-1 same as R2C2.

Vref1

Bridge-1 same as Vref2

PH1

Bridge-1 same as PH2

I11

Bridge-1 same as I12

I01

Bridge-1 same as I02

EN1

Bridge-1 same as EN2

Vs1

Bridge-1 Power supply voltage.

COMPINP1 Bridge-1

An internal low pass filter RcCc is integrated. Another RC external network will

modify the blanking time (ss Functional Description)

3,4,5,14,15,

N.C.

Not connected

16,21,33,34

OUT1A Bridge-1

Output connection. The output stage is a "H" bridge formed by four transistors and

four diodes connected to ground suitable for switching applications

GND

Ground.

RS1

Bridge-1

Power stage sink transistors emitter connection.Sensing resistor is connected from

this pin and ground.

OUT1B same as OUT1A

3/13

L8219

THERMAL CHARACTERISTICS - SO28EP

Conditions

Power Dissipated T Ambient Thermal J-A resistance

(W)

(˚C)

(˚C/W)

4.4

pad layout + ground layers + 16 via hol

PCB ref.: 4 LAYER cm 12 x 12

3.5

pad layout + ground layers

PCB ref.: 4 LAYER cm 12 x 12

2.1

pad layout + 6cm2 on board heat sink

PCB ref.: 2 LAYER cm 12 x 12

D02IN1372

Power Dissipated (W)

23˚C/W

38˚C/W

18˚C/W

100

120

Ambient Temperature (˚C)

140

160

D02IN1373

4/13

L8219

THERMAL CHARACTERISTICS - PowerSO36

Conditions

Power Dissipated T Ambient Thermal J-A resistance

(W)

(˚C)

(˚C/W)

5.3

pad layout + ground layers + 16 via hol

PCB ref.: 4 LAYER cm 12 x 12

4.0

pad layout + ground layers

PCB ref.: 4 LAYER cm 12 x 12

2.3

pad layout + 6cm2 on board heat sink

PCB ref.: 2 LAYER cm 12 x 12

D02IN1370

Power Dissipated (W)

20˚C/W

35˚C/W

15˚C/W

100

120

Ambient Temperature (˚C)

140

160

D02IN1371

5/13

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