LB1026AA datasheet, PDF - EEWORLD Datasheet

LB1026AA: DescriptionIC,COMPRESSION/EXPANSION CIRCUIT,BIPOLAR,WAFER; CategoryWireless rf/communication Telecom circuit; File Size299KB，5 Pages; ManufacturerSTMicroelectronics; Websitehttp://www.st.com/

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LB1026AA Overview

IC,COMPRESSION/EXPANSION CIRCUIT,BIPOLAR,WAFER

Parameter Name	Attribute value
Maker	STMicroelectronics
package instruction	, WAFER
Reach Compliance Code	compliant
Maximum operating temperature	50 °C
Minimum operating temperature
Encapsulate equivalent code	WAFER
power supply	2/15 V
Certification status	Not Qualified
Maximum slew rate	1 mA
technology	BIPOLAR
Telecom integrated circuit types	TELECOM CIRCUIT
Temperature level	COMMERCIAL

	LB1026AA	LB1026AB
Description	IC,COMPRESSION/EXPANSION CIRCUIT,BIPOLAR,WAFER	IC,COMPRESSION/EXPANSION CIRCUIT,BIPOLAR,DIP,8PIN,PLASTIC
Maker	STMicroelectronics	STMicroelectronics
package instruction	, WAFER	DIP, DIP8,.3
Reach Compliance Code	compliant	compliant
Maximum operating temperature	50 °C	50 °C
Encapsulate equivalent code	WAFER	DIP8,.3
power supply	2/15 V	2/15 V
Certification status	Not Qualified	Not Qualified
Maximum slew rate	1 mA	1 mA
technology	BIPOLAR	BIPOLAR
Telecom integrated circuit types	TELECOM CIRCUIT	TELECOM CIRCUIT
Temperature level	COMMERCIAL	COMMERCIAL

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