LB1026AB datasheet, PDF - EEWORLD Datasheet

LB1026AB: DescriptionIC,COMPRESSION/EXPANSION CIRCUIT,BIPOLAR,DIP,8PIN,PLASTIC; CategoryWireless rf/communication Telecom circuit; File Size299KB，5 Pages; ManufacturerSTMicroelectronics; Websitehttp://www.st.com/

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LB1026AB Overview

IC,COMPRESSION/EXPANSION CIRCUIT,BIPOLAR,DIP,8PIN,PLASTIC

Parameter Name	Attribute value
Maker	STMicroelectronics
package instruction	DIP, DIP8,.3
Reach Compliance Code	compliant
JESD-30 code	R-PDIP-T8
Number of terminals	8
Maximum operating temperature	50 °C
Minimum operating temperature
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP8,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	2/15 V
Certification status	Not Qualified
Maximum slew rate	1 mA
surface mount	NO
technology	BIPOLAR
Telecom integrated circuit types	TELECOM CIRCUIT
Temperature level	COMMERCIAL
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

	LB1026AB	LB1026AA
Description	IC,COMPRESSION/EXPANSION CIRCUIT,BIPOLAR,DIP,8PIN,PLASTIC	IC,COMPRESSION/EXPANSION CIRCUIT,BIPOLAR,WAFER
Maker	STMicroelectronics	STMicroelectronics
package instruction	DIP, DIP8,.3	, WAFER
Reach Compliance Code	compliant	compliant
Maximum operating temperature	50 °C	50 °C
Encapsulate equivalent code	DIP8,.3	WAFER
power supply	2/15 V	2/15 V
Certification status	Not Qualified	Not Qualified
Maximum slew rate	1 mA	1 mA
technology	BIPOLAR	BIPOLAR
Telecom integrated circuit types	TELECOM CIRCUIT	TELECOM CIRCUIT
Temperature level	COMMERCIAL	COMMERCIAL

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