M27V512-90F6 Related Products
|
M27V512-90F6 |
M27V512-90B1 |
M27V512-90B6 |
M27V512-90F1 |
M27V512-90K1 |
M27V512-90K6 |
M27V512-90N6 |
| Description |
M27V512-90F6, DIP6-28 |
M27V512-90B1, DIP6-28 |
M27V512-90B6, DIP6-28 |
M27V512-90F1, DIP6-28 |
M27V512-90K1, PLCC-32 |
M27V512-90K6, PLCC-32 |
M27V512-90N6, TSOP-28 |
| Is it Rohs certified? |
incompatible |
incompatible |
incompatible |
incompatible |
incompatible |
incompatible |
incompatible |
| Maker |
STMicroelectronics |
STMicroelectronics |
STMicroelectronics |
STMicroelectronics |
STMicroelectronics |
STMicroelectronics |
STMicroelectronics |
| package instruction |
DIP, DIP28,.6 |
DIP6-28 |
DIP6-28 |
DIP, DIP28,.6 |
PLCC-32 |
PLCC-32 |
TSOP-28 |
| Reach Compliance Code |
not_compliant |
not_compliant |
not_compliant |
not_compliant |
not_compliant |
not_compliant |
not_compliant |
| Maximum access time |
90 ns |
90 ns |
90 ns |
90 ns |
90 ns |
90 ns |
90 ns |
| I/O type |
COMMON |
COMMON |
COMMON |
COMMON |
COMMON |
COMMON |
COMMON |
| JESD-30 code |
R-XDIP-T28 |
R-PDIP-T28 |
R-PDIP-T28 |
R-XDIP-T28 |
R-PQCC-J32 |
R-PQCC-J32 |
R-PDSO-G28 |
| JESD-609 code |
e0 |
e0 |
e0 |
e0 |
e0 |
e0 |
e0 |
| memory density |
524288 bit |
524288 bit |
524288 bit |
524288 bit |
524288 bit |
524288 bit |
524288 bit |
| Memory IC Type |
UVPROM |
OTP ROM |
OTP ROM |
UVPROM |
OTP ROM |
OTP ROM |
OTP ROM |
| memory width |
8 |
8 |
8 |
8 |
8 |
8 |
8 |
| Number of terminals |
28 |
28 |
28 |
28 |
32 |
32 |
28 |
| word count |
65536 words |
65536 words |
65536 words |
65536 words |
65536 words |
65536 words |
65536 words |
| character code |
64000 |
64000 |
64000 |
64000 |
64000 |
64000 |
64000 |
| Maximum operating temperature |
85 °C |
70 °C |
85 °C |
70 °C |
70 °C |
85 °C |
85 °C |
| Minimum operating temperature |
-40 °C |
- |
-40 °C |
- |
- |
-40 °C |
-40 °C |
| organize |
64KX8 |
64KX8 |
64KX8 |
64KX8 |
64KX8 |
64KX8 |
64KX8 |
| Output characteristics |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
| Package body material |
CERAMIC |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
CERAMIC |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
| encapsulated code |
DIP |
DIP |
DIP |
DIP |
QCCJ |
QCCJ |
TSSOP |
| Encapsulate equivalent code |
DIP28,.6 |
DIP28,.6 |
DIP28,.6 |
DIP28,.6 |
LDCC32,.5X.6 |
LDCC32,.5X.6 |
TSSOP28,.53,22 |
| Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
| Package form |
IN-LINE |
IN-LINE |
IN-LINE |
IN-LINE |
CHIP CARRIER |
CHIP CARRIER |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| power supply |
3.3/5 V |
3.3/5 V |
3.3/5 V |
3.3/5 V |
3.3/5 V |
3.3/5 V |
3.3/5 V |
| Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
| Maximum standby current |
0.00001 A |
0.00001 A |
0.00001 A |
0.00001 A |
0.00001 A |
0.00001 A |
0.00001 A |
| Maximum slew rate |
0.03 mA |
0.03 mA |
0.03 mA |
0.03 mA |
0.03 mA |
0.03 mA |
0.03 mA |
| surface mount |
NO |
NO |
NO |
NO |
YES |
YES |
YES |
| technology |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
| Temperature level |
INDUSTRIAL |
COMMERCIAL |
INDUSTRIAL |
COMMERCIAL |
COMMERCIAL |
INDUSTRIAL |
INDUSTRIAL |
| Terminal surface |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
| Terminal form |
THROUGH-HOLE |
THROUGH-HOLE |
THROUGH-HOLE |
THROUGH-HOLE |
J BEND |
J BEND |
GULL WING |
| Terminal pitch |
2.54 mm |
2.54 mm |
2.54 mm |
2.54 mm |
1.27 mm |
1.27 mm |
0.55 mm |
| Terminal location |
DUAL |
DUAL |
DUAL |
DUAL |
QUAD |
QUAD |
DUAL |