512Mb: x4, x8, x16 DDR2 SDRAM
Features
DDR2 SDRAM
MT47H128M4 – 32 Meg x 4 x 4 banks
MT47H64M8 – 16 Meg x 8 x 4 banks
MT47H32M16 – 8 Meg x 16 x 4 banks
Features
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
V
DD
= +1.8V ±0.1V, V
DDQ
= +1.8V ±0.1V
JEDEC-standard 1.8V I/O (SSTL_18-compatible)
Differential data strobe (DQS, DQS#) option
4n-bit prefetch architecture
Duplicate output strobe (RDQS) option for x8
DLL to align DQ and DQS transitions with CK
4 internal banks for concurrent operation
Programmable CAS latency (CL)
Posted CAS additive latency (AL)
WRITE latency = READ latency - 1
t
CK
Selectable burst lengths: 4 or 8
Adjustable data-output drive strength
64ms, 8192-cycle refresh
On-die termination (ODT)
Industrial temperature (IT) option
Automotive temperature (AT) option
RoHS-compliant
Supports JEDEC clock jitter specification
Options
1
•
Configuration
–
128 Meg x 4 (32 Meg x 4 x 4 banks)
–
64 Meg x 8 (16 Meg x 8 x 4 banks)
–
32 Meg x 16 (8 Meg x 16 x 4 banks)
•
FBGA package (Pb-free) – x16
–
84-ball FBGA (8mm x 12.5mm) Rev. F
•
FBGA package (Pb-free) – x4, x8
–
60-ball FBGA (8mm x 10mm) Rev. F
•
FBGA package (lead solder) – x16
–
84-ball FBGA (8mm x 12.5mm) Rev. F
•
FBGA package (lead solder) – x4, x8
–
60-ball FBGA (8mm x 10mm) Rev. F
•
Timing – cycle time
–
2.5ns @ CL = 5 (DDR2-800)
–
2.5ns @ CL = 6 (DDR2-800)
–
3.0ns @ CL = 4 (DDR2-667)
–
3.0ns @ CL = 5 (DDR2-667)
–
3.75ns @ CL = 4 (DDR2-533)
•
Self refresh
–
Standard
–
Low-power
•
Operating temperature
–
Commercial (0°C
≤
T
C
≤
85°C)
–
Industrial (–40°C
≤
T
C
≤
95°C;
–40°C
≤
T
A
≤
85°C)
–
Automotive (–40°C
≤
T
C
, T
A
≤
105°C)
•
Revision
Note:
Marking
128M4
64M8
32M16
HR
CF
HW
JN
-25E
-25
-3E
-3
-37E
None
L
None
IT
AT
:F
1. Not all options listed can be combined to
define an offered product. Use the Part
Catalog Search on
www.micron.com
for
product offerings and availability.
PDF: 09005aef82f1e6e2
512MbDDR2.pdf - Rev. O 7/09 EN
1
Products and specifications discussed herein are subject to change by Micron without notice.
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©2004
Micron Technology, Inc. All rights reserved.
512Mb: x4, x8, x16 DDR2 SDRAM
Features
Table 1: Key Timing Parameters
Data Rate (MT/s)
Speed Grade
-25E
-25
-3E
-3
-37E
CL = 3
400
400
400
400
400
CL = 4
533
533
667
533
533
CL = 5
800
667
667
667
n/a
CL = 6
800
800
n/a
n/a
n/a
t
RC
(ns)
55
55
54
55
55
Table 2: Addressing
Parameter
Configuration
Refresh count
Row address
Bank address
Column address
128 Meg x 4
32 Meg x 4 x 4 banks
8K
A[13:0] (16K)
BA[1:0] (4)
A[11, 9:0] (2K)
64 Meg x 8
16 Meg x 8 x 4 banks
8K
A[13:0] (16K)
BA[1:0] (4)
A[9:0] (1K)
32 Meg x 16
8 Meg x 16 x 4 banks
8K
A[12:0] (8K)
BA[1:0] (4)
A[9:0] (1K)
Figure 1: 512Mb DDR2 Part Numbers
Example Part Number: MT47H128M4B6-25E :D
-
MT47H
Configuration
Package
Speed
:
Revision
{
Configuration
256 Meg x 4
128 Meg x 8
64 Meg x 16
Package
Pb-free
84-ball 8mm x 12.5mm FBGA
60-ball 8mm x 10mm FBGA
Lead Solder
84-ball 8mm x 12.5mm FBGA
60-ball 8mm x 10mm FBGA
HW
JN
HR
CF
-37E
-3
-3E
-25
-25E
Speed Grade
tCK = 3.75ns, CL = 4
tCK = 3ns, CL = 5
tCK = 3ns, CL = 4
tCK = 2.5ns, CL = 6
tCK = 2.5ns, CL = 5
128M4
64M8
32M16
L Low power
IT Industrial temperature
AT Automotive temperature
:F
Revision
Note:
1. Not all speeds and configurations are available in all packages.
FBGA Part Number System
Due to space limitations, FBGA-packaged components have an abbreviated part marking that is different from the
part number. For a quick conversion of an FBGA code, see the FBGA Part Marking Decoder on Micron’s Web site:
http://www.micron.com.
PDF: 09005aef82f1e6e2
512MbDDR2.pdf - Rev. O 7/09 EN
2
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©2004
Micron Technology, Inc. All rights reserved.
512Mb: x4, x8, x16 DDR2 SDRAM
State Diagram .................................................................................................................................................. 8
Functional Description ..................................................................................................................................... 9
Industrial Temperature ................................................................................................................................ 9
Automotive Temperature ........................................................................................................................... 10
General Notes ............................................................................................................................................ 10
Functional Block Diagrams ............................................................................................................................. 11
Ball Assignments and Descriptions ................................................................................................................. 13
Packaging ...................................................................................................................................................... 17
Package Dimensions .................................................................................................................................. 17
FBGA Package Capacitance ......................................................................................................................... 19
Electrical Specifications – Absolute Ratings ..................................................................................................... 20
Temperature and Thermal Impedance ........................................................................................................ 20
Electrical Specifications – I
DD
Parameters ........................................................................................................ 23
I
DD
Specifications and Conditions ............................................................................................................... 23
I
DD7
Conditions .......................................................................................................................................... 23
AC Timing Operating Specifications ................................................................................................................ 27
AC and DC Operating Conditions .................................................................................................................... 38
ODT DC Electrical Characteristics ................................................................................................................... 39
Input Electrical Characteristics and Operating Conditions ............................................................................... 40
Output Electrical Characteristics and Operating Conditions ............................................................................. 43
Output Driver Characteristics ......................................................................................................................... 45
Power and Ground Clamp Characteristics ....................................................................................................... 49
AC Overshoot/Undershoot Specification ......................................................................................................... 50
Input Slew Rate Derating ................................................................................................................................ 52
Commands .................................................................................................................................................... 65
Truth Tables ............................................................................................................................................... 65
DESELECT ................................................................................................................................................. 69
NO OPERATION (NOP) .............................................................................................................................. 70
LOAD MODE (LM) ..................................................................................................................................... 70
ACTIVATE .................................................................................................................................................. 70
READ ......................................................................................................................................................... 70
WRITE ....................................................................................................................................................... 70
PRECHARGE .............................................................................................................................................. 71
REFRESH ................................................................................................................................................... 71
SELF REFRESH ........................................................................................................................................... 71
Mode Register (MR) ........................................................................................................................................ 71
Burst Length .............................................................................................................................................. 72
Burst Type ................................................................................................................................................. 73
Operating Mode ......................................................................................................................................... 73
DLL RESET ................................................................................................................................................. 73
Write Recovery ........................................................................................................................................... 74
Power-Down Mode .................................................................................................................................... 74
CAS Latency (CL) ........................................................................................................................................ 75
Extended Mode Register (EMR) ....................................................................................................................... 76
DLL Enable/Disable ................................................................................................................................... 77
Output Drive Strength ................................................................................................................................ 77
DQS# Enable/Disable ................................................................................................................................. 77
RDQS Enable/Disable ................................................................................................................................. 77
Output Enable/Disable ............................................................................................................................... 77
On-Die Termination (ODT) ........................................................................................................................ 78
Contents
PDF: 09005aef82f1e6e2
512MbDDR2.pdf - Rev. O 7/09 EN
3
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©2004
Micron Technology, Inc. All rights reserved.
512Mb: x4, x8, x16 DDR2 SDRAM
Off-Chip Driver (OCD) Impedance Calibration ............................................................................................ 78
Posted CAS Additive Latency (AL) ............................................................................................................... 78
Extended Mode Register 2 (EMR2) .................................................................................................................. 80
Extended Mode Register 3 (EMR3) .................................................................................................................. 81
Initialization .................................................................................................................................................. 82
ACTIVATE ...................................................................................................................................................... 86
READ ............................................................................................................................................................. 88
READ with Precharge ................................................................................................................................. 92
READ with Auto Precharge .......................................................................................................................... 94
WRITE ........................................................................................................................................................... 99
PRECHARGE ................................................................................................................................................. 109
REFRESH ...................................................................................................................................................... 110
SELF REFRESH .............................................................................................................................................. 111
Power-Down Mode ....................................................................................................................................... 113
Precharge Power-Down Clock Frequency Change .......................................................................................... 120
Reset ............................................................................................................................................................. 121
CKE Low Anytime ...................................................................................................................................... 121
ODT Timing .................................................................................................................................................. 123
MRS Command to ODT Update Delay ........................................................................................................ 125
PDF: 09005aef82f1e6e2
512MbDDR2.pdf - Rev. O 7/09 EN
4
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©2004
Micron Technology, Inc. All rights reserved.
512Mb: x4, x8, x16 DDR2 SDRAM
Table 1: Key Timing Parameters ...................................................................................................................... 2
Table 2: Addressing ......................................................................................................................................... 2
Table 3: FBGA 84-Ball – x16 and 60-Ball – x4, x8 Descriptions .......................................................................... 15
Table 4: Input Capacitance ............................................................................................................................ 19
Table 5: Absolute Maximum DC Ratings ........................................................................................................ 20
Table 6: Temperature Limits .......................................................................................................................... 21
Table 7: Thermal Impedance ......................................................................................................................... 22
Table 8: General I
DD
Parameters .................................................................................................................... 23
Table 9: I
DD7
Timing Patterns (4-Bank Interleave READ Operation) ................................................................. 23
Table 10: DDR2 I
DD
Specifications and Conditions ........................................................................................ 24
Table 11: AC Operating Specifications and Conditions .................................................................................... 27
Table 12: Recommended DC Operating Conditions (SSTL_18) ........................................................................ 38
Table 13: ODT DC Electrical Characteristics ................................................................................................... 39
Table 14: Input DC Logic Levels ..................................................................................................................... 40
Table 15: Input AC Logic Levels ..................................................................................................................... 40
Table 16: Differential Input Logic Levels ........................................................................................................ 41
Table 17: Differential AC Output Parameters .................................................................................................. 43
Table 18: Output DC Current Drive ................................................................................................................ 43
Table 19: Output Characteristics .................................................................................................................... 44
Table 20: Full Strength Pull-Down Current (mA) ............................................................................................ 45
Table 21: Full Strength Pull-Up Current (mA) ................................................................................................. 46
Table 22: Reduced Strength Pull-Down Current (mA) ..................................................................................... 47
Table 23: Reduced Strength Pull-Up Current (mA) .......................................................................................... 48
Table 24: Input Clamp Characteristics ........................................................................................................... 49
Table 25: Address and Control Balls ............................................................................................................... 50
Table 26: Clock, Data, Strobe, and Mask Balls ................................................................................................. 50
Table 27: AC Input Test Conditions ................................................................................................................ 51
Table 28: DDR2-400/533 Setup and Hold Time Derating Values (
t
IS and
t
IH) ................................................... 53
Table 29: DDR2-667/800/1066 Setup and Hold Time Derating Values (
t
IS and
t
IH) .......................................... 54
Table 30: DDR2-400/533
t
DS,
t
DH Derating Values with Differential Strobe ..................................................... 57
Table 31: DDR2-667/800/1066
t
DS,
t
DH Derating Values with Differential Strobe ............................................ 58
Table 32: Single-Ended DQS Slew Rate Derating Values Using
t
DS
b
and
t
DH
b
.................................................. 59
Table 33: Single-Ended DQS Slew Rate Fully Derated (DQS, DQ at V
REF
) at DDR2-667 ..................................... 59
Table 34: Single-Ended DQS Slew Rate Fully Derated (DQS, DQ at V
REF
) at DDR2-533 ..................................... 60
Table 35: Single-Ended DQS Slew Rate Fully Derated (DQS, DQ at V
REF
) at DDR2-400 ..................................... 60
Table 36: Truth Table – DDR2 Commands ..................................................................................................... 65
Table 37: Truth Table – Current State Bank
n
– Command to Bank
n
............................................................... 66
Table 38: Truth Table – Current State Bank
n
– Command to Bank
m
.............................................................. 68
Table 39: Minimum Delay with Auto Precharge Enabled ................................................................................. 69
Table 40: Burst Definition .............................................................................................................................. 73
Table 41: READ Using Concurrent Auto Precharge ......................................................................................... 94
Table 42: WRITE Using Concurrent Auto Precharge ....................................................................................... 100
Table 43: Truth Table – CKE ......................................................................................................................... 115
List of Tables
PDF: 09005aef82f1e6e2
512MbDDR2.pdf - Rev. O 7/09 EN
5
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©2004
Micron Technology, Inc. All rights reserved.
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