RoHS Compliant
Value Added
ATA Disk Module
Ⅲ
Specification for Mini ADM III (44P/180D) Middle Profile
March 3, 2011
Version 1.1
Apacer Technology Inc.
4 Fl., 75 Xintai 5 Rd., Sec.1, Hsichih, New Taipei City, Taiwan 221
Tel: +886-2-2698-2888
www.apacer.com
Fax: +886-2-2698-2889
th
th
Value Added
ATA-Disk ModuleⅢ
Ⅲ
AP-FMxxxxE2XXXS-MPXXXJ
Features:
Standard ATA/IDE bus interface
–
512 bytes per sector
– ATA command set compatible
– ATA operating mode supports up to:
PIO Mode-4
Multiword DMA Mode-2
Ultra DMA Mode-4
Connector type
– 44-pin female connector
Low power consumption (typical)
– Supply voltage: 3.3V & 5V
– Active mode: 85 mA/95 mA (3.3V/5.0V)
– Sleep mode: 500µA /600µA (3.3V/5.0V)
Performance
– Sustained read: Up to 35 MB/sec
– Sustained write:
Standard: Up to 10 MB/sec
High Speed: Up to 10 MB/sec
Capacity
–
Standard:
128, 256, 512 MB
1, 2, 8 GB
– High Speed:
256, 512 MB
1, 2, 4 GB
NAND Flash Type: SLC
*Extended Temperature
Temperature ranges
– Operation:
Standard: 0° to 70°
C
C
ET*: -40° to 85°
C
C
– Storage: -40° to 100°
C
C
Flash management
–
Intelligent endurance design
Advanced wear-leveling algorithms
S.M.A.R.T. technology
Built-in hardware ECC
Enhanced data integrity
–
Intelligent power failure recovery
–
Enhanced security level
Secure protection zone
ATA Secure Erase
RoHS compliant
2
©2011 Apacer Technology Inc.
Rev. 1.1
Value Added
ATA-Disk ModuleⅢ
Ⅲ
AP-FMxxxxE2XXXS-MPXXXJ
Table of Contents
1. GENERAL DESCRIPTION ......................................................................................... 4
1.1 P
ERFORMANCE
-O
PTIMIZED
C
ONTROLLER
............................................................................................... 4
1.1.1 Power Management Unit (PMU)................................................................................................... 4
1.1.2 SRAM Buffer ................................................................................................................................. 4
2. FUNCTIONAL BLOCK ............................................................................................... 5
3. PIN ASSIGNMENTS ................................................................................................... 6
4. CAPACITY SPECIFICATION ..................................................................................... 7
4.1 P
ERFORMANCE
S
PECIFICATION
.............................................................................................................. 7
4.2 E
NVIRONMENTAL
S
PECIFICATION
............................................................................................................ 8
5. FLASH MANAGEMENT ............................................................................................. 9
5.1 I
NTELLIGENT
E
NDURANCE
D
ESIGN
.......................................................................................................... 9
5.1.1 Advanced wear-leveling algorithms .............................................................................................. 9
5.1.2 S.M.A.R.T. technology.................................................................................................................. 9
5.1.3 Built-in hardware ECC .................................................................................................................. 9
5.1.4 Enhanced data integrity ................................................................................................................ 9
5.2 I
NTELLIGENT
P
OWER
F
AILURE
R
ECOVERY
............................................................................................. 10
5.3 E
NHANCED
S
ECURITY
L
EVEL
................................................................................................................ 10
5.3.1 Secure protection zone............................................................................................................... 10
5.3.2 ATA Secure Erase ...................................................................................................................... 10
6. SOFTWARE INTERFACE ....................................................................................... 11
6.1 C
OMMAND
S
ET
.................................................................................................................................... 11
7. ELECTRICAL SPECIFICATION .............................................................................. 13
8. PHYSICAL CHARACTERISTICS ............................................................................ 14
8.1 D
IMENSION
– M
INI
ADM....................................................................................................................... 14
8.1.1 44 pin/ 180 degree middle profile w/o housing .......................................................................... 14
8.1.2 44 pin/ 180 degree middle profile w/ housing ............................................................................ 15
9. PRODUCT ORDERING INFORMATION ................................................................. 16
9.1 P
RODUCT
C
ODE
D
ESIGNATIONS
........................................................................................................... 16
9.2 V
ALID
C
OMBINATIONS
.......................................................................................................................... 17
9.2.1 Standard MP ............................................................................................................................... 17
9.2.2 Hi-SpeE2 MP .............................................................................................................................. 17
9.2.3 Ext. Temp Standard MP ............................................................................................................. 17
9.2.4 Ext. Temp Hi-SpeE2 MP............................................................................................................. 17
9.2.5 Standard with Housing................................................................................................................ 18
9.2.6 Hi-SpeE2 with Housing............................................................................................................... 18
9.2.7 Ext. Temp Standard with Housing .............................................................................................. 18
9.2.8 Ext. Temp Hi-SpeE2 with Housing ............................................................................................. 18
3
©2011 Apacer Technology Inc.
Rev. 1.1
Value Added
ATA-Disk ModuleⅢ
Ⅲ
AP-FMxxxxE2XXXS-MPXXXJ
1. General Description
Apacer’s ATA-Disk Module (ADM) is a high-performance, embedded flash drive designed to replace the
conventional IDE hard disk drive. The ADMs can be plugged into a standard IDE connector commonly
found in desktops, IT-STB, industrial PCs and thin client systems. Apacer’s ADM SSD has a built-in
microcontroller with file management firmware that communicates with the ATA standard interfaces. No
additional or proprietary host software is required.
Well suited for embedded flash storage applications by offering new and expanded functionalities as well
as more cost-effective designs, better performance and increased reliability, ADM is designed to work at
either 5 or 3.3 Volts, supports the standard ATA/IDE protocol for up to PIO Mode-4, Multiword DMA
Mode-2 and Ultra DMA Mode-4 interfaces, and uses the standard ATA driver complying with all major
operating systems such as Microsoft’s Windows series, Apple’s Mac OS family, and Unix variants.
Featuring technologies as Intelligent Power Failure Recovery, ATA Secure Erase, S.M.A.R.T., Advanced
wear-leveling algorithms, Secure Protection Zone, and Enhanced Data Integrity, Apacer’s ADM assures
users of a versatile device on data storage.
1.1 Performance-Optimized Controller
The kernel of an ATA-Disk Module is the ATA controller, which translates standard ATA signals into the
data and controls of the flash media. This proprietary ATA controller is specifically designed to attain high
data throughput from the host to the flash.
1.1.1 Power Management Unit (PMU)
The power management unit (PMU) controls the power consumption of the ATA-Disk Module. It reduces
the power consumption of the ATA-Disk Module Controller by putting circuitry not in operation into sleep
mode. The PMU has zero wake-up latency.
1.1.2 SRAM Buffer
The ATA-Disk Module Controller performs as an SRAM buffer to optimize the host’s data transfer to and
from the flash media.
4
©2011 Apacer Technology Inc.
Rev. 1.1
Value Added
ATA-Disk ModuleⅢ
Ⅲ
AP-FMxxxxE2XXXS-MPXXXJ
2. Functional Block
The ATA-Disk Module (ADM) includes the ATA controller and flash media, as well as the ATA standard
interface. Figure 2-1 shows the functional block diagram.
Flash Array
Flash
Media
HOST
ATA/IDE Bus
ATA
Controller
Flash
Media
Flash
Media
Flash
Media
Figure 2-1:
Functional block diagram
5
©2011 Apacer Technology Inc.
Rev. 1.1
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