EMC
Components
RF Chokes
B82498-B
Data Book Supplement
RF Chokes
SIMID 08-B Series
Preliminary data
SIMID 08 (Siemens Miniature Inductors)
Rated inductance 2,2 to 560 nH
Rated current 0,1 to 0,6 A
Construction
q
q
q
q
q
B82498-B
Size as per EIA standard: 0805
Cubic coil with ceramic core
Plastic-sealed winding
Winding ends welded to contact areas
Temperature index of wire enamel: 180
°C
Features
q
q
q
q
Same measuring frequency for
L
and
Q
High
Q
factor
High resonance frequency
Suitable for reflow (IR and vapor phase)
and wave soldering
Applications
q
Antenna amplifiers
q
Mobile phones
q
Video cameras
Terminals
q
Solderable metallized contact areas of Ag/Pd/Pt
Marking
Minimum marking on reel:
Manufacturer, part number, ordering code,
L
value and tolerance of
L
value,
quantity, date of packing
Delivery mode
8-mm blister tape wound on 180-mm
∅
reel
For details on taping, packing and packing units refer to data book EMC Components, page 433.
/home/SMC-Allg/Datenblaetter/KO-dt-eng/DA-B82498-B-10-96-e
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10.96
Siemens Matsushita Components
B82498-B
Preliminary data
Outline drawing
EIA size 0805,
approx. weight 8,5 mg
Metallization
Welding area
1)
Sealing
PCB layout recommendation
/home/SMC-Allg/Datenblaetter/KO-dt-eng/DA-B82498-B-10-96-e
Dimensions (mm)
a
1,0 ... 1,2
b
3,0 ... 3,8
c
0,9 ... 1,3
1) This area (30 % of seating area) should not be used to assess solderability.
Siemens Matsushita Components
10.96
3
B82498-B
Preliminary data
Characteristics and ordering codes
For further technical data see page 5.
Ordering code
2)
B82498-B3229-M
B82498-B3479-M
B82498-B3689-+
B82498-B3829-M
B82498-B3100-+
B82498-B3120-+
B82498-B3150-+
B82498-B3180-+
B82498-B3220-+
B82498-B3270-+
B82498-B3330-+
B82498-B3390-+
B82498-B3470-+
B82498-B3560-+
B82498-B3680-+
B82498-B3820-+
B82498-B3101-+
B82498-B3121-+
B82498-B3151-+
B82498-B3181-+
B82498-B3221-+
B82498-B3271-+
B82498-B3331-+
B82498-B3391-+
B82498-B3471-+
B82498-B3561-+
/home/SMC-Allg/Datenblaetter/KO-dt-eng/DA-B82498-B-10-96-e
L
R
nH
2,2
4,7
6,8
8,2
10
12
15
18
22
27
33
39
47
56
68
82
100
120
150
180
220
270
330
390
470
560
Toler-
ance
1)
±
10 %
=K
ˆ
±
20%
=M
ˆ
±
5%
=J
ˆ
±
10%
=K
ˆ
±
20%
=M
ˆ
Q
min
25
30
30
35
40
40
40
45
45
50
50
50
45
45
45
40
40
40
35
35
35
35
35
35
35
35
f
L
; f
Q
MHz
250
250
250
250
250
250
250
250
250
250
250
250
200
200
200
150
150
150
100
100
100
100
100
100
100
100
I
R
mA
600
600
600
600
600
600
600
600
500
500
500
500
500
500
500
400
400
350
340
310
270
230
230
170
150
100
R
max
Ω
0,05
0,06
0,06
0,07
0,07
0,07
0,08
0,09
0,10
0,11
0,12
0,13
0,15
0,17
0,20
0,25
0,30
0,40
0,42
0,52
0,66
0,95
0,90
1,7
2,1
2,8
f
res, min
MHz
6000
6000
5500
5000
4500
4100
3700
3300
2700
2600
2200
2200
2100
1800
1700
1600
1350
1300
1250
1150
1100
900
900
800
750
650
1) Closer tolerances upon request.
2) Replace the + by the code letter for the required inductance tolerance.
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10.96
Siemens Matsushita Components
B82498-B
Preliminary data
General technical data
Rated inductance
L
R
Measured at frequency
f
L
,
with impedance analyzer HP 4286 A
Measurement recorded with HP 16193 A
Measured at frequeny
f
Q
,
with impedance analyzer HP 4286 A
Measurement recorded with HP 16193 A
Maximum permissible dc with
an inductance decrease of
∆
L/L
0
≤
10 %
and/or a temperature increase of
≤
20 K
referred to 85
°C
ambient temperature
Measured with network analyzer HP 8753
Measured at 20
°C
ambient temperature,
measuring current
<
I
R
In accordance with IEC 68-1
55/125/56 (– 55
°C/+
125
°C/56
days damp heat test)
Wave and reflow soldering (IR and vapor phase)
temperature and time curves in accordance with
CECC 00 802
Wetting of soldering area:
≥
90 %
|∆
L/L
|
≤
5 %
|∆
Q/Q
|≤ 20 %
2 mm (100 mm long standard PCB)
Q
factor
Q
min
Rated current
I
R
Self-resonance frequency
f
res, min
DC resistance
R
max
or
R
typ
Climatic category
Permissible soldering procedures
Solderability
Resistance to soldering heat
Permissible PCB bending
/home/SMC-Allg/Datenblaetter/KO-dt-eng/DA-B82498-B-10-96-e
Siemens Matsushita Components
10.96
5
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