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TC538200P

Description
IC 1M X 8 MASK PROM, 200 ns, PDIP42, 0.600 INCH, PLASTIC, DIP-42, Programmable ROM
Categorystorage    storage   
File Size201KB,7 Pages
ManufacturerToshiba Semiconductor
Websitehttp://toshiba-semicon-storage.com/
Download Datasheet Parametric Compare View All

TC538200P Overview

IC 1M X 8 MASK PROM, 200 ns, PDIP42, 0.600 INCH, PLASTIC, DIP-42, Programmable ROM

TC538200P Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerToshiba Semiconductor
Parts packaging codeDIP
package instruction0.600 INCH, PLASTIC, DIP-42
Contacts42
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum access time200 ns
Spare memory width16
JESD-30 codeR-PDIP-T42
JESD-609 codee0
length53.2 mm
memory density8388608 bit
Memory IC TypeMASK ROM
memory width8
Number of functions1
Number of terminals42
word count1048576 words
character code1000000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize1MX8
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP42,.6
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)240
power supply5 V
Certification statusNot Qualified
Maximum seat height4.8 mm
Maximum standby current0.0001 A
Maximum slew rate0.06 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width15.24 mm

TC538200P Related Products

TC538200P TC538200F TC538200F(TP2) TC538200F(EL) TC538200F(TP1)
Description IC 1M X 8 MASK PROM, 200 ns, PDIP42, 0.600 INCH, PLASTIC, DIP-42, Programmable ROM IC 1M X 8 MASK PROM, 200 ns, PDSO44, 0.600 INCH, PLASTIC, SOP-44, Programmable ROM IC 1M X 8 MASK PROM, 200 ns, PDSO44, 0.600 INCH, PLASTIC, SOP-44, Programmable ROM IC 1M X 8 MASK PROM, 200 ns, PDSO44, 0.600 INCH, PLASTIC, SOP-44, Programmable ROM IC 1M X 8 MASK PROM, 200 ns, PDSO44, 0.600 INCH, PLASTIC, SOP-44, Programmable ROM
Is it lead-free? Contains lead Contains lead Contains lead Contains lead Contains lead
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible
Maker Toshiba Semiconductor Toshiba Semiconductor Toshiba Semiconductor Toshiba Semiconductor Toshiba Semiconductor
Parts packaging code DIP SOIC SOIC SOIC SOIC
package instruction 0.600 INCH, PLASTIC, DIP-42 0.600 INCH, PLASTIC, SOP-44 0.600 INCH, PLASTIC, SOP-44 0.600 INCH, PLASTIC, SOP-44 0.600 INCH, PLASTIC, SOP-44
Contacts 42 44 44 44 44
Reach Compliance Code unknown unknown unknown unknown unknown
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99
Maximum access time 200 ns 200 ns 200 ns 200 ns 200 ns
Spare memory width 16 16 16 16 16
JESD-30 code R-PDIP-T42 R-PDSO-G44 R-PDSO-G44 R-PDSO-G44 R-PDSO-G44
JESD-609 code e0 e0 e0 e0 e0
length 53.2 mm 28.2 mm 28.2 mm 28.2 mm 28.2 mm
memory density 8388608 bit 8388608 bit 8388608 bit 8388608 bit 8388608 bit
Memory IC Type MASK ROM MASK ROM MASK ROM MASK ROM MASK ROM
memory width 8 8 8 8 8
Number of functions 1 1 1 1 1
Number of terminals 42 44 44 44 44
word count 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words
character code 1000000 1000000 1000000 1000000 1000000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C
organize 1MX8 1MX8 1MX8 1MX8 1MX8
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP SOP SOP SOP SOP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 240 240 240 240 240
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 4.8 mm 3.1 mm 3.1 mm 3.1 mm 3.1 mm
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V
surface mount NO YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) TIN LEAD TIN LEAD TIN LEAD
Terminal form THROUGH-HOLE GULL WING GULL WING GULL WING GULL WING
Terminal pitch 2.54 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm
Terminal location DUAL DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 15.24 mm 12.6 mm 12.6 mm 12.6 mm 12.6 mm
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