IC 1M X 8 MASK PROM, 200 ns, PDSO44, 0.600 INCH, PLASTIC, SOP-44, Programmable ROM
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | Toshiba Semiconductor |
| Parts packaging code | SOIC |
| package instruction | 0.600 INCH, PLASTIC, SOP-44 |
| Contacts | 44 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Maximum access time | 200 ns |
| Spare memory width | 16 |
| JESD-30 code | R-PDSO-G44 |
| JESD-609 code | e0 |
| length | 28.2 mm |
| memory density | 8388608 bit |
| Memory IC Type | MASK ROM |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 44 |
| word count | 1048576 words |
| character code | 1000000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 1MX8 |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | SOP |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | 240 |
| Certification status | Not Qualified |
| Maximum seat height | 3.1 mm |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | TIN LEAD |
| Terminal form | GULL WING |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 12.6 mm |
| TC538200F(TP1) | TC538200P | TC538200F | TC538200F(TP2) | TC538200F(EL) | |
|---|---|---|---|---|---|
| Description | IC 1M X 8 MASK PROM, 200 ns, PDSO44, 0.600 INCH, PLASTIC, SOP-44, Programmable ROM | IC 1M X 8 MASK PROM, 200 ns, PDIP42, 0.600 INCH, PLASTIC, DIP-42, Programmable ROM | IC 1M X 8 MASK PROM, 200 ns, PDSO44, 0.600 INCH, PLASTIC, SOP-44, Programmable ROM | IC 1M X 8 MASK PROM, 200 ns, PDSO44, 0.600 INCH, PLASTIC, SOP-44, Programmable ROM | IC 1M X 8 MASK PROM, 200 ns, PDSO44, 0.600 INCH, PLASTIC, SOP-44, Programmable ROM |
| Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | Toshiba Semiconductor | Toshiba Semiconductor | Toshiba Semiconductor | Toshiba Semiconductor | Toshiba Semiconductor |
| Parts packaging code | SOIC | DIP | SOIC | SOIC | SOIC |
| package instruction | 0.600 INCH, PLASTIC, SOP-44 | 0.600 INCH, PLASTIC, DIP-42 | 0.600 INCH, PLASTIC, SOP-44 | 0.600 INCH, PLASTIC, SOP-44 | 0.600 INCH, PLASTIC, SOP-44 |
| Contacts | 44 | 42 | 44 | 44 | 44 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Maximum access time | 200 ns | 200 ns | 200 ns | 200 ns | 200 ns |
| Spare memory width | 16 | 16 | 16 | 16 | 16 |
| JESD-30 code | R-PDSO-G44 | R-PDIP-T42 | R-PDSO-G44 | R-PDSO-G44 | R-PDSO-G44 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 |
| length | 28.2 mm | 53.2 mm | 28.2 mm | 28.2 mm | 28.2 mm |
| memory density | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit |
| Memory IC Type | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM |
| memory width | 8 | 8 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 44 | 42 | 44 | 44 | 44 |
| word count | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words |
| character code | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| organize | 1MX8 | 1MX8 | 1MX8 | 1MX8 | 1MX8 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | SOP | DIP | SOP | SOP | SOP |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Peak Reflow Temperature (Celsius) | 240 | 240 | 240 | 240 | 240 |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 3.1 mm | 4.8 mm | 3.1 mm | 3.1 mm | 3.1 mm |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | NO | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | TIN LEAD | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | TIN LEAD | TIN LEAD |
| Terminal form | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | GULL WING |
| Terminal pitch | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | 12.6 mm | 15.24 mm | 12.6 mm | 12.6 mm | 12.6 mm |
京公网安备 11010802033920号
EEWORLD
