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ZMM55-D2V7_R2_10001

Description
Zener Diode, 2.7V V(Z), 20%, 0.5W, Silicon, Unidirectional, ROHS COMPLIANT, GLASS, LL34, MINIMELF-2
CategoryDiscrete semiconductor    diode   
File Size98KB,6 Pages
ManufacturerPANJIT
Websitehttp://www.panjit.com.tw/
Environmental Compliance

PANJIT is a global IDM that offers a broad product portfolio including MOSFETs, Schottky diodes, SiC devices, bipolar junction transistors and bridges. The company aims to meet the needs of customers in various applications such as automotive, power, industrial, computing, consumer and communications. Their vision is to power the world with reliable quality, energy-efficient and efficient products, bringing a greener and smarter future to people. The company's core values ​​include innovation, responsibility, customer-centricity, learning and growth, mutual trust and collaboration.

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ZMM55-D2V7_R2_10001 Overview

Zener Diode, 2.7V V(Z), 20%, 0.5W, Silicon, Unidirectional, ROHS COMPLIANT, GLASS, LL34, MINIMELF-2

ZMM55-D2V7_R2_10001 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerPANJIT
package instructionROHS COMPLIANT, GLASS, LL34, MINIMELF-2
Reach Compliance Codecompliant
ECCN codeEAR99
Shell connectionISOLATED
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeZENER DIODE
Maximum dynamic impedance85 Ω
JESD-30 codeO-LELF-R2
Number of components1
Number of terminals2
Maximum operating temperature175 °C
Package body materialGLASS
Package shapeROUND
Package formLONG FORM
Peak Reflow Temperature (Celsius)NOT SPECIFIED
polarityUNIDIRECTIONAL
Maximum power dissipation0.5 W
Nominal reference voltage2.7 V
surface mountYES
technologyZENER
Terminal formWRAP AROUND
Terminal locationEND
Maximum time at peak reflow temperatureNOT SPECIFIED
Maximum voltage tolerance20%
Working test current5 mA

ZMM55-D2V7_R2_10001 Preview

Download Datasheet
ZMM55-C2V4 SERIES
SURFACE MOUNT ZENER DIODES
VOLTAGE
2.4 to 75 Volts
POWER
500 mWatts
FEATURES
• Planar Die construction
• 500mW Power Dissipation
• Ideally Suited for Automated Assembly Processes
0.063(1.6)
0.020(0.5)
0.012(0.3)
0.146(3.7)
0.130(3.3)
0.055(1.4)DIA.
• Lead free in comply with EU RoHS 2011/65/EU directives
MECHANICAL DATA
• Case: Molded Glass MINI-MELF
• Terminals: Solderable per MIL-STD-750, Method 2026
• Polarity: See Diagram Below
• Approx. Weight: 0.03 grams
• Mounting Position: Any
• Packing information
T/R - 2.5K per 7" plastic Reel
T/R - 10K per 13" plastic Reel
0.020(0.5)
0.012(0.3)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Parameter
Power Dissipation at T
A
= 25
O
C
Junction Temperature
Storage Temperature Range
Symbol
Value
500
175
-65 to +175
Units
mW
O
P
TOT
T
J
T
S
C
C
O
Parameter
Thermal Resistance Junction to Ambient Air
Forward Voltage at I
F
= 200mA
Symbol
Min.
Typ.
Max.
0.3
1.5
o
Units
C/mW
V
R
JA
V
F
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May 10,2013-REV.07
PAGE . 1
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