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K4G813222B-QC80

Description
Synchronous Graphics RAM, 256KX32, 6.5ns, CMOS, PQFP100, 20 X 14 MM, 0.65 MM PITCH, TQFP-100
Categorystorage    storage   
File Size1MB,49 Pages
ManufacturerSAMSUNG
Websitehttp://www.samsung.com/Products/Semiconductor/
Download Datasheet Parametric Compare View All

K4G813222B-QC80 Overview

Synchronous Graphics RAM, 256KX32, 6.5ns, CMOS, PQFP100, 20 X 14 MM, 0.65 MM PITCH, TQFP-100

K4G813222B-QC80 Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerSAMSUNG
Parts packaging codeQFP
package instructionTQFP, TQFP100,.7X.9,25
Contacts100
Reach Compliance Codecompliant
ECCN codeEAR99
access modeDUAL BANK PAGE BURST
Maximum access time6.5 ns
Other featuresAUTO/SELF REFRESH
Maximum clock frequency (fCLK)125 MHz
I/O typeCOMMON
interleaved burst length4,8
JESD-30 codeR-PQFP-G100
JESD-609 codee0
length20 mm
memory density8388608 bit
Memory IC TypeSYNCHRONOUS GRAPHICS RAM
memory width32
Number of functions1
Number of ports1
Number of terminals100
word count262144 words
character code256000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize256KX32
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeTQFP
Encapsulate equivalent codeTQFP100,.7X.9,25
Package shapeRECTANGULAR
Package formFLATPACK, THIN PROFILE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply3.3 V
Certification statusNot Qualified
refresh cycle1024
Maximum seat height1.2 mm
self refreshYES
Continuous burst length1,2,4,8,FP
Maximum standby current0.002 A
Maximum slew rate0.28 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
width14 mm
K4G813222B
128K x 32Bit x 2 Banks Synchronous Graphic RAM
FEATURES
JEDEC standard 3.3V power supply
LVTTL compatible with multiplexed address
Dual bank / Pulse RAS
MRS cycle with address key programs
-. CAS Latency (2, 3)
-. Burst Length (1, 2, 4, 8 & full page)
-. Burst Type (Sequential & Interleave)
All inputs are sampled at the positive going edge of the
system clock
Burst Read Single-bit Write operation
DQM 0-3 for byte masking
Auto & self refresh
16ms refresh period (1K cycle)
100 Pin PQFP, TQFP (14 x 20 mm)
Reverse Type Package offers the best signal routing
CMOS SGRAM
GENERAL DESCRIPTION
The K4G813222B is 8,388,608 bits synchronous high data
rate Dynamic RAM organized as 2 x 131,072 words by 32 bits,
fabricated with SAMSUNG's high performance CMOS technol-
ogy. Synchronous design allows precise cycle control with the
use of system clock. I/O transactions are possible on every
clock cycle. Range of operating frequencies, programmable
burst length, and programmable latencies allows the same
device to be useful for a variety of high bandwidth, high perfor-
mance memory system applications.
Write per bit and 8 columns block write improves performance in
graphics systems.
ORDERING INFORMATION
Part NO.
K4G813222B-PC70
K4G813222B-PC80
K4G813222B-PC10
K4G813222B-QC70
K4G813222B-QC80
K4G813222B-QC10
* -UC# : Reverse Type PQFP
Max Freq.
143MHz
125MHz
100MHz
143MHz
125MHz
100MHz
Interface
LVTTL
Package
100 PQFP
Graphics Features
• SMRS cycle.
-. Load mask register
-. Load color register
• Write Per Bit(Old Mask)
• Block Write(8 Columns)
LVTTL
100 TQFP
FUNCTIONAL BLOCK DIAGRAM
DQMi
BLOCK
WRITE
CONTROL
LOGIC
CLK
CKE
CS
MASK
WRITE
MASK
REGISTER
COLOR
REGISTER
INPUT BUFFER
CONTROL
LOGIC
MUX
COLUMN
MASK
DQMi
DQi
(i=0~31)
TIMING REGISTER
SENSE
AMPLIFIER
RAS
CAS
WE
DSF
DQMi
128Kx32
CELL
ARRAY
128Kx32
CELL
ARRAY
ROW DECORDER
BANK SELECTION
SERIAL
COUNTER
COLUMN ADDRESS
BUFFER
ROW ADDRESS
BUFFER
REFRESH
COUNTER
ADDRESS REGISTER
CLOCK ADDRESS(A
0
~A
9
)
OUTPUT BUFFER
LATENCY &
BURST LENGTH
PROGRAMING
REGISTER
COLUMN
DECORDER

K4G813222B-QC80 Related Products

K4G813222B-QC80 K4G813222B-QC10 K4G813222B-PC80 K4G813222B-QC70 K4G813222B-PC70 K4G813222B-UC80 K4G813222B-PC10 K4G813222B-UC70 K4G813222B-UC10
Description Synchronous Graphics RAM, 256KX32, 6.5ns, CMOS, PQFP100, 20 X 14 MM, 0.65 MM PITCH, TQFP-100 Synchronous Graphics RAM, 256KX32, 7ns, CMOS, PQFP100, 20 X 14 MM, 0.65 MM PITCH, TQFP-100 Synchronous Graphics RAM, 256KX32, 6.5ns, CMOS, PQFP100, 20 X 14 MM, 0.65 MM PITCH, PLASTIC, QFP-100 Synchronous Graphics RAM, 256KX32, 6ns, CMOS, PQFP100, 20 X 14 MM, 0.65 MM PITCH, TQFP-100 Synchronous Graphics RAM, 256KX32, 6ns, CMOS, PQFP100, 20 X 14 MM, 0.65 MM PITCH, PLASTIC, QFP-100 Synchronous Graphics RAM, 256KX32, 6.5ns, CMOS, PQFP100, 20 X 14 MM, 0.65 MM PITCH, PLASTIC, REVERSE, QFP-100 Synchronous Graphics RAM, 256KX32, 7ns, CMOS, PQFP100, 20 X 14 MM, 0.65 MM PITCH, PLASTIC, QFP-100 Synchronous Graphics RAM, 256KX32, 6ns, CMOS, PQFP100, 20 X 14 MM, 0.65 MM PITCH, PLASTIC, REVERSE, QFP-100 Synchronous Graphics RAM, 256KX32, 7ns, CMOS, PQFP100, 20 X 14 MM, 0.65 MM PITCH, PLASTIC, REVERSE, QFP-100
Parts packaging code QFP QFP QFP QFP QFP QFP QFP QFP QFP
package instruction TQFP, TQFP100,.7X.9,25 TQFP, TQFP100,.7X.9,25 QFP, QFP100,.7X.9 TQFP, TQFP100,.7X.9,25 QFP, QFP100,.7X.9 QFP, QFP, QFP100,.7X.9 QFP, QFP,
Contacts 100 100 100 100 100 100 100 100 100
Reach Compliance Code compliant compliant compliant compliant compliant unknown compliant unknown unknown
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
access mode DUAL BANK PAGE BURST DUAL BANK PAGE BURST DUAL BANK PAGE BURST DUAL BANK PAGE BURST DUAL BANK PAGE BURST DUAL BANK PAGE BURST DUAL BANK PAGE BURST DUAL BANK PAGE BURST DUAL BANK PAGE BURST
Maximum access time 6.5 ns 7 ns 6.5 ns 6 ns 6 ns 6.5 ns 7 ns 6 ns 7 ns
Other features AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH
JESD-30 code R-PQFP-G100 R-PQFP-G100 R-PQFP-G100 R-PQFP-G100 R-PQFP-G100 R-PQFP-G100 R-PQFP-G100 R-PQFP-G100 R-PQFP-G100
length 20 mm 20 mm 20 mm 20 mm 20 mm 20 mm 20 mm 20 mm 20 mm
memory density 8388608 bit 8388608 bit 8388608 bit 8388608 bit 8388608 bit 8388608 bit 8388608 bit 8388608 bit 8388608 bit
Memory IC Type SYNCHRONOUS GRAPHICS RAM SYNCHRONOUS GRAPHICS RAM SYNCHRONOUS GRAPHICS RAM SYNCHRONOUS GRAPHICS RAM SYNCHRONOUS GRAPHICS RAM SYNCHRONOUS GRAPHICS RAM SYNCHRONOUS GRAPHICS RAM SYNCHRONOUS GRAPHICS RAM SYNCHRONOUS GRAPHICS RAM
memory width 32 32 32 32 32 32 32 32 32
Number of functions 1 1 1 1 1 1 1 1 1
Number of ports 1 1 1 1 1 1 1 1 1
Number of terminals 100 100 100 100 100 100 100 100 100
word count 262144 words 262144 words 262144 words 262144 words 262144 words 262144 words 262144 words 262144 words 262144 words
character code 256000 256000 256000 256000 256000 256000 256000 256000 256000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
organize 256KX32 256KX32 256KX32 256KX32 256KX32 256KX32 256KX32 256KX32 256KX32
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TQFP TQFP QFP TQFP QFP QFP QFP QFP QFP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form FLATPACK, THIN PROFILE FLATPACK, THIN PROFILE FLATPACK FLATPACK, THIN PROFILE FLATPACK FLATPACK FLATPACK FLATPACK FLATPACK
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.2 mm 1.2 mm 3 mm 1.2 mm 3 mm 3 mm 3 mm 3 mm 3 mm
self refresh YES YES YES YES YES YES YES YES YES
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 3 V 3 V 3 V 3 V 3 V 3 V 3 V 3 V 3 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
surface mount YES YES YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal form GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
Terminal pitch 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm
Terminal location QUAD QUAD QUAD QUAD QUAD QUAD QUAD QUAD QUAD
width 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible - incompatible - -
Maker SAMSUNG SAMSUNG - SAMSUNG SAMSUNG SAMSUNG SAMSUNG SAMSUNG SAMSUNG
Maximum clock frequency (fCLK) 125 MHz 100 MHz 125 MHz 143 MHz 143 MHz - 100 MHz - -
I/O type COMMON COMMON COMMON COMMON COMMON - COMMON - -
interleaved burst length 4,8 4,8 4,8 4,8 4,8 - 4,8 - -
JESD-609 code e0 e0 - e0 e0 - e0 - -
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE - 3-STATE - -
Encapsulate equivalent code TQFP100,.7X.9,25 TQFP100,.7X.9,25 QFP100,.7X.9 TQFP100,.7X.9,25 QFP100,.7X.9 - QFP100,.7X.9 - -
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED 225 NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED - -
power supply 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V - 3.3 V - -
refresh cycle 1024 1024 1024 1024 1024 - 1024 - -
Continuous burst length 1,2,4,8,FP 1,2,4,8,FP 1,2,4,8,FP 1,2,4,8,FP 1,2,4,8,FP - 1,2,4,8,FP - -
Maximum standby current 0.002 A 0.002 A 0.002 A 0.002 A 0.002 A - 0.002 A - -
Maximum slew rate 0.28 mA 0.21 mA 0.28 mA 0.3 mA 0.3 mA - 0.21 mA - -
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb) - -
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED - -
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