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AT28C64E-25FI

Description
EEPROM, 8KX8, 250ns, Parallel, CMOS, CDFP28, FP-28
Categorystorage    storage   
File Size804KB,12 Pages
ManufacturerAtmel (Microchip)
Download Datasheet Parametric Compare View All

AT28C64E-25FI Overview

EEPROM, 8KX8, 250ns, Parallel, CMOS, CDFP28, FP-28

AT28C64E-25FI Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerAtmel (Microchip)
package instructionDFP, FL28,.4
Reach Compliance Codecompliant
Maximum access time250 ns
command user interfaceNO
Data pollingYES
JESD-30 codeR-CDFP-F28
JESD-609 codee0
memory density65536 bit
Memory IC TypeEEPROM
memory width8
Number of functions1
Number of terminals28
word count8192 words
character code8000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize8KX8
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeDFP
Encapsulate equivalent codeFL28,.4
Package shapeRECTANGULAR
Package formFLATPACK
Parallel/SerialPARALLEL
power supply5 V
Programming voltage5 V
Certification statusNot Qualified
ready/busyYES
Maximum standby current0.003 A
Maximum slew rate0.045 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formFLAT
Terminal pitch1.27 mm
Terminal locationDUAL
switch bitNO
Maximum write cycle time (tWC)0.2 ms

AT28C64E-25FI Related Products

AT28C64E-25FI AT28C64-25FI AT28C64-25LI AT28C64X-25LI AT28C64E-25LI AT28C64F-25FI AT28C64F-25LI
Description EEPROM, 8KX8, 250ns, Parallel, CMOS, CDFP28, FP-28 EEPROM, 8KX8, 250ns, Parallel, CMOS, CDFP28, FP-28 EEPROM, 8KX8, 250ns, Parallel, CMOS, CQCC32, LCC-32 EEPROM, 8KX8, 250ns, Parallel, CMOS, CQCC32 EEPROM, 8KX8, 250ns, Parallel, CMOS, CQCC32, LCC-32 EEPROM, 8KX8, 250ns, Parallel, CMOS, CDFP28, FP-28 EEPROM, 8KX8, 250ns, Parallel, CMOS, CQCC32, LCC-32
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible
package instruction DFP, FL28,.4 DFP, FL28,.4 QCCN, LCC32,.45X.55 QCCN, LCC32,.45X.55 QCCN, LCC32,.45X.55 DFP, FL28,.4 QCCN, LCC32,.45X.55
Reach Compliance Code compliant compliant compliant compliant compliant compliant compliant
Maximum access time 250 ns 250 ns 250 ns 250 ns 250 ns 250 ns 250 ns
command user interface NO NO NO NO NO NO NO
Data polling YES YES YES YES YES YES YES
JESD-30 code R-CDFP-F28 R-CDFP-F28 R-CQCC-N32 R-XQCC-N32 R-CQCC-N32 R-CDFP-F28 R-CQCC-N32
JESD-609 code e0 e0 e0 e0 e0 e0 e0
memory density 65536 bit 65536 bit 65536 bit 65536 bit 65536 bit 65536 bit 65536 bit
Memory IC Type EEPROM EEPROM EEPROM EEPROM EEPROM EEPROM EEPROM
memory width 8 8 8 8 8 8 8
Number of terminals 28 28 32 32 32 28 32
word count 8192 words 8192 words 8192 words 8192 words 8192 words 8192 words 8192 words
character code 8000 8000 8000 8000 8000 8000 8000
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
organize 8KX8 8KX8 8KX8 8KX8 8KX8 8KX8 8KX8
Package body material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
encapsulated code DFP DFP QCCN QCCN QCCN DFP QCCN
Encapsulate equivalent code FL28,.4 FL28,.4 LCC32,.45X.55 LCC32,.45X.55 LCC32,.45X.55 FL28,.4 LCC32,.45X.55
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form FLATPACK FLATPACK CHIP CARRIER CHIP CARRIER CHIP CARRIER FLATPACK CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
power supply 5 V 5 V 5 V 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum standby current 0.003 A 0.003 A 0.003 A 0.003 A 0.003 A 0.003 A 0.003 A
Maximum slew rate 0.045 mA 0.045 mA 0.045 mA 0.045 mA 0.045 mA 0.045 mA 0.045 mA
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form FLAT FLAT NO LEAD NO LEAD NO LEAD FLAT NO LEAD
Terminal pitch 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm
Terminal location DUAL DUAL QUAD QUAD QUAD DUAL QUAD
switch bit NO NO NO NO NO NO NO
Maker Atmel (Microchip) - - Atmel (Microchip) Atmel (Microchip) Atmel (Microchip) Atmel (Microchip)
Number of functions 1 1 1 - 1 1 1
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS - ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Programming voltage 5 V 5 V 5 V - 5 V 5 V 5 V
ready/busy YES YES YES - YES YES YES
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V - 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V - 4.5 V 4.5 V 4.5 V
Maximum write cycle time (tWC) 0.2 ms 1 ms 1 ms - 0.2 ms 0.2 ms 0.2 ms
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